电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

TAZD105K035LBMB0800

产品描述Tantalum Capacitors - Solid SMD
产品类别无源元件    电容器   
文件大小382KB,共14页
制造商AVX
下载文档 详细参数 全文预览

TAZD105K035LBMB0800在线购买

供应商 器件名称 价格 最低购买 库存  
TAZD105K035LBMB0800 - - 点击查看 点击购买

TAZD105K035LBMB0800概述

Tantalum Capacitors - Solid SMD

TAZD105K035LBMB0800规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称AVX
包装说明, 1510
Reach Compliance Codenot_compliant
ECCN代码EAR99
电容1 µF
电容器类型TANTALUM CAPACITOR
介电材料TANTALUM (DRY/SOLID)
ESR2200 mΩ
高度1.27 mm
JESD-609代码e0
长度3.81 mm
制造商序列号TAZ
负容差10%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形式SMT
包装方法Bulk
极性POLARIZED
正容差10%
额定(直流)电压(URdc)35 V
参考标准MIL-PRF-55365/11
系列TAZ
尺寸代码1510
端子面层Tin/Lead (Sn/Pb) - hot dipped
宽度2.54 mm

文档预览

下载PDF文档
TAZ Series
CWR09 - MIL-PRF-55365/4
Established Reliability, COTS-Plus & Space Level
All 4V to 50V ratings are qualified to
MIL-PRF-55365 Weibull “B”, “C”, “D” and “T”
levels, with all surge options (“A”, “B” & “C”)
available.
For Space Level applications, AVX SRC 9000
qualification is recommended (see ratings table
for part number availability).
There are four termination finishes available:
solder plated, fused solder plated, hot solder
dipped and gold plated (these are “H”, “K”, “C”
and “B” termination, respectively, per MIL-PRF-
55365). In addition, the molding compound has
been selected to meet the requirements of
UL94V-0 (Flame Retardancy) and outgassing
requirements of ASTM E-595.
For moisture sensitivity levels please refer to the
High Reliability Tantalum MSL section located in
the back of the High Reliability Tantalum Catalog.
This is the original high reliability molded
tantalum chip series and the case sizes still
represent the most flexible of surface mount
form factors. TAZ offers nine case sizes, eight of
which (A through H) are fully qualified to MIL-
PRF-55365/4, and also includes the original
sub-miniature R case (non-QPL).
This series is fully interchangeable with CWR06
conformal types, while offering the advantages of
molded body/compliant termination construction
(ensuring no TCE mismatch with any substrate).
This construction is compatible with a wide range
of SMT board assembly processes including
wave or reflow solder, conductive epoxy or com-
pression bonding techniques.
The parts also carry full polarity and
capacitance / voltage marking. The five smaller
cases are characterized by their low profile
construction, with the A case being the world’s
smallest molded military tantalum chip.
CASE DIMENSIONS:
Case
Length (L)
Width (W)
Height (H)
Code ±0.38 (0.015) ±0.38 (0.015) ±0.38 (0.015)
Term. Width (W
1
)
1.27±0.13
(0.050±0.005)
1.27±0.13
(0.050±0.005)
1.27±0.13
(0.050±0.005)
2.41+0.13/-0.25
(0.095+0.005/-0.010)
2.41+0.13/-0.25
(0.095+0.005/-0.010)
3.30±0.13
(0.130±0.005)
2.67±0.13
(0.105±0.005)
3.68+0.13/-0.51
(0.145+0.005/-0.020)
1.0±0.10
(0.039±0.004)
millimeters (inches)
Term. Length (A)
+0.25/-0.13
(+0.010/-0.005)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
1.27 (0.050)
1.27 (0.050)
0.50 (0.020)
+0.30 (0.012)
-0.20 (0.008)
S min
0.38
(0.015)
1.65
(0.065)
2.92
(0.115)
1.65
(0.065)
2.92
(0.115)
3.43
(0.135)
3.56
(0.140)
4.06
(0.160)
0.71
(0.028)
Typical
Weight (g)
0.016
0.025
0.035
0.045
0.065
0.125
0.205
0.335
0.010
MARKING
(White marking on black body)
Polarity Stripe (+)
Capacitance Code
Rated Voltage
A
B
C
D
E
F
G
H
R
2.54 (0.100)
3.81 (0.150)
5.08 (0.200)
3.81 (0.150)
5.08 (0.200)
5.59 (0.220)
6.73 (0.265)
7.24 (0.285)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
2.54 (0.100)
2.54 (0.100)
3.43 (0.135)
2.79 (0.110)
3.81 (0.150)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
1.78 (0.070)
2.79 (0.110)
2.79 (0.110)
1.20 (0.047)
max
1.30 (0.051)
2.05 (0.081) +0.20 (0.008)
±0.20 (0.008) -0.10 (0.004)
CWR09 MIL-PRF-55365/4
CAPACITANCE AND RATED VOLTAGE, V
R
(VOLTAGE CODE) RANGE (LETTER DENOTES CASE SIZE)
Capacitance
μF
Code
0.10
104
0.15
154
0.22
224
0.33
334
0.47
474
0.68
684
1.0
105
1.5
155
2.2
225
3.3
335
4.7
475
6.8
685
10
106
15
156
22
226
33
336
47
476
68
686
100
107
4V (C)
6V (D)
10V (F)
Rated Voltage DC (V
R
) at 85ºC
15V (H)
20V (J)
25V (K)
35V (M)
50V (N)
A
A
B
B
C
D
E
F
F
G
H
A
R
R
R
A
A/R
A
A/R
B
C
D
E
F
G
H
G
H
B
C
D
E
F
G
H
B
C
D
E
F
G
H
B
C
D
E
F
G
H
A
A
B
B
C
D
E
F
B
C
D
E
F
G
G
H
B
C
D
E
F
G
H
8
我的单片机开发之路(二)
在掌握了Keil和Protel 99以后我就正式入行了。先前我主要的工作是开发8051的汇编程序,公司主要产品是IC卡读写器(非CPU卡,使用IIC总线),那时如果会IIC总线和驱动128x64液晶就可以独挡一面了, ......
bigbat 工作这点儿事
uclinux下s3c4510b,flash为39vf160,如何才能知道flash中空闲地址?
希望能在用户程序中对flash读写数据,可是查看资料后 也不明白代码怎么存放,写了原有数据就启动不了了。uclinux下flash开始地址 FLASH_MEM_BASE=0x01000000,FLASH_SIZE=0x00200000. 而且修改 ......
joy.zhou Linux开发
Iar for ARM(Cortex-M3)的汇编语法
想学一下IAR FOR ARM ,Cortex-M3的汇编,但是不知道这个编译器的汇编语法是怎么弄得,上IAR官网找了半天也没好找不到相关资料。谁能帮忙发个相关的资料或者是给个下载地址。...
lr2131 ARM技术
LED发光二极管的结构组成
一、支架:   1)、支架的作用:用来导电和支撑   2)、支架的组成:支架由支架素材经过电镀而形成,由里到外是素材、铜、镍、铜、银这五层所组成。   3)、支架的种类:带杯支架做聚 ......
咖啡不加糖 模拟电子
“山寨机之父”联发科参与TD标准制定
本帖最后由 jameswangsynnex 于 2015-3-3 19:59 编辑 转自---高工在线 1月19日消息,有“山寨机之父”之称的联发科与工信部旗下泰尔实验室最近签订战略联盟合约,携手推广自主研发3G标准TD-SCD ......
gaogong 消费电子
这个帖让我笑得不行了~~
https://bbs.eeworld.com.cn/thread-95398-2-1.html 但又没法回复 哎 哈哈哈哈哈哈...
soso 聊聊、笑笑、闹闹

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1692  1401  2435  1281  409  31  59  15  34  14 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved