Registers 1.8V 25BT-1:1/14BT-1:2 BUFFER
| 参数名称 | 属性值 |
| Brand Name | NXP Semiconductor |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | BGA |
| 包装说明 | 13.50 X 5.50 MM, 1.05 MM HEIGHT, LEAD FREE, PLASTIC, SOT-536-1, LFBGA-96 |
| 针数 | 96 |
| 制造商包装代码 | SOT-536-1 |
| Reach Compliance Code | unknown |
| 系列 | 32866 |
| JESD-30 代码 | R-PBGA-B96 |
| 长度 | 13.5 mm |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 湿度敏感等级 | 2 |
| 位数 | 14 |
| 功能数量 | 1 |
| 端子数量 | 96 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | OPEN-DRAIN |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFBGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 峰值回流温度(摄氏度) | 260 |
| 传播延迟(tpd) | 1.8 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.5 mm |
| 最大供电电压 (Vsup) | 2 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 40 |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 5.5 mm |
| 最小 fmax | 450 MHz |

| SSTUA32866EC/G,551 | SSTUA32866EC,557 | SSTUA32866EC,518 | SSTUA32866EC/G-T | SSTUA32866EC518 | SSTUA32866EC-G518 | SSTUA32866EC557 | SSTUA32866EC/G,557 | SSTUA32866EC,551 | SSTUA32866EC/G,518 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Registers 1.8V 25BT-1:1/14BT-1:2 BUFFER | IC buffer 1.8V 25bit sot536 | IC buffer 1.8V 25bit sot536 | 寄存器 1.8V 25bt-1:7 14bt-1:2 buffer | Registers 1.8V 25BT-1:1/14BT-1:2 BUFFER | Registers 1.8V 25BT-1:7 | Registers 1.8V 25BT-1:1/14BT-1:2 BUFFER | Registers 1.8V 25BT-1:1/14BT-1:2 BUFFER | Registers 1.8V 25BT-1:1/14BT-1:2 BUFFER | IC REG BUFFER 25BIT 96-LFBGA |
| Brand Name | NXP Semiconductor | NXP Semiconduc | NXP Semiconduc | - | - | - | - | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | - | - | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | BGA | BGA | BGA | - | - | - | - | BGA | BGA | BGA |
| 包装说明 | 13.50 X 5.50 MM, 1.05 MM HEIGHT, LEAD FREE, PLASTIC, SOT-536-1, LFBGA-96 | LFBGA, BGA96,6X16,32 | LFBGA, | - | - | - | - | 13.50 X 5.50 MM, 1.05 MM HEIGHT, LEAD FREE, PLASTIC, SOT-536-1, LFBGA-96 | LFBGA, | 13.50 X 5.50 MM, 1.05 MM HEIGHT, LEAD FREE, PLASTIC, SOT-536-1, LFBGA-96 |
| 针数 | 96 | 96 | 96 | - | - | - | - | 96 | 96 | 96 |
| 制造商包装代码 | SOT-536-1 | SOT536-1 | SOT536-1 | - | - | - | - | SOT-536-1 | SOT536-1 | SOT536-1 |
| Reach Compliance Code | unknown | unknow | unknow | - | - | - | - | compliant | unknown | unknown |
| 系列 | 32866 | 32866 | 32866 | - | - | - | - | 32866 | 32866 | 32866 |
| JESD-30 代码 | R-PBGA-B96 | R-PBGA-B96 | R-PBGA-B96 | - | - | - | - | R-PBGA-B96 | R-PBGA-B96 | R-PBGA-B96 |
| 长度 | 13.5 mm | 13.5 mm | 13.5 mm | - | - | - | - | 13.5 mm | 13.5 mm | 13.5 mm |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | - | - | - | - | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 位数 | 14 | 14 | 14 | - | - | - | - | 14 | 14 | 14 |
| 功能数量 | 1 | 1 | 1 | - | - | - | - | 1 | 1 | 1 |
| 端子数量 | 96 | 96 | 96 | - | - | - | - | 96 | 96 | 96 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | - | - | - | - | 70 °C | 70 °C | 70 °C |
| 输出特性 | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN | - | - | - | - | OPEN-DRAIN | OPEN-DRAIN | OPEN-DRAIN |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | - | - | - | - | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFBGA | LFBGA | LFBGA | - | - | - | - | LFBGA | LFBGA | LFBGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | - | - | - | - | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 传播延迟(tpd) | 1.8 ns | 1.8 ns | 1.8 ns | - | - | - | - | 1.8 ns | 1.8 ns | 1.8 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | - | - | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.5 mm | 1.5 mm | 1.5 mm | - | - | - | - | 1.5 mm | 1.5 mm | 1.5 mm |
| 最大供电电压 (Vsup) | 2 V | 2 V | 2 V | - | - | - | - | 2 V | 2 V | 2 V |
| 最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | - | - | - | - | 1.7 V | 1.7 V | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | - | - | - | - | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | - | - | - | - | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | - | - | - | - | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | - | - | - | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | BALL | BALL | BALL | - | - | - | - | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | - | - | - | - | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | - | - | - | - | BOTTOM | BOTTOM | BOTTOM |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | - | - | - | - | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | 5.5 mm | 5.5 mm | 5.5 mm | - | - | - | - | 5.5 mm | 5.5 mm | 5.5 mm |
| 最小 fmax | 450 MHz | 450 MHz | 450 MHz | - | - | - | - | 450 MHz | 450 MHz | 450 MHz |
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