Hot Swap Voltage Controllers Positive Hot-Swap Controller
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 可调阈值 | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 4.9 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 最大供电电压 (Vsup) | 80 V |
| 最小供电电压 (Vsup) | 33 V |
| 标称供电电压 (Vsup) | 48 V |
| 表面贴装 | YES |
| 技术 | BICMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3.9 mm |
| MAX5933BESA+ | MAX5933DESA-T | MAX5933BESA-T | MAX5933EESA- | MAX5933EESA+T | MAX5947CESA+ | MAX5947AESA+T | MAX5933FESA | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Hot Swap Voltage Controllers Positive Hot-Swap Controller | Hot Swap Voltage Controllers Positive Hot-Swap Controller | Hot Swap Voltage Controllers Positive Hot-Swap Controller | Hot Swap Voltage Controllers Positive Hot-Swap Controller | Hot Swap Voltage Controllers Positive Hot-Swap Controller | Hot Swap Voltage Controllers Positive Hot-Swap Controller | Hot Swap Voltage Controllers Positive Hot-Swap Controller | Hot Swap Voltage Controllers |
| 是否无铅 | 不含铅 | 含铅 | 含铅 | - | 不含铅 | 不含铅 | 不含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 不符合 | 不符合 | - | 符合 | 符合 | 符合 | 不符合 |
| 零件包装代码 | SOIC | SOIC | SOIC | - | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | SOP, | SOP, | SOP, | - | SOP, | SOP, | SOP, | 0.150 INCH, MS012AA, SOIC-8 |
| 针数 | 8 | 8 | 8 | - | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | - | compliant | compliant | compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 |
| 可调阈值 | YES | YES | YES | - | YES | YES | YES | YES |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | - | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e3 | e0 | e0 | - | e3 | e3 | e3 | e0 |
| 长度 | 4.9 mm | 4.9 mm | 4.9 mm | - | 4.9 mm | 4.9 mm | 4.9 mm | 4.9 mm |
| 湿度敏感等级 | 1 | 1 | - | - | - | 1 | 1 | 1 |
| 信道数量 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | - | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | SOP | SOP | - | SOP | SOP | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | - | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 240 | 245 | - | 260 | 260 | 260 | 245 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 1.75 mm | 1.75 mm | - | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 80 V | 80 V | 80 V | - | 80 V | 80 V | 80 V | 80 V |
| 最小供电电压 (Vsup) | 33 V | 33 V | 33 V | - | 33 V | 9 V | 9 V | 33 V |
| 标称供电电压 (Vsup) | 48 V | 48 V | 48 V | - | 48 V | 24 V | 24 V | 48 V |
| 表面贴装 | YES | YES | YES | - | YES | YES | YES | YES |
| 技术 | BICMOS | BICMOS | BICMOS | - | BICMOS | BICMOS | BICMOS | BICMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | MATTE TIN | TIN LEAD | TIN LEAD | - | MATTE TIN | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | GULL WING | GULL WING | - | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3.9 mm | 3.9 mm | 3.9 mm | - | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm |
模拟电子
NXP MCU
嵌入式系统
传感器
模拟与混合信号
WindowsCE
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