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IS66WVE1M16BLL-55BLI

产品描述SRAM 16Mb 1M x 16 55ns Pseudo SRAM
产品类别存储   
文件大小473KB,共30页
制造商ISSI(芯成半导体)
官网地址http://www.issi.com/
标准
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IS66WVE1M16BLL-55BLI概述

SRAM 16Mb 1M x 16 55ns Pseudo SRAM

IS66WVE1M16BLL-55BLI规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
ISSI(芯成半导体)
产品种类
Product Category
SRAM
RoHSDetails
Memory Size16 Mbit
Organization1 M x 16
Access Time55 ns
电源电压-最大
Supply Voltage - Max
3.6 V
电源电压-最小
Supply Voltage - Min
2.7 V
Supply Current - Max35 mA
最小工作温度
Minimum Operating Temperature
- 40 C
最大工作温度
Maximum Operating Temperature
+ 85 C
安装风格
Mounting Style
SMD/SMT
封装 / 箱体
Package / Case
BGA-48
系列
Packaging
Tray
Memory TypePsuedo
Moisture SensitiveYes
工厂包装数量
Factory Pack Quantity
480

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IS66WVE1M16BLL
3.0V Core Async/Page PSRAM
Overview
The IS66WVE1M16BLL is an integrated memory device containing 16Mbit Pseudo Static Random Access
Memory using a self-refresh DRAM array organized as 1M words by 16 bits. The device includes several
power saving modes : Partial Array Refresh mode where data is retained in a portion of the array and
Deep Power Down mode. Both these modes reduce standby current drain. The die has separate power
rails, VDDQ and VSSQ for the I/O to be run from a separate power supply from the device core.
Features
Asynchronous and page mode interface
Dual voltage rails for optional performance
VDD 2.7V~3.6V, VDDQ 2.7V~3.6V
Page mode read access
Interpage Read access : 55ns, 70ns
Intrapage Read access : 20ns
Low Power Consumption
Asynchronous Operation < 30 mA
Intrapage Read < 18mA
Standby < 80 uA (max.)
Deep power-down (DPD) < 3uA (Typ)
Low Power Feature
Temperature Controlled Refresh
Partial Array Refresh
Deep power-down (DPD) mode
Operating temperature Range
Industrial -40°C~85°C
Packages:
48-ball TFBGA, 48-pin TSOP-I
Notes :
1. The 48-pin TSOP-I package option is not yet available. Please contact SRAM marketing at
sram@issi.com
for
additional information.
Copyright © 2012 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its
products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services
described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information
and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or
malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or
effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to
its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Rev. A | Feb. 2012
www.issi.com
- SRAM@issi.com
1

IS66WVE1M16BLL-55BLI相似产品对比

IS66WVE1M16BLL-55BLI IS66WVE1M16BLL-55BLI-TR
描述 SRAM 16Mb 1M x 16 55ns Pseudo SRAM SRAM 16Mb 1M x 16 55ns Pseudo SRAM
Product Attribute Attribute Value Attribute Value
制造商
Manufacturer
ISSI(芯成半导体) ISSI(芯成半导体)
产品种类
Product Category
SRAM SRAM
RoHS Details Details
Memory Size 16 Mbit 16 Mbit
Organization 1 M x 16 1 M x 16
Access Time 55 ns 55 ns
电源电压-最大
Supply Voltage - Max
3.6 V 3.6 V
电源电压-最小
Supply Voltage - Min
2.7 V 2.7 V
Supply Current - Max 35 mA 35 mA
最小工作温度
Minimum Operating Temperature
- 40 C - 40 C
最大工作温度
Maximum Operating Temperature
+ 85 C + 85 C
安装风格
Mounting Style
SMD/SMT SMD/SMT
封装 / 箱体
Package / Case
BGA-48 BGA-48
Memory Type Psuedo Psuedo
工厂包装数量
Factory Pack Quantity
480 2500
系列
Packaging
Tray Reel
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