rise of 40°C without core loss. Derating is necessary for AC currents. PCB
layout, trace thickness and width, air-flow and proximity of other heat generat- ing components will affect the
temperature rise. It is recommended the part temperature not exceed 125°C under worst case operating conditions
verified in the end application.
3. Isat: Peak current for approximately 10% rolloff at 25°C.
4. K-factor:UsedtodetermineBp-pforcoreloss(seegraph).Bp-p=K*L*ΔI,Bp-p:(Gauss), K: (K-factor from table),
L: (inductance in μH),
ΔI
(peak-to-peak ripple current in amps).
5. Part Number Definition: UP5-xxx-R
• UP5 = Product code and size
• xxx= Inductance value in μH, R = decimal point. If no R is present, then third digit equals the number of zeros.
• “-R” suffix = RoHS compliant
Dimensions (mm)
±
±
xxx = Inductance value in μH (R = Decimal point).
If no “R” is present, then the third digit equals the number of zeros.
wwllyy = Date code R = Revision level
2
www.eaton.com/elx
UP5
High power, drum inductors
Packaging information
Supplied in tape-and-reel packaging, 250 parts per reel, 13” diameter reel.
Technical Data
4409
Effective December 2015
±
Temperature rise vs. total loss
60
50
Temerature Rise (°C)
40
30
20
10
0
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
Total Loss (W)
www.eaton.com/elx
3
Technical Data
4409
Effective December 2015
UP5
High power, drum inductors
Core loss
Core Loss vs. Bp-p
1
300kHz
0.1
200kHz
100kHz
Core Loss (W)
0.01
0.001
100
1000
10000
Bp-p (Gauss)
Inductance characteristics
110%
100%
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
% of OCL vs. I
sat
% of OCL
-40°C
+25°C
+85°C
100%
120%
140%
160%
180%
% of I
sat
4
www.eaton.com/elx
200%
20%
40%
60%
80%
0%
UP5
High power, drum inductors
Solder reflow profile
T
P
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
T
L
Preheat
A
t
t
P
T
C
-5°C
Technical Data
4409
Effective December 2015
Table 1 - Standard SnPb Solder (Tc)
Package
Thickness
Volume
mm3
<350
Volume
mm3
≥350
<2.5mm)
≥2.5mm
T
smax
235°C
220°C
220°C
220°C
Temperature
Table 2 - Lead (Pb) Free Solder (Tc)
T
smin
t
s
Package
Thickness
Volume
mm
3
<350
Volume
mm
3
350 - 2000
Volume
mm
3
>2000
<1.6mm
1.6 – 2.5mm
>2.5mm
25°C
Time 25°C to Peak
260°C
260°C
250°C
260°C
250°C
245°C
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Standard SnPb Solder
Lead (Pb) Free Solder
Preheat and Soak
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
100°C
150°C
60-120 Seconds
3°C/ Second Max.
183°C
60-150 Seconds
Table 1
20 Seconds**
6°C/ Second Max.
6 Minutes Max.
150°C
200°C
60-120 Seconds
3°C/ Second Max.
217°C
60-150 Seconds
Table 2
30 Seconds**
6°C/ Second Max.
8 Minutes Max.
Average ramp up rate Tsmax to Tp
Liquidous temperature (T
l
)
Time at liquidous (tL)
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written
approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly
used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.
Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also
reserves the right to change or update, without notice, any technical information contained in this bulletin.
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