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89HPES24T6G2ZCALG

产品描述PCI Interface IC PCI EXPRESS SWITCH
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小571KB,共54页
制造商IDT (Integrated Device Technology)
标准
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89HPES24T6G2ZCALG概述

PCI Interface IC PCI EXPRESS SWITCH

89HPES24T6G2ZCALG规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅不含铅
是否Rohs认证符合
零件包装代码FCBGA
包装说明19 X 19 MM, 1 MM PITCH, GREEN, FCBGA-324
针数324
制造商包装代码ALG324
Reach Compliance Codecompliant
ECCN代码EAR99
地址总线宽度
总线兼容性PCI
最大时钟频率125 MHz
外部数据总线宽度
JESD-30 代码S-PBGA-B324
JESD-609代码e1
长度19 mm
湿度敏感等级4
端子数量324
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA324,18X18,40
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)260
电源1,3.3 V
认证状态Not Qualified
座面最大高度3.42 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度19 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI
Base Number Matches1

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24-Lane 6-Port
Gen2 PCI Express® Switch
®
89HPES24T6G2
Data Sheet
Device Overview
The 89HPES24T6G2 is a member of IDT’s PRECISE™ family of PCI
Express® switching solutions. The PES24T6G2 is a 24-lane, 6-port
Gen2 peripheral chip that performs PCI Express base switching with a
feature set optimized for high performance applications such as servers,
storage, and communications systems. It provides connectivity and
switching functions between a PCI Express upstream port and up to five
downstream ports and supports switching between downstream ports.
High Performance PCI Express Switch
– Twenty-four 5 Gbps Gen2 PCI Express lanes supporting
5 Gbps and 2.5 Gbps operation
– Up to six switch ports
– Support for Max Payload Size up to 2048 bytes
– Supports one virtual channel and eight traffic classes
– Fully compliant with PCI Express base specification Revision
2.0
Flexible Architecture with Numerous Configuration Options
– Automatic per port link width negotiation to x8, x4, x2, or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion
– Supports in-band hot-plug presence detect capability
– Supports external signal for hot plug event notification allowing
SCI/SMI generation for legacy operating systems
Features
– Dynamic link width reconfiguration for power/performance
optimization
– Configurable downstream port PCI-to-PCI bridge device
numbering
– Crosslink support
– Supports ARI forwarding defined in the Alternative Routing-ID
Interpretation (ARI) ECN for virtualized and non-virtualized
environments
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Supports bus locked transactions, allowing use of PCI Express
with legacy software
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates twenty-four 5 Gbps / 2.5 Gbps embedded SerDes,
8B/10B encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Ability to disable peer-to-peer communications
– Supports ECRC and Advanced Error Reporting
– All internal data and control RAMs are SECDED ECC
protected
– Supports PCI Express hot-plug on all downstream ports
– Supports upstream port hot-plug
Block Diagram
6-Port Switch Core / 24 Gen2 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Multiplexer / Demultiplexer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
Phy
Logical
Layer
SerDes
SerDes
SerDes SerDes
SerDes
SerDes
SerDes SerDes
SerDes
SerDes
SerDes SerDes
(Port 0)
(Port 1)
Figure 1 Internal Block Diagram
(Port 5)
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 54
2013 Integrated Device Technology, Inc.
April 30, 2013
DSC 6930

89HPES24T6G2ZCALG相似产品对比

89HPES24T6G2ZCALG 89HPES24T6G2ZCALI 89HPES24T6G2ZBAL 89HPES24T6G2ZBAL8 89HPES24T6G2ZCALGI 89HPES24T6G2ZCAL
描述 PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH PCI Interface IC PCI EXPRESS SWITCH
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 不含铅 含铅 含铅 含铅 不含铅 含铅
是否Rohs认证 符合 不符合 不符合 不符合 符合 不符合
零件包装代码 FCBGA FCBGA FCBGA FCBGA FCBGA FCBGA
包装说明 19 X 19 MM, 1 MM PITCH, GREEN, FCBGA-324 19 X 19 MM, 1 MM PITCH, FCBGA-324 19 X 19 MM, 1 MM PITCH, FCBGA-324 FCBGA-324 19 X 19 MM, 1 MM PITCH, GREEN, FCBGA-324 19 X 19 MM, 1 MM PITCH, FCBGA-324
针数 324 324 324 324 324 324
制造商包装代码 ALG324 AL324 AL324 AL324 ALG324 AL324
Reach Compliance Code compliant not_compliant not_compliant not_compliant compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
总线兼容性 PCI PCI PCI PCI; SMBUS PCI PCI
最大时钟频率 125 MHz 125 MHz 125 MHz 100 MHz 125 MHz 125 MHz
JESD-30 代码 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324 S-PBGA-B324
JESD-609代码 e1 e0 e0 e0 e1 e0
长度 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm
湿度敏感等级 4 4 4 4 4 4
端子数量 324 324 324 324 324 324
最高工作温度 70 °C 85 °C 70 °C 70 °C 85 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA BGA BGA BGA BGA
封装等效代码 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40 BGA324,18X18,40
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) 260 225 225 225 260 225
电源 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V 1,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 3.42 mm 3.42 mm 3.42 mm 3.42 mm 3.42 mm 3.42 mm
最大供电电压 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V
最小供电电压 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V
标称供电电压 1 V 1 V 1 V 1 V 1 V 1 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37)
端子形式 BALL BALL BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 NOT SPECIFIED 30 NOT SPECIFIED NOT SPECIFIED 30
宽度 19 mm 19 mm 19 mm 19 mm 19 mm 19 mm
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 1 1 1 - 1
厂商名称 - IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) -

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