Equalizers ISL90810U LW NSE/LW PWR/I2C BUS/256 TAPS
参数名称 | 属性值 |
Brand Name | Intersil |
厂商名称 | Renesas(瑞萨电子) |
零件包装代码 | QFN |
包装说明 | HVQCCN, LCC20,.16SQ,20 |
针数 | 20 |
Reach Compliance Code | compliant |
Factory Lead Time | 5 weeks |
商用集成电路类型 | CONSUMER CIRCUIT |
JESD-30 代码 | S-PQCC-N20 |
JESD-609代码 | e3 |
长度 | 4 mm |
湿度敏感等级 | 1 |
功能数量 | 1 |
端子数量 | 20 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | HVQCCN |
封装等效代码 | LCC20,.16SQ,20 |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 |
电源 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 1 mm |
最大压摆率 | 60 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子面层 | Matte Tin (Sn) - annealed |
端子形式 | NO LEAD |
端子节距 | 0.5 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 4 mm |
ISL59603IRZ-T7 | ISL59605-SPI-EVALZ | ISL59601IRZ-T7 | ISL59605IRZ-T7 | |
---|---|---|---|---|
描述 | Equalizers ISL90810U LW NSE/LW PWR/I2C BUS/256 TAPS | Video IC Development Tools DEMO BRD FOR AUTO EQ COMPOSITE VID | IC VIDEO EQUALIZER 20-QFN | IC VIDEO EQUALIZER 20-QFN |
Brand Name | Intersil | - | Intersil | Intersil |
零件包装代码 | QFN | - | QFN | QFN |
包装说明 | HVQCCN, LCC20,.16SQ,20 | - | HVQCCN, LCC20,.16SQ,20 | HVQCCN, LCC20,.16SQ,20 |
针数 | 20 | - | 20 | 20 |
Reach Compliance Code | compliant | - | compliant | compliant |
Factory Lead Time | 5 weeks | - | 4 weeks | 3 weeks |
商用集成电路类型 | CONSUMER CIRCUIT | - | CONSUMER CIRCUIT | CONSUMER CIRCUIT |
JESD-30 代码 | S-PQCC-N20 | - | S-PQCC-N20 | S-PQCC-N20 |
JESD-609代码 | e3 | - | e3 | e3 |
长度 | 4 mm | - | 4 mm | 4 mm |
湿度敏感等级 | 1 | - | 1 | 1 |
功能数量 | 1 | - | 1 | 1 |
端子数量 | 20 | - | 20 | 20 |
最高工作温度 | 85 °C | - | 85 °C | 85 °C |
最低工作温度 | -40 °C | - | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | HVQCCN | - | HVQCCN | HVQCCN |
封装等效代码 | LCC20,.16SQ,20 | - | LCC20,.16SQ,20 | LCC20,.16SQ,20 |
封装形状 | SQUARE | - | SQUARE | SQUARE |
封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度) | 260 | - | 260 | 260 |
电源 | 5 V | - | 5 V | 5 V |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified |
座面最大高度 | 1 mm | - | 1 mm | 1 mm |
最大压摆率 | 60 mA | - | 60 mA | 60 mA |
最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | 4.5 V |
表面贴装 | YES | - | YES | YES |
温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL |
端子面层 | Matte Tin (Sn) - annealed | - | Matte Tin (Sn) - annealed | Matte Tin (Sn) - annealed |
端子形式 | NO LEAD | - | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm |
端子位置 | QUAD | - | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 4 mm | - | 4 mm | 4 mm |
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