Multiplexer Switch ICs High Voltage, Fault-Protected Analog Multiplexer
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | PLASTIC, DIP-18 |
| 针数 | 18 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 其他特性 | FAULT PROTECTED; OVERVOLTAGE PROTECTION |
| 模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER |
| JESD-30 代码 | R-PDIP-T18 |
| JESD-609代码 | e0 |
| 长度 | 22.86 mm |
| 湿度敏感等级 | 1 |
| 标称负供电电压 (Vsup) | -15 V |
| 信道数量 | 4 |
| 功能数量 | 1 |
| 端子数量 | 18 |
| 标称断态隔离度 | 68 dB |
| 通态电阻匹配规范 | 300 Ω |
| 最大通态电阻 (Ron) | 3000 Ω |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP18,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 245 |
| 电源 | +-15 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.572 mm |
| 最大信号电流 | 0.02 A |
| 最大供电电流 (Isup) | 2.5 mA |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 最长断开时间 | 1 ns |
| 最长接通时间 | 1 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| MAX389EPN | MAX389EWG | MAX388MLI/883B | MAX388CWG-T | MAX388CWG | MAX388C/D | MAX389CWG-T | MAX389MJN | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Multiplexer Switch ICs High Voltage, Fault-Protected Analog Multiplexer | Multiplexer Switch ICs High Voltage, Fault-Protected Analog Multiplexer | Multiplexer Switch ICs | Multiplexer Switch ICs High Voltage, Fault-Protected Analog Multiplexer | Multiplexer Switch ICs High-Voltage, Fault-Protected Analog Multiplexers | Multiplexer Switch ICs | Multiplexer Switch ICs High Voltage, Fault-Protected Analog Multiplexer | Multiplexer Switch ICs |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | - | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 |
| 零件包装代码 | DIP | SOIC | QLCC | SOIC | SOIC | - | SOIC | DIP |
| 包装说明 | PLASTIC, DIP-18 | SO-24 | PLASTIC, LCC-28 | SOIC-24 | SOP-24 | - | SOP-24 | CERDIP-18 |
| 针数 | 18 | 24 | 28 | 24 | 24 | - | 24 | 18 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | - | not_compliant | not_compliant |
| 模拟集成电路 - 其他类型 | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | - | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER |
| JESD-30 代码 | R-PDIP-T18 | R-PDSO-G24 | S-PQCC-J | R-PDSO-G24 | R-PDSO-G24 | - | R-PDSO-G24 | R-GDIP-T18 |
| JESD-609代码 | e0 | e0 | - | e0 | e0 | - | e0 | e0 |
| 长度 | 22.86 mm | 15.4 mm | 11.43 mm | 15.4 mm | 15.4 mm | - | 15.4 mm | - |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | - | -15 V | -15 V |
| 信道数量 | 4 | 4 | 4 | 8 | 8 | - | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | - | 1 | 1 |
| 端子数量 | 18 | 24 | - | 24 | 24 | - | 24 | 18 |
| 标称断态隔离度 | 68 dB | 68 dB | 68 dB | 68 dB | 68 dB | - | 68 dB | 68 dB |
| 通态电阻匹配规范 | 300 Ω | 300 Ω | 300 Ω | 300 Ω | 300 Ω | - | 300 Ω | 300 Ω |
| 最大通态电阻 (Ron) | 3000 Ω | 3000 Ω | 3000 Ω | 3000 Ω | 3000 Ω | - | 3000 Ω | 3000 Ω |
| 最高工作温度 | 85 °C | 85 °C | 125 °C | 70 °C | 70 °C | - | 70 °C | 125 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | SOP | QCCJ | SOP | SOP | - | SOP | DIP |
| 封装等效代码 | DIP18,.3 | SOP24,.4 | - | SOP24,.4 | SOP24,.4 | - | SOP24,.4 | DIP18,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE | - | SMALL OUTLINE | IN-LINE |
| 峰值回流温度（摄氏度） | 245 | 245 | 225 | 240 | 245 | - | 240 | 245 |
| 电源 | +-15 V | +-15 V | - | +-15 V | +-15 V | - | +-15 V | +-15 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 4.572 mm | 2.65 mm | 2.54 mm | 2.65 mm | 2.65 mm | - | 2.65 mm | 5.08 mm |
| 最大信号电流 | 0.02 A | 0.02 A | - | 0.02 A | 0.02 A | - | 0.02 A | 0.02 A |
| 最大供电电流 (Isup) | 2.5 mA | 2.5 mA | - | 2.5 mA | 2.5 mA | - | 2.5 mA | 2.5 mA |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | - | 15 V | 15 V |
| 表面贴装 | NO | YES | YES | YES | YES | - | YES | NO |
| 最长断开时间 | 1 ns | 1 ns | 1 ns | 1 ns | 1 ns | - | 1 ns | 1 ns |
| 最长接通时间 | 1 ns | 1 ns | 1 ns | 1 ns | 1 ns | - | 1 ns | 1 ns |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | MILITARY | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | MILITARY |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn85Pb15) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | GULL WING | J BEND | GULL WING | GULL WING | - | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | DUAL | - | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.5 mm | 11.43 mm | 7.5 mm | 7.5 mm | - | 7.5 mm | 7.62 mm |
| 厂商名称 | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) |
stm32/stm8
微控制器 MCU
MicroPython开源版块
电子竞赛
测试/测量
stm32/stm8
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
