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MAX4747ETE+T

产品描述Analog Switch ICs Quad/Dual SPDT Analog Switch
产品类别模拟混合信号IC    信号电路   
文件大小237KB,共14页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
标准
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MAX4747ETE+T概述

Analog Switch ICs Quad/Dual SPDT Analog Switch

MAX4747ETE+T规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Maxim(美信半导体)
包装说明,
Reach Compliance Codecompliant
Is SamacsysN
模拟集成电路 - 其他类型SPST
湿度敏感等级1
峰值回流温度(摄氏度)NOT SPECIFIED
端子面层NOT SPECIFIED
处于峰值回流温度下的最长时间NOT SPECIFIED
Base Number Matches1

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19-2646; Rev 3; 1/12
50
, Low-Voltage, Quad SPST/Dual SPDT Analog
Switches in WLP
General Description
The MAX4747–MAX4750 low-voltage, quad single-pole
single-throw (SPST)/dual single-pole/double-throw
(SPDT) analog switches operate from a single +2V to
+11V supply and handle rail-to-rail analog signals.
These switches exhibit low leakage current (0.1nA) and
consume less than 0.5nW (typ) of quiescent power,
making them ideal for battery-powered applications.
When powered from a +3V supply, these switches fea-
ture 50Ω (max) on-resistance (R
ON
), with 3.5Ω (max)
matching between channels and 9Ω (max) flatness
over the specified signal range.
The MAX4747 has four normally open (NO) switches, the
MAX4748 has four normally closed (NC) switches, and
the MAX4749 has two NO and two NC switches. The
MAX4750 has two SPDT switches. These switches are
available in 14-pin TSSOP, 16-pin TQFN (4mm x 4mm),
and 16-bump WLP packages. This tiny chip-scale pack-
age occupies a 2mm

2mm area and significantly
reduces the required PC board area.
Features
o
2mm

2mm WLP
o
Guaranteed On-Resistance (R
ON
)
25Ω (max) at +5V
50Ω (max) at +3V
o
On-Resistance Matching
3Ω (max) at +5V
3.5Ω (max) at +3V
o
Guaranteed < 0.1nA Leakage Current at
T
A
= +25°C
o
Single-Supply Operation from +2.0V to +11V
o
TTL/CMOS-Logic Compatible
o
-84dB Crosstalk (1MHz)
o
-72dB Off-Isolation (1MHz)
o
Low Power Consumption: 0.5nW (typ)
o
Rail-to-Rail Signal Handling
MAX4747–MAX4750
Ordering Information
PART
MAX4747EUD+
MAX4747ETE+
MAX4747EWE+T
TEMP
RANGE
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
PIN-/BUMP-
PACKAGE
14 TSSOP
16 Thin QFN-EP*
16 WLP
Applications
Battery-Powered Systems
Audio/Video-Signal Routing
Low-Voltage Data-Acquisition Systems
Cell Phones
Communications Circuits
Glucose Meters
PDAs
*EP
= Exposed pad.
+Denotes
a lead(Pb)-free/RoHS-compliant package.
T = Tape and reel.
Ordering Information continued at end of data sheet.
Pin/Bump Configurations/Truth Tables
TOP VIEW
N.C.
NO1
TOP VIEW
(BUMPS SIDE DOWN)
MAX4747
IN1
1
2
3
4
+
16
V+
15
14
13
MAX4747
+
12
11
IN4
NO4
COM4
COM3
NO1 1
COM1 2
NO2 3
14 V+
13 IN1
12 IN4
11 NO4
10 COM4
9 COM3
8 NO3
D
C
B
A
COM1
NO2
COM2
IN2
COM1
NO2
COM2
IN2
1
2
3
4
NO1
V+
IN3
MAX4747ETE
*EP
10
9
COM2 4
IN2 5
IN3 6
IN1
GND
NO3
IN4
NO4
COM4
COM3
5
IN3
6
GND
7
NO3
8
N.C.
GND 7
TSSOP
WLP
INPUT
LOW
HIGH
SWITCH STATE
OFF
ON
TQFN
*CONNECT EP TO V+
Pin Configurations/Truth Tables continued at end of data sheet.
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

MAX4747ETE+T相似产品对比

MAX4747ETE+T MAX4750EUD+T MAX4750EBE+T MAX4750EUD+ MAX4750ETE+ MAX4748EBE-T MAX4748EBE+T
描述 Analog Switch ICs Quad/Dual SPDT Analog Switch Analog Switch ICs Quad SPST/Dual SPDT Analog Switch Analog Switch ICs 50ohm, Low-Voltage, Quad SPST/Dual SPDT Analog Switches in UCSP Analog Switch ICs Quad SPST/Dual SPDT Analog Switch Analog Switch ICs Quad SPST/Dual SPDT Analog Switch Analog Switch ICs 50OHM Low-Voltage, Quad SPST/Dual SPDT Analog Switches in UCSP Analog Switch ICs Quad SPST/Dual SPDT Analog Switch
是否无铅 不含铅 不含铅 - 不含铅 不含铅 含铅 不含铅
是否Rohs认证 符合 符合 - 符合 符合 不符合 符合
厂商名称 Maxim(美信半导体) Maxim(美信半导体) - Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体) Maxim(美信半导体)
包装说明 , TSSOP, TSSOP14,.25 - TSSOP, TSSOP14,.25 HVQCCN, LCC16,.16SQ,25 2 X 2 MM, UCSP-16 VFBGA, BGA16,4X4,20
Reach Compliance Code compliant compliant - compliant compliant not_compliant compliant
模拟集成电路 - 其他类型 SPST SPDT - SPDT SPDT SPST SPST
湿度敏感等级 1 1 - 1 1 1 1
峰值回流温度(摄氏度) NOT SPECIFIED 260 - 260 260 240 260
端子面层 NOT SPECIFIED Matte Tin (Sn) - Matte Tin (Sn) Matte Tin (Sn) Tin/Lead (Sn/Pb) Matte Tin (Sn)
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED 30 20 NOT SPECIFIED
零件包装代码 - TSSOP - TSSOP QFN BGA BGA
针数 - 14 - 14 16 16 16
ECCN代码 - EAR99 - EAR99 EAR99 EAR99 EAR99
JESD-30 代码 - R-PDSO-G14 - R-PDSO-G14 S-XQCC-N16 S-XBGA-B16 S-XBGA-B16
JESD-609代码 - e3 - e3 e3 e0 e3
长度 - 5 mm - 5 mm 5 mm 2.02 mm 2.02 mm
信道数量 - 1 - 1 1 1 1
功能数量 - 2 - 2 2 4 4
端子数量 - 14 - 14 16 16 16
标称断态隔离度 - 72 dB - 72 dB 72 dB 72 dB 72 dB
通态电阻匹配规范 - 0.2 Ω - 0.2 Ω 0.2 Ω 0.2 Ω 0.2 Ω
最大通态电阻 (Ron) - 50 Ω - 50 Ω 50 Ω 50 Ω 50 Ω
最高工作温度 - 85 °C - 85 °C 85 °C 85 °C 85 °C
最低工作温度 - -40 °C - -40 °C -40 °C -40 °C -40 °C
封装主体材料 - PLASTIC/EPOXY - PLASTIC/EPOXY UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装代码 - TSSOP - TSSOP HVQCCN VFBGA VFBGA
封装等效代码 - TSSOP14,.25 - TSSOP14,.25 LCC16,.16SQ,25 BGA16,4X4,20 BGA16,4X4,20
封装形状 - RECTANGULAR - RECTANGULAR SQUARE SQUARE SQUARE
封装形式 - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
电源 - 3/5 V - 3/5 V 3/5 V 3/5 V 3/5 V
认证状态 - Not Qualified - Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 - 1.1 mm - 1.1 mm 0.8 mm 0.67 mm 0.67 mm
最大供电电压 (Vsup) - 11 V - 11 V 11 V 11 V 11 V
最小供电电压 (Vsup) - 2 V - 2 V 2 V 2 V 2 V
标称供电电压 (Vsup) - 3 V - 3 V 3 V 3 V 3 V
表面贴装 - YES - YES YES YES YES
最长断开时间 - 60 ns - 60 ns 60 ns 60 ns 60 ns
最长接通时间 - 150 ns - 150 ns 150 ns 150 ns 150 ns
切换 - BREAK-BEFORE-MAKE - BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
技术 - CMOS - CMOS CMOS CMOS CMOS
温度等级 - INDUSTRIAL - INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 - GULL WING - GULL WING NO LEAD BALL BALL
端子节距 - 0.65 mm - 0.65 mm 0.8 mm 0.5 mm 0.5 mm
端子位置 - DUAL - DUAL QUAD BOTTOM BOTTOM
宽度 - 4.4 mm - 4.4 mm 5 mm 2.02 mm 2.02 mm

 
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