EEPROM EEPROM 1Kb 3 wire 1.8V to 5.5V
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ABLIC |
| 零件包装代码 | SOIC |
| 包装说明 | TSSOP, |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 其他特性 | 100 YEAR DATA RETENTION |
| 最大时钟频率 (fCLK) | 2 MHz |
| 数据保留时间-最小值 | 100 |
| JESD-30 代码 | R-PDSO-G8 |
| JESD-609代码 | e6 |
| 长度 | 4.4 mm |
| 内存密度 | 1024 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 64 words |
| 字数代码 | 64 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 64X16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL |
| 峰值回流温度(摄氏度) | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 串行总线类型 | MICROWIRE |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.6 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Bismuth (Sn/Bi) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 10 |
| 宽度 | 3 mm |
| 最长写入周期时间 (tWC) | 8 ms |
| Base Number Matches | 1 |

| S-93L46AD0I-T8T1G | S-93L56AR0I-J8T1G | S-93L56AD0I-T8T1G | S-93L46AR0I-J8T1U | S-93L66AD0I-I8T1U | S-93L46AD0I-I8T1U | S-93L66AR0I-J8T1U | S-93L46AD0I-T8T1U | S-93L56AR0I-J8T1U | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM EEPROM 1Kb 3 wire 1.8V to 5.5V | EEPROM EEPROM 2Kb 3 wire 1.8V to 5.5V | EEPROM EEPROM 2Kb 3 wire 1.8V to 5.5V | EEPROM EEPROM | EEPROM EEPROM | EEPROM EEPROM | EEPROM EEPROM | EEPROM EEPROM | EEPROM EEPROM |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC | ABLIC |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | TSSOP, | SOP-8 | TSSOP-8 | SOP, | SNT-8 | VSOF, | SOP-8 | TSSOP, | SOP-8 |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | 100 YEAR DATA RETENTION | 100 YEAR DATA RETENTION | 100 YEAR DATA RETENTION | 100 YEAR DATA RETENTION | 100 YEAR DATA RETENTION | 100 YEAR DATA RETENTION | 100 YEAR DATA RETENTION | 100 YEAR DATA RETENTION | 100 YEAR DATA RETENTION |
| 最大时钟频率 (fCLK) | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz | 2 MHz |
| 数据保留时间-最小值 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
| JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-F8 | R-PDSO-F8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e6 | e6/e2 | e6 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 4.4 mm | 5.02 mm | 4.4 mm | 5.02 mm | 2.23 mm | 2.23 mm | 5.02 mm | 4.4 mm | 5.02 mm |
| 内存密度 | 1024 bit | 2048 bit | 2048 bit | 1024 bit | 4096 bit | 1024 bit | 4096 bit | 1024 bit | 2048 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 字数 | 64 words | 128 words | 128 words | 64 words | 256 words | 64 words | 256 words | 64 words | 128 words |
| 字数代码 | 64 | 128 | 128 | 64 | 256 | 64 | 256 | 64 | 128 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 64X16 | 128X16 | 128X16 | 64X16 | 256X16 | 64X16 | 256X16 | 64X16 | 128X16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | SOP | TSSOP | SOP | VSOF | VSOF | SOP | TSSOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 1.75 mm | 1.1 mm | 1.75 mm | 0.5 mm | 0.5 mm | 1.75 mm | 1.1 mm | 1.75 mm |
| 串行总线类型 | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.6 V | 1.6 V | 1.6 V | 1.6 V | 1.6 V | 1.6 V | 1.6 V | 1.6 V | 1.6 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Bismuth (Sn/Bi) | TIN BISMUTH/TIN SILVER | Tin/Bismuth (Sn/Bi) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | FLAT | FLAT | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm | 0.5 mm | 0.5 mm | 1.27 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 10 | 10 | 10 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3 mm | 3.9 mm | 3 mm | 3.9 mm | 1.97 mm | 1.97 mm | 3.9 mm | 3 mm | 3.9 mm |
| 最长写入周期时间 (tWC) | 8 ms | 8 ms | 8 ms | 8 ms | 8 ms | 8 ms | 8 ms | 8 ms | 8 ms |
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