ARS50A thru ARS50M
Taiwan Semiconductor
CREAT BY ART
FEATURES
- Diffused junction
- Low leakage
- High surge capability
- Low cost construction utilizing void-free molded plastic technique
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
High Current Button Rectifiers
MECHANICAL DATA
Case:
ARS
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - green compound (halogen-free)
Terminal:
Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
Weight:
1.68 g (approximately)
ARS
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
(T
A
=25
o
C unless otherwise noted)
de
ARS
50B
100
70
100
ARS
50D
200
200
140
ARS
50G
400
400
50
600
1.1
5
250
3
300
1
- 50 to +175
- 50 to +175
280
ARS
50J
600
420
600
d
en
50A
50
35
50
SYMBOL
V
RRM
V
RMS
V
DC
I
F(AV)
I
FSM
V
F
I
R
ARS
ARS
50K
800
560
800
ARS
50M
1000
700
1000
UNIT
V
V
V
A
A
V
μA
μs
pF
O
PARAMETER
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
Maximum instantaneous forward voltage (Note 1)
@ 50 A
Maximum reverse current @ Rated VR T
J
=25
o
C
Typical reverse recovery time (Note 2)
Typical junction capacitance (Note 3)
Typical Thermal Resistance
Storage temperature range
tR
e co
T
J
=125
o
C
trr
Cj
R
θJC
T
J
T
STG
mm
C/W
O
O
Operating junction temperature range
C
C
Note 1: Pulse test with PW=300μs, 1% duty cycle
Note 2: Reverse Recovery Time Test Conditions: I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A
Note 3: Measured at 1 MHz and Applied Reverse Voltage of 4.0V D.C.
Document Number: DS_D1409007
No
Version: D14
ARS50A thru ARS50M
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
ARS50x
(Note 1)
PACKING CODE
PACKING CODE
SUFFIX
B0
G
ARS
1,000 / Bulk packing
PACKAGE
PACKING
Note 1: "x" defines voltage from 50V (ARS50A) to 1000V (ARS50M)
EXAMPLE
PREFERRED P/N
ARS50M B0
ARS50M B0G
PART NO.
ARS50M
ARS50M
PACKING CODE
B0
B0
G
Green compound
PACKING CODE
SUFFIX
DESCRIPTION
RATINGS AND CHARACTERISTICS CURVES
(T
A
=25
o
C unless otherwise noted)
FIG.1 MAXMUM FORWARD CURRENT DERATING
CURVE
60
AVERAGE FORWARD CURRENT(A)
50
40
30
20
10
0
125
135
145
CASE
INSTANTANEOUS REVERSE CURRENT (μA)
RESISTIVE OR
INDUCTIVE LOAD
100
mm
1
en
T
J
=125
o
C
10
T
J
=25
o
C
175
0.1
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
TEMPERATURE(
o
C)
FIG. 3 MAXIMUM NON-REPETITIVE PEAK FORWARD
SURGE CURRENT
tR
8.3ms Single Half Sine Wave
10
NUMBER OF CYCLES AT 60 Hz
e co
155
165
INSTANTANEOUS FORWARD CURRENT (A)
100
100
PEAK FORWARD SURGE CURRENT(A)
No
1000
10
100
1
10
1
0.1
0
0.2
0.4
0.6
0.8
1
FORWARD VOLTAGE (V)
1.2
1.4
Document Number: DS_D1409007
de
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
FIG. 4 TYPICAL FORWARD CHARACTERISTICS
d
PULSE WIDTH-300μs
1% DUTY CYCLE
Version: D14
ARS50A thru ARS50M
Taiwan Semiconductor
FIG. 5 TYPICAL JUNCTION CAPACITANCE
1000
JUNCTION CAPACITANCE (pF)
100
f=1.0MHz
Vsig=50m Vp-p
10
1
10
REVERSE VOLTAGE (V)
100
DIM.
A
B
C
D
Unit (mm)
Min
5.50
8.30
6.00
4.20
MARKING DIAGRAM
Document Number: DS_D1409007
No
tR
P/N =
G=
F=
YW =
Specific Device Code
Green Compound
Date Code
Factory Code
e co
mm
en
8.90
6.40
4.70
0.327
0.236
0.165
de
Unit (inch)
Max
5.70
Min
Max
0.217
0.224
0.350
0.252
0.185
Version: D14
ARS
d
PACKAGE OUTLINE DIMENSIONS
ARS50A thru ARS50M
Taiwan Semiconductor
CREAT BY ART
No
Document Number: DS_D1409007
tR
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Version: D14
e co
mm
en
de
d
FPGA/CPLD
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