1 Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 Vrms, 0.0 Adc
2 Irms: DC current for an approximate
ΔT
rise of 40 °C without core loss. Derating is necessary for
AC currents. PCB layout, trace thickness and width, air-flow and proximity of other heat generat-
ing components will affect the temperature rise. It is recommended the part temperature not
exceed
+125
°C under worst case operating conditions verified in the end application.
3 Isat: Peak current for approximately 7.5% rolloff at
+25
°C.
4 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L *
ΔI
, Bp-p: (Gauss),
K: (K-factor from table), L: (inductance in
μH), ΔI
(peak-to-peak ripple current in amps).
6 Part Number Definition: UP2CU-xxx-R
• UP2CU = Product code and size
• xxx= Inductance value in
μH,
R = decimal point. If no R is present, then third digit
equals the number of zeros.
• “-R” suffix = RoHS compliant
Dimensions-mm
Top V iew
9.3
±0.2
S ide V iew
5.21
m ax
2.54
±0.2
B ottom V iew
R ecom m ended P ad Layout
2.79
ref
S chem atic
12.7
±0.25
U P 2U C -
xxx
w w llyy R
1
2
Part Marking: UP2UC
1
8.4
±0.15
2.54
±0.2
7.62 typ
7.62
ref
2
2.92
ref
xxx = Inductance value in
μH
(R = Decimal point). If no “R” is present, then the third digit equals the number of zeros.
wwllyy = Date code
R = Revision level
Tolerances are ±0.254 mm unless otherwise specified.
Do not route traces or vias underneath the inductor
Packaging information-mm
Supplied in tape-and-reel packaging, 600 parts per reel, 13” diameter reel.
4.0
2.0
16
1.5 dia.
1.75
11.5
24 ±0.30
13.4
UP2UC-
xxx
wwllyy R
UP2UC-
xxx
wwllyy R
UP2UC-
xxx
wwllyy R
5.5
Section A-A
4.40
User direction of feed
9.70
2
www.eaton.com/electronics
UP2UC
UNI-PAC™ drum core power inductors
Temperature rise vs total loss
60
Effective
August
2017
Technical Data
4369
T e m p e ra tu re R is e (°C )
50
40
30
20
10
0
0
0 .1
0 .2
0 .3
0 .4
0 .5
0 .6
To ta l L o s s (W )
Core loss
vs Bp-p
C o r e Lo s s v s . Bp - p
10
5 0 0 kHz
4 0 0 kHz
3 0 0 kHz
2 0 0 kHz
1 0 0 kHz
1
C o re L o ss (W )
0 .1
0 .0 1
0 .0 0 1
0 .0 0 0 1
0 .0 0 0 0 1
100
1000
10000
B
p-p
(Gauss)
Inductance characteristics
% of O C L v s I
s a t
110%
100%
90%
80%
-4 0 °C
+2 5 °C
+8 5 °C
% of OC L
70%
60%
50%
40%
30%
20%
10%
100%
120%
140%
160%
% o f I
s at
180%
20%
40%
60%
80%
0%
0%
www.eaton.com/electronics
3
Technical Data
4369
Effective
August
2017
UP2UC
UNI-PAC™ drum core power inductors
Solder Reflow Profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
T
ab
l
e
1 -
S
t
a
n
da
r
d S
nP
b S
ol
de
r (T c)
Package
Thickness
<2.5mm
_
>2.5mm
Volume
mm
3
<350
235°C
220°C
Volume
mm
3
_
>350
220°C
220°C
Temperature
T
smax
T
ab
l
e
2 - L
ead
(P
b
) Fr
ee S
ol
de
r (T c)
T
smin
t
s
Package
Thickness
<1.6mm
1.6 – 2.5mm
>2.5mm
Time
Volume
mm
3
<350
260°C
260°C
250°C
Volume
mm
3
350 - 2000
260°C
250°C
245°C
Volume
mm
3
>2000
260°C
245°C
245°C
25°C
Time 25°C to Peak
Reference JDEC J-STD-020
Profile Feature
Preheat
and Soak
• T
e
mperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
L
)
Time
at
liquidous (tL)
Peak package
body
temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Standard SnPb Solder
100°C
150°C
60-120 Seconds
3°C/
Second
Max.
183°C
60-150 Seconds
Table 1
20
Seconds**
6°C/ Second
Max.
6
Minutes Max.
Lead (Pb) Free Solder
150°C
200°C
60-120 Seconds
3°C/
Second
Max.
217°C
60-150 Seconds
T
able
2
30
Seconds**
6°C/ Second
Max.
8 Minutes Max.
*
Tolerance for peak profile temperature (Tp) is
defined as a
supplier minimum
and a
user maximum.
**
Tolerance for time
at
peak profile temperature (tp) is
defined as a
supplier minimum
and a
user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
据外媒报道，萨里大学（University of Surrey）的研究人员开发出一种无需依赖GPS即可在人口密集的城市地区精确定位设备位置的人工智能系统。该系统可将定位误差从734米缩小到22米以内，这对于自动驾驶汽车和救援车辆等技术的发展意义重大。 图片来源： 萨里大学 在发表于《IEEE Robotics and Automation Letters》的论文中，研究人员介绍了PEn...[详细]
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