2. Unique construction with no plastic material provides superior
soldering heat resistance to maintain excellent characteristic
performance after reflow soldering.
3. Designed for automatic placement in surface mount pplications.
4. Funnel shaped metal case enables in-process automatic
adjustment.
Packaging Information
Packaging
R00
Specifications
180mm Embossed Tape
Minimum
Order Quantity
2000
1 of 3
Atten ti o n
1.This datasheet is downloaded from the website of Murata Manufacturing Co., Ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued
without advance notice. Please check with our sales representatives or product engineers before ordering.
2.This datasheet has only typical specifications because there is no space for detailed specifications.
Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
URL : https://www.murata.com/
Last updated
:
2018/05/19
Product Search Data Sheet
Note: This datasheet may be out of date.
Please download the latest datasheet of TZV2R200A110R00 from the official website of Murata Manufacturing
1.This datasheet is downloaded from the website of Murata Manufacturing Co., Ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued
without advance notice. Please check with our sales representatives or product engineers before ordering.
2.This datasheet has only typical specifications because there is no space for detailed specifications.
Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
URL : https://www.murata.com/
Last updated
:
2018/05/19
Product Search Data Sheet
Note: This datasheet may be out of date.
Please download the latest datasheet of TZV2R200A110R00 from the official website of Murata Manufacturing
1.This datasheet is downloaded from the website of Murata Manufacturing Co., Ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued
without advance notice. Please check with our sales representatives or product engineers before ordering.
2.This datasheet has only typical specifications because there is no space for detailed specifications.
Therefore, please review our product specifications or consult the approval sheet for product specifications before ordering.
语音作为自然的人机接口,可以使车载导航系统实现更安全、更人性化的操作。通过国内外车载导航系统的功能对比可知,支持语音交互是车载导航系统的一个发展趋势。另外,市场信息服务公司J.D Power and Associates的调研数据也表明,56%的消费者更倾向于选择声控的导航系统。因此,开发车载语音导航系统是很有意义的。目前,国内已经具备开发车载语音导航系统的技术基础,特别是文语转换TTS技术...[详细]
在全球半导体产业因景气不佳而纷传并购、整合之际,两大IT巨头三星、IBM日前却双双宣布,将强化半导体产业投资。 三星电子本周一宣布,已向韩国证券交易所提交一份申请文件,打算2008年投下10.5亿美元,用于升级内存芯片生产线、改进技术工艺,从而提高产能并降低成本。无独有偶。本周二IBM公司宣布,未来3年将投资10亿美元,用于扩充位于纽约州 East Fishkill 的半导体工厂,以消...[详细]