100V, 2A Peak, High Frequency Half-Bridge Drivers with
Rising Edge Delay Timer
HIP2122, HIP2123
The HIP2122 and HIP2123 are 100V, high frequency, half-bridge
MOSFET driver ICs. They are based on the popular ISL2100A and
ISL2101A half-bridge drivers. Like the ISL2100A, two logic
inputs, LI and HI, control both bridge outputs, LO and HO. All logic
inputs are V
DD
tolerant.
These drivers have a programmable dead-time to insure
break-before-make operation between the high-side and low-side
drivers. The dead-time is adjustable up to 220ns. The internal
logic does not prevent both outputs from turning on
simultaneously if both inputs are high simultaneously for a time
greater than the programmed delay.
A single PWM logic input controls both bridge outputs (HO, LO).
An enable pin (EN), when low, drives both outputs to a low state.
All logic inputs are V
DD
tolerant and the HIP2122 has CMOS
inputs with hysteresis for superior operation in noisy
environments.
The HIP2122 has hysteretic inputs with thresholds that are
proportional to V
DD
. The HIP2123 has 3.3V logic/TTL compatible
inputs.
Two package options are provided. The 10 lead 4x4 DFN package
has standard pinouts. The 9 lead 4x4 DFN package omits pin 2 to
comply with 100V conductor spacing per IPC-2221.
Features
• 9 Ld TDFN “B” Package Compliant with 100V Conductor
Spacing Guidelines per IPC-2221
• Break-Before-Make Dead-Time Prevents Shoot-through and is
adjustable up to 220ns
• Bootstrap Supply Max Voltage to 114VDC
• Wide Supply Voltage Range (8V to 14V)
• Supply Undervoltage Protection
• CMOS Compatible Input Thresholds with Hysteresis (HIP2122)
• 1.6Ω/1Ω Typical Output Pull-up/Pull-down Resistance
• On-Chip 1Ω Bootstrap Diode
Applications
• Telecom Half-Bridge DC/DC Converters
• UPS and Inverters
• Motor Drives
• Class-D Amplifiers
• Forward Converter with Active Clamp
Related Literature
•
FN7668,
HIP2120, HIP2121 “100V, 2A Peak, High Frequency
Half-Bridge Drivers with Adjustable Dead Time Control and
PWM Input”
HALF
BRIDGE
100V MAX
HIP2122, HIP2123
VDD
HI
HB
HO
HS
RDT
VSS
EPAD
LO
FEEDBACK
WITH
ISOLATION
SECONDARY
CIRCUITS
DEADTIME (ns)
200
160
140
120
100
80
60
40
PWM
CONTROLLER
LI
20
8
16
24
32
RDT (kΩ)
40 48 56 64 80
FIGURE 1. TYPICAL APPLICATION
FIGURE 2. DEAD-TIME vs TIMING RESISTOR
December 23, 2011
FN7670.0
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774
|
Copyright Intersil Americas Inc. 2011. All Rights Reserved
Intersil (and design) is a trademark owned by Intersil Corporation or one of its subsidiaries.
All other trademarks mentioned are the property of their respective owners.
HIP2122, HIP2123
Block Diagram
VDD
HB
HIP2122,
HIP2123
HIP2122
HO
HIP2122/23
UNDER
VOLTAGE
LEVEL
SHIFT
HO
HS
DELAY
RDT
OPTIONAL INVERSION
FOR FUTURE PART
NUMBERS
DELAY
HIP2122
HIP2122/23
EPAD
EPAD IS
ELECTRICALLY
ISOLATED
UNDER
VOLTAGE
LO
LO
VSS
Pin Configurations
HIP2122, HIP2123
(10 LD 4X4 TDFN)
TOP VIEW
VDD
HB
HO
HS
NC
1
2
3
4
5
EPAD
10 LO
9
8
7
6
VSS
LI
HI
RDT
HB
HO
HS
3
4
5
EPAD
VDD
1
HIP2122, HIP2123
(9 LD 4X4 TDFN)
TOP VIEW
10 LO
9
8
7
6
VSS
LI
HI
RDT
2
FN7670.0
December 23, 2011
HIP2122, HIP2123
Pin Descriptions
9 LD TDFN 10 LD TDFN SYMBOL
1
3
4
5
8
7
9
10
-
6
-
1
2
3
4
8
7
9
10
5
6
-
VDD
HB
HO
HS
LI
HI
VSS
LO
NC
RDT
EPAD
DESCRIPTION
Positive supply voltage for lower gate driver. Decouple this pin with a ceramic capacitor to VSS.
High-side bootstrap supply voltage referenced to HS. Connect the positive side of bootstrap capacitor to this pin.
Bootstrap diode is on-chip.
High-side output. Connect to gate of high-side power MOSFET.
High-side source connection. Connect to source of high-side power MOSFET. Connect the negative side of
bootstrap capacitor to this pin.
Low side driver input. For LI = 1, LO = 1 after programmed delay time; for LI = 0, LO = 0 with minimal delay.
High side driver input. For HI = 1, HO = 1 after programmed delay time; for Hi = 0, HO = 0 with minimal delay.
Negative supply input, which will generally be ground.
Low-side output. Connect to gate of low-side power MOSFET.
No Connect. This pin is isolated from all other pins.
A resistor connected between this pin and VSS adds additional delay time to the normal rising edge propagation
delay.
Exposed pad. Connect to ground or float. The EPAD is electrically isolated from all other pins.
Ordering Information
PART NUMBER
(Notes 1, 2, 4)
HIP2122FRTAZ
HIP2123FRTAZ
HIP2122FRTBZ (Note 3)
HIP2123FRTBZ (Note 3)
NOTES:
1. Add “-T*” suffix for tape and reel. Please refer to
TB347
for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
PbHfree products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. “B” package option has alternate pin assignments for compliance with 100V Conductor Spacing Guidelines per IPC-2221. Note that Pin 2 is omitted
for additional spacing.
4. For Moisture Sensitivity Level (MSL), please see device information page for
HIP2122, HIP2123.
For more information on MSL please see tech brief
TB363.
PART
MARKING
HIP 2122AZ
HIP 2123AZ
HIP 2122BZ
HIP 2123BZ
INPUT
CMOS
3.3V/TTL
CMOS
3.3V/TTL
TEMP. RANGE
(°C)
- 40 to +125
- 40 to +125
- 40 to +125
- 40 to +125
PACKAGE
(Pb-Free)
10 Ld 4x4 TDFN
10 Ld 4x4 TDFN
9 Ld 4x4 TDFN
9 Ld 4x4 TDFN
PKG.
DWG. #
L10.4x4
L10.4x4
L9.4x4
L9.4x4
3
FN7670.0
December 23, 2011
HIP2122, HIP2123
Table of Contents
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Thermal Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Maximum Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
ESD Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Switching Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Typical Performance Curves. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Functional Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Selecting the Boot Capacitor Value . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Typical Application Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Transients on HS Node . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
PC Board Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
EPAD Design Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Products . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Package Outline Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Package Outline Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4
FN7670.0
December 23, 2011
HIP2122, HIP2123
Absolute Maximum Ratings
Supply Voltage, V
DD
, V
HB
- V
HS
(Notes 5, 6) . . . . . . . . . . . . . . . -0.3V to 18V
LI and HI Input Voltage (Note 6) . . . . . . . . . . . . . . . . . . .-0.3V to VDD + 0.3V
Voltage on LO (Note 6) . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to VDD + 0.3V
Voltage on HO (Note 6) . . . . . . . . . . . . . . . . . . . . . VHS - 0.3V to VHB + 0.3V
Voltage on HS (Continuous) (Note 6) . . . . . . . . . . . . . . . . . . . . . -1V to 110V
Voltage on HB (Note 6). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118V
Average Current in V
DD
to HB Diode . . . . . . . . . . . . . . . . . . . . . . . . . 100mA
Thermal Information
Thermal Resistance (Typical)
θ
JA
(°C/W)
θ
JC
(°C/W)
10 Ld TDFN (Notes 7, 8) . . . . . . . . . . . . . . .
42
4
9 Ld TDFN (Notes 7, 8) . . . . . . . . . . . . . . . .
42
4
Max Power Dissipation at +25°C in Free Air
10 Ld TDFN (Notes 7, 8) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.0W
9 Ld TDFN (Notes 7, 8). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1W
Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Junction Temperature Range . . . . . . . . . . . . . . . . . . . . . . .-55°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Maximum Recommended Operating
Conditions
Supply Voltage, V
DD
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8V to 14V
Voltage on HS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -1V to 100V
Voltage on HS . . . . . . . . . . . . . . . . . . . . . .(Repetitive Transient) -5V to 105V
Voltage on HB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
HS
+ 8V to V
HS
+ 14V and
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DD
- 1V to V
DD
+ 100V
HS Slew Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . <50V/ns
ESD Ratings
Human Body Model Class 2 (Tested per JESD22-A114E). . . . . . . . . . 3000V
Machine Model Class B (Tested per JESD22-A115-A). . . . . . . . . . . . . . 300V
Charged Device Model Class IV. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2000V
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
5. The HIP2122 and HIP2123 are capable of derated operation at supply voltages exceeding 14V. Figure 20 shows the high-side voltage derating curve
for this mode of operation.
6. All voltages referenced to V
SS
unless otherwise specified.
7.
θ
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief
TB379.
8. For
θ
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications
V
DD
= V
HB
= 12V, V
SS
= V
HS
= 0V, R
DT
= 0
K
, PWM= 0V, No Load on LO or HO, Unless Otherwise Specified.
Boldface limits apply over the operating temperature range, -40°C to +125°C.
T
A
= +25°C
PARAMETERS
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
T
A
= -40°C to +125°C
MIN (Note 9) MAX (Note 9)
UNITS
SUPPLY CURRENTS
V
DD
Quiescent Current
I
DD80
I
DD8k
V
DD
Operating Current
I
DDO80k
I
DDO8k
Total HB Quiescent Current
Total HB Operating Current
HB to V
SS
Current, Quiescent
HB to V
SS
Current, Operating
I
HB
I
HBO
I
HBS
I
HBSO
R
DT
= 80k
R
DT
= 8k
f = 500kHz, R
DT
= 80k
f = 500kHz, R
DT
= 8k
LI = HI = 0V
f = 500kHz
LI = HI = 0V; V
HB
= V
HS
= 114V
f = 500kHz; V
HB
= V
HS
= 114V
-
-
-
-
-
-
-
-
470
1.0
2.5
3.4
65
2.0
0.05
1.2
850
2.1
3
4
115
2.5
1.5
1.5
-
-
-
-
-
-
-
-
900
2.2
3
4
150
3
10
1.6
µA
mA
mA
mA
µA
mA
µA
mA
INPUT PINS
Low Level Input Voltage
Threshold
Low Level Input Voltage
Threshold
High Level Input Voltage
Threshold
High Level Input Voltage
Threshold
V
IL
V
IL
V
IH
V
IH
HIP2122 (CMOS)
HIP2123 (3.3V/TTL)
HIP2122 (CMOS)
HIP2123 ((3.3V/TTL)
3.7
1.4
-
-
4.4
1.8
6.54
1.8
-
-
7.93
2.2
2.7
1.2
5.3
-
-
-
8.2
2.4
V
V
V
V
5
FN7670.0
December 23, 2011
DSP 与 ARM 处理器
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