* Absolute maximum continuous ratings are those values beyond which damage to the device
may occur. Exposure to these conditions or conditions beyond those indicated may adversely
affect device reliability. Functional operation under absolute–maximum–rated conditions is not
implied.
†Derating — SOIC Packages: – 7 mW/
_
C from 65
_
to 125
_
C
TSSOP Package: – 6.1 mW/
_
C from 65
_
to 125
_
C
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MC74VHC04
MAXIMUM RATINGS*
Symbol
VCC
Vout
Tstg
ICC
IOK
Iout
Vin
PD
IIK
Storage Temperature
Power Dissipation in Still Air,
DC Supply Current, VCC and GND Pins
DC Output Current, per Pin
Output Diode Current
Input Diode Current
DC Output Voltage
DC Input Voltage
DC Supply Voltage
Parameter
SOIC Packages†
TSSOP Package†
–0.5 to VCC + 0.5
– 65 to + 150
–0.5 to + 7.0
–0.5 to + 7.0
Value
±
50
±
25
±
20
500
450
–20
Unit
mW
mA
mA
mA
mA
DC ELECTRICAL CHARACTERISTICS
RECOMMENDED OPERATING CONDITIONS
MOTOROLA
Symbol
S b l
Symbol
VOH
VCC
VOL
Vout
VIH
tr, tf
VIL
Vin
TA
Maximum Low–Level
Output Voltage
Minimum High–Level
Output Voltage
Maximum Low–Level
Input Voltage
Minimum High–Level
Input Voltage
Input Rise and Fall Time
Operating Temperature
DC Output Voltage
DC Input Voltage
DC Supply Voltage
Parameter
P
Parameter
Vin = VIH or VIL
IOL = 4mA
IOL = 8mA
Vin = VIH or VIL
IOL = 50µA
Vin = VIH or VIL
IOH = –4mA
IOH = –8mA
Vin = VIH or VIL
IOH = –50µA
Test C di i
T
Conditions
VCC = 3.3V
±0.3V
VCC = 5.0V
±0.5V
2.0
3.0 to
5.5
2.0
3.0 to
5.5
VCC
V
3.0
4.5
2.0
3.0
4.5
3.0
4.5
2.0
3.0
4.5
2
Min
–40
2.0
0
0
0
0
1.50
VCC x 0.7
2.58
3.94
Min
1.9
2.9
4.4
VCC
+ 85
Max
100
20
5.5
5.5
TA = 25°C
ns/V
Unit
_
C
_
C
Typ
V
V
V
V
V
V
0.0
0.0
0.0
2.0
3.0
4.5
0.50
VCC x 0.3
0.36
0.36
Max
0.1
0.1
0.1
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND (Vin or Vout) VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or V CC ).
Unused outputs must be left open.
VHC Data – Advanced CMOS Logic
DL203 — Rev 1
1.50
VCC x 0.7
TA = –40 to 85°C
2.48
3.80
Min
1.9
2.9
4.4
v
0.50
VCC x 0.3
0.44
0.44
Max
0.1
0.1
0.1
v
Unit
U i
V
V
V
V
MC74VHC04
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DC ELECTRICAL CHARACTERISTICS
Symbol
Iin
Parameter
Test Conditions
VCC
V
TA = 25°C
Typ
TA = –40 to 85°C
Min
Max
Min
Max
Unit
µA
µA
Maximum Input
Leakage Current
Vin = 5.5 or GND
0 to 5.5
5.5
±
0.1
2.0
±
0.1
20.0
ICC
Maximum Quiescent
Supply Current
Vin = VCC or GND
AC ELECTRICAL CHARACTERISTICS
(Input tr = tf = 3.0ns)
Symbol
S b l
tPLH,
tPHL
Parameter
P
TA = 25°C
Typ
5.0
7.5
3.8
5.3
4
TA = –40 to 85°C
Min
1.0
1.0
1.0
1.0
Max
Test C di i
T
Conditions
Min
Max
Unit
U i
ns
Maximum Propagation Delay,
A or B to Y
VCC = 3.3
±
0.3V
VCC = 5.0
±
0.5V
CL = 15pF
CL = 50pF
CL = 15pF
CL = 50pF
7.1
10.6
5.5
7.5
10
8.5
12.0
6.5
8.5
10
Cin
Maximum Input Capacitance
pF
Typical @ 25°C, VCC = 5.0V
18
CPD
Power Dissipation C
P
Di i i Capacitance (P I
i
(Per Inverter) (N
) (Note 1.)
1)
pF
F
1. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: ICC(OPR
)
= CPD
VCC
fin + ICC / 6 (per buffer). CPD is used to determine the no–load
dynamic power consumption; PD = CPD
VCC2
fin + ICC
VCC.
NOISE CHARACTERISTICS
(Input tr = tf = 3.0ns, CL = 50pF, VCC = 5.0V)
TA = 25°C
Symbol
S b l
VOLP
VOLV
VIHD
VILD
Characteristic
Ch
i i
Quiet Output Maximum Dynamic VOL
Quiet Output Minimum Dynamic VOL
Minimum High Level Dynamic Input Voltage
Maximum Low Level Dynamic Input Voltage
Typ
0.4
–0.4
Max
0.8
–0.8
3.5
1.5
TEST POINT
A
50%
GND
tPLH
Y
50% VCC
* Includes all probe and jig capacitance
tPHL
VCC
DEVICE
UNDER
TEST
OUTPUT
CL*
Unit
U i
V
V
V
V
Figure 1. Switching Waveforms
Figure 2. Test Circuit
INPUT
Figure 3. Input Equivalent Circuit
VHC Data – Advanced CMOS Logic
DL203 — Rev 1
3
MOTOROLA
MC74VHC04
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
–A–
14
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–B–
1
7
P
7 PL
0.25 (0.010)
M
B
M
G
C
R
X 45°
F
SEATING
PLANE
D
14 PL
K
M
M
B
S
J
0.25 (0.010)
T
A
S
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
8.75
8.55
4.00
3.80
1.75
1.35
0.49
0.35
1.25
0.40
1.27 BSC
0.25
0.19
0.25
0.10
7°
0°
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
7°
0°
0.228 0.244
0.010 0.019
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948G–01
ISSUE O
14X
K
REF
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,
PROTRUSIONS OR GATE BURRS. MOLD FLASH
OR GATE BURRS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN
EXCESS OF THE K DIMENSION AT MAXIMUM
MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED
AT DATUM PLANE –W–.
DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
–––
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.50
0.60
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0
_
8
_
INCHES
MIN
MAX
0.193
0.200
0.169
0.177
–––
0.047
0.002
0.006
0.020
0.030
0.026 BSC
0.020
0.024
0.004
0.008
0.004
0.006
0.007
0.012
0.007
0.010
0.252 BSC
0
_
8
_
0.10 (0.004)
0.15 (0.006) T U
S
M
T U
S
V
S
N
2X
L/2
14
8
0.25 (0.010)
M
L
PIN 1
IDENT.
1
7
B
–U–
N
F
DETAIL E
K
K1
J J1
0.15 (0.006) T U
S
A
–V–
SECTION N–N
–W–
C
0.10 (0.004)
–T–
SEATING
PLANE
D
G
H
DETAIL E
MOTOROLA
4
ÉÉÉ
ÇÇÇ
ÉÉÉ
ÇÇÇ
VHC Data – Advanced CMOS Logic
DL203 — Rev 1
MC74VHC04
OUTLINE DIMENSIONS
M SUFFIX
PLASTIC SOIC EIAJ PACKAGE
CASE 965–01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS AND ARE MEASURED
AT THE PARTING LINE. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
A
A1
b
c
D
E
e
HE
0.50
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
–––
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10
_
0
_
0.70
0.90
–––
1.42
INCHES
MIN
MAX
–––
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10
_
0
_
0.028
0.035
–––
0.056
14
8
LE
Q1
E HE
M
_
L
DETAIL P
1
7
Z
D
e
A
VIEW P
c
b
0.13 (0.005)
M
A1
0.10 (0.004)
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specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
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Opportunity/Affirmative Action Employer.
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