Translation - Voltage Levels
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Microchip(微芯科技) |
| 包装说明 | LEAD FREE, MSOP-8 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 8 weeks |
| 其他特性 | CAN ALSO OPERATE WITH 5V SUPPLY |
| 最大延迟 | 0.6 ns |
| 接口集成电路类型 | TTL/CMOS TO PECL TRANSLATOR |
| JESD-30 代码 | S-PDSO-G8 |
| JESD-609代码 | e4 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 位数 | 1 |
| 功能数量 | 2 |
| 端子数量 | 8 |
| 输出锁存器或寄存器 | NONE |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 | 3.465 V |
| 最小供电电压 | 3.135 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 3 mm |
| SY100EPT22VKG-TR | SY100EPT22VKG | SY100EPT22VZG | SY100EPT22VZG-TR | |
|---|---|---|---|---|
| 描述 | Translation - Voltage Levels | Translation - Voltage Levels 3.3V/5V Dual LVTTL/LVCMOS-to-Differential LVPECL Translator | Translation - Voltage Levels 3.3V/5V Dual LVTTL/LVCMOS-to-Differential LVPECL Translator | Translation - Voltage Levels |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
| 包装说明 | LEAD FREE, MSOP-8 | LEAD FREE, MSOP-8 | LEAD FREE, PLASTIC, SOIC-8 | LEAD FREE, PLASTIC, SOIC-8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 8 weeks | 8 weeks | 6 weeks | 6 weeks |
| 其他特性 | CAN ALSO OPERATE WITH 5V SUPPLY | CAN ALSO OPERATE WITH 5V SUPPLY | CAN ALSO OPERATE WITH 5V SUPPLY | CAN ALSO OPERATE WITH 5V SUPPLY |
| 最大延迟 | 0.6 ns | 0.6 ns | 0.6 ns | 0.6 ns |
| 接口集成电路类型 | TTL/CMOS TO PECL TRANSLATOR | TTL/CMOS TO PECL TRANSLATOR | TTL/CMOS TO PECL TRANSLATOR | TTL/CMOS TO PECL TRANSLATOR |
| JESD-30 代码 | S-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e4 | e4 | e4 | e4 |
| 长度 | 3 mm | 3 mm | 4.93 mm | 4.93 mm |
| 湿度敏感等级 | 1 | 1 | 3 | 3 |
| 位数 | 1 | 1 | 1 | 1 |
| 功能数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 8 | 8 | 8 | 8 |
| 输出锁存器或寄存器 | NONE | NONE | NONE | NONE |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | SOP | SOP |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 1.1 mm | 1.73 mm | 1.73 mm |
| 最大供电电压 | 3.465 V | 3.465 V | 3.465 V | 3.465 V |
| 最小供电电压 | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 |
| 宽度 | 3 mm | 3 mm | 3.94 mm | 3.94 mm |
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