BYG20D - BYG20J
Taiwan Semiconductor
CREAT BY ART
1.5A, 200V - 600V High Efficient Surface Mount Rectifiers
FEATURES
- Glass passivated junction chip
- Ideal for automated placement
- Fast switching for high efficiency
- High surge current capability
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21
DO-214AC (SMA)
MECHANICAL DATA
Case:
DO-214AC (SMA)
Molding compound: UL flammability classification rating 94V-0
Part No. with suffix "H" means AEC-Q101 qualified
Packing code with suffix "G" means green compound (halogen-free)
Moisture sensitivity level: level 1, per J-STD-020
Terminal:
Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
Polarity:
Indicated by cathode band
Weight:
0.064 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(T
A
=25°C unless otherwise noted)
PARAMETER
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
Maximum instantaneous forward voltage
(Note 1)
Maximum reverse current @ rated V
R
Pulse energy in avalanche mode, non repetitive
(Inductive load switch off ), L=120mH
Maximum reverse recovery time (Note 2)
Typical thermal resistance (Note 3)
Operating junction temperature range
Storage temperature range
Note 1: Pulse test with PW=300μs, 1% duty cycle
Note 2: Reverse recovery test conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Note 3: Mount on PC board with 5mm x 5mm copper pads as heatsink.
I
F
=1.0A
I
F
=1.5A
T
J
=25°C
T
J
=100°C
SYMBOL
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
I
R
E
RSM
t
rr
R
θJL
R
θJA
T
J
T
STG
BYG20D
200
140
200
BYG20G
400
280
400
1.5
30
1.3
1.4
1
10
20
75
25
100
- 55 to +150
- 55 to +150
BYG20J
600
420
600
UNIT
V
V
V
A
A
V
μA
mJ
ns
°C/W
°C
°C
Document Number: DS_D0000075
Version: E15
BYG20D - BYG20J
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
PART NO.
SUFFIX
PACKING
CODE
R3
R2
BYG20x
(Note 1)
H
M2
F3
F2
F4
Note 1: "x" defines voltage from 200V (BYG20D) to 600V (BYG20J)
G
PACKING CODE
SUFFIX
PACKAGE
SMA
SMA
SMA
Folded SMA
Folded SMA
Folded SMA
PACKING
1,800 / 7" Plastic reel
7,500 / 13" Paper reel
7,500 / 13" Plastic reel
1,800 / 7" Plastic reel
7,500 / 13" Paper reel
7,500 / 13" Plastic reel
EXAMPLE
EXAMPLE
PART NO.
BYG20DHR3G
PART NO.
BYG20D
PART NO.
SUFFIX
H
PACKING
CODE
R3
PACKING CODE
SUFFIX
G
DESCRIPTION
AEC-Q101 qualified
Green compound
RATINGS AND CHARACTERISTICS CURVES
(T
A
=25°C unless otherwise noted)
FIG.1 FORWARD CURRENT DERATING CURVE
2
AVERAGE FORWARD CURRENT (A)
100
INSTANTANEOUS REVERSE CURRENT (μA)
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
10
1.5
1
T
J
=125°C
0.1
1
0.5
Resistive or
inductive load
0.01
T
J
=25°C
0
0
20
40
60
80
100
120
140
160
0.001
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
LEAD TEMPERATURE (
°
C)
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
INSTANTANEOUS FORWARD CURRENT (A)
70
10
FIG. 4 TYPICAL FORWARD CHARACTERISTICS
PEAK FORWARD SURGE URRENT (A)
60
8.3ms single half sine wave
50
40
30
20
10
0
1
10
100
1
0.1
0.4
0.6
0.8
1
1.2
1.4
1.6
NUMBER OF CYCLES AT 60 Hz
FORWARD VOLTAGE (V)
Document Number: DS_D0000075
Version: E15
BYG20D - BYG20J
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D0000075
Version: E15
GD32 MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
