AT89C51RD2 / AT89C51ED2 QualPack
1 Table of contents
1
2
3
TABLE OF CONTENTS............................................................................................................................................. 2
GENERAL INFORMATION...................................................................................................................................... 3
TECHNOLOGY INFORMATION ............................................................................................................................ 4
3.1
3.2
3.3
W
AFER
P
ROCESS
T
ECHNOLOGY
.............................................................................................................................. 4
P
RODUCT
D
ESIGN
................................................................................................................................................... 5
D
EVICE CROSS SECTION
.......................................................................................................................................... 6
4
QUALIFICATION ...................................................................................................................................................... 7
4.1
Q
UALIFICATION
M
ETHODOLOGY
............................................................................................................................ 7
4.2
Q
UALIFICATION
T
EST
M
ETHODS
............................................................................................................................. 8
4.3
W
AFER
L
EVEL
R
ELIABILITY
................................................................................................................................... 9
4.3.1 Electromigration ............................................................................................................................................... 9
4.3.2 Hot Carriers Injection ..................................................................................................................................... 11
4.3.3 Time Dependent Dielectric Breakdown ............................................................................................................ 12
4.3.4 FLASH Characteristics.................................................................................................................................... 14
4.4
D
EVICE
R
ELIABILITY
............................................................................................................................................ 18
4.4.1 Operating Life Testing..................................................................................................................................... 18
4.4.2 ESD / Latch-up................................................................................................................................................ 18
4.4.3 FLASH and EEPROM Data Retention and Endurance Cycling ........................................................................ 18
4.4.4 AT89C51ED2 Operating Reliability Calculation.............................................................................................. 20
4.5
AT89C51ED2 P
ACKAGING RELIABILITY
............................................................................................................... 21
4.6
AT89C51ED2 Q
UALIFICATION STATUS
................................................................................................................ 21
5
6
ENVIRONMENTAL INFORMATION .................................................................................................................... 22
OTHER DATA .......................................................................................................................................................... 23
6.1
6.2
6.3
ISO / TS16949 : 2002 C
ERTIFICATE
..................................................................................................................... 23
D
ATA
B
OOK
R
EFERENCE
...................................................................................................................................... 24
R
EVISION
H
ISTORY
.............................................................................................................................................. 24
2
Rev. 0 – 2003 July
AT89C51RD2 / AT89C51ED2 QualPack
2 General Information
Product Name:
Function:
Product Name:
Function:
AT89C51RD2
8-bit Microcontroller with 64 Kbytes FLASH
SPI Interface
AT89C51E2
8-bit Microcontroller with 64 Kbytes FLASH, 2 Kbytes EEPROM
SPI Interface
Wafer Process:
Available Package Types
Other Forms:
Locations:
Process Development,
Product Development
Wafer Plant
QC Responsibility
Probe Test
Assembly
Final Test
Lot Release
Shipment Control
Quality Assurance
Reliability Testing
Failure Analysis
Logic CMOS 0.35 um with embedded FLASH
PLCC 44, VQFP 44, PLCC 68, VQFP 68 ,PDIL 40
Die, Wafer
Atmel Colorado Springs, USA
Atmel Nantes, France
Atmel Colorado Springs, USA
Atmel Nantes, France
Atmel Colorado Springs, USA
Depending on package
Atmel TSTI Manila, Philippines
Atmel Nantes, France
Global Logistic Center, Philippines
Atmel Nantes, France
Atmel Nantes, France
Atmel Nantes, France
Quality Management
Atmel Nantes, France
Signed: Pascal LECUYER
Rev. 0 – 2003 July
3