CM1401-03
4-Channel ESD/EMI Filter
Array Plus 4-Channel ESD
Array for USB
Product Description
The CM1401−03 is a multichannel array with four low−pass filter
+ ESD channels and four ESD−only channels. The CM1401−03
reduces EMI/RFI emissions on a data port and protects against ESD on
a USB port. Each EMI/RFI channel integrates a high quality pi−style
filter (C−R−C) that provides greater than 30 dB attenuation in the
800−2700 MHz range relative to the pass band attenuation. These
pi−style filters are bidirectional, controlling EMI both to and from a
data port connector.
The CM1401−03 provides a high−level of ESD protection on all
eight channels for sensitive electronic components that may be
subjected to electrostatic discharge (ESD). The input pins safely
dissipate ESD strikes of
±15
kV, exceeding the maximum requirement
of the IEC 61000−4−2 international standard. Using the
MIL−STD−883 (Method 3015) specification for Human Body Model
(HBM) ESD, the device provides protection for contact discharges to
greater than
±30
kV.
The CM1401−03 is particularly well suited for portable electronics
(e.g., cellular telephones, PDAs, notebook computers) because of its
small package footprint and low weight.
The CM1401−03 incorporates
OptiGuardt
coating for improved
reliability at assembly and comes in a space−saving, low−profile Chip
Scale Package with RoHS−compliant lead−free finishing.
Features
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WLCSP15
CP SUFFIX
CASE 567BS
MARKING DIAGRAM
N013 MG
G
N013
= CM1401−03CP
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
CM1401−03CP
Package
CSP−15
(Pb−Free)
Shipping
†
3500/Tape & Reel
•
•
•
•
•
•
•
•
•
•
•
Functionally and Pin−Compatible with CSPEMI307A Device
OptiGuardt
Coated for Improved Reliability at Assembly
Four Channels of Combined EMI/RFI Filtering + ESD Protection
Four Additional Channels of ESD−Only Protection
40 dB Absolute Attenuation (Typical) at 1 GHz
35 dB Attenuation (Typical) at 1 GHz Relative to Pass Band
±15
kV ESD Protection on All Channels
(IEC 61000−4−2 Level 4, Contact Discharge)
±30
kV ESD Protection on All Channels (HBM)
15−Bump, 2.960 mm X 1.330 mm Footprint
Chip Scale Package (CSP) Features Extremely Low Lead Inductance
for Optimum Filter and ESD Performance
These Devices are Pb−Free and are RoHS Compliant
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Applications
•
EMI Filtering and ESD Protection for Both Data and
I/O Ports
•
Outer Four Channels Provide ESD Protection for
USB Lines and Other I/O Port Applications
•
Wireless Handsets
©
Semiconductor Components Industries, LLC, 2011
•
•
•
•
Handheld PCs / PDAs
MP3 Players
Notebooks
Desktop PCs
March, 2011
−
Rev. 4
1
Publication Order Number:
CM1401−03/D
CM1401−03
BLOCK DIAGRAM
100
W
FILTER + ESDn*
30 pF
30 pF
FILTER + ESDn*
ESDn*
30 pF
GND
(Pins B1−B3)
1 of 4 EMI/RFI + ESD Channels.
*See Package/Pinout Diagram for expanded pin information.
1 of 4 ESD−only Channels
Table 1. PIN DESCRIPTIONS
15−bump CSP Package
Pin
A1
A2
A3
A4
A5
A6
B1−B3
C1
C2
C3
C4
C5
C6
Name
ESD_1
FILTER + ESD_1
FILTER + ESD_2
FILTER + ESD_3
FILTER + ESD_4
ESD_2
GND
ESD_3
FILTER + ESD_1
FILTER + ESD_2
FILTER + ESD_3
FILTER + ESD_4
ESD_4
Description
ESD Channel 1
Filter + ESD Channel 1
Filter + ESD Channel 2
Filter + ESD Channel 3
Filter + ESD Channel 4
ESD Channel 2
Device Ground
ESD Channel 3
Filter + ESD Channel 1
Filter + ESD Channel 2
Filter + ESD Channel 3
Filter + ESD Channel 4
ESD Channel 4
Orientation
Marking
C
B
Orientation
Marking
A
PACKAGE / PINOUT DIAGRAMS
Top View
(Bumps Down View)
+
1
2
3
4
5
6
N013
Bottom View
(Bumps Up View)
ESD_3
FILTER+ESD_2
FILTER+ESD_4
C1
GND
B1
ESD_1
C2
C3
GND
B2
C4
C5
GND
B3
C6
ESD_4
FILTER+ESD_1 FILTER+ESD_3
FILTER+ESD_2
FILTER+ESD_4
A1
A1
A2
A3
A4
A5
A6
ESD_2
FILTER+ESD_1 FILTER+ESD_3
CM1401−03
CSP Package
SPECIFICATIONS
Table 2. ABSOLUTE MAXIMUM RATINGS
Parameter
Storage Temperature Range
DC Power per Resistor
DC Package Power Rating
Rating
–65 to +150
100
600
Units
°C
mW
mW
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
Table 3. STANDARD OPERATING CONDITIONS
Parameter
Operating Temperature Range
Rating
–40 to +85
Units
°C
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2
CM1401−03
Table 4. ELECTRICAL OPERATING CHARACTERISTICS
(Note 1)
Symbol
R
C
TCR
TCC
V
DIODE
I
LEAK
V
SIG
Resistance
Capacitance
Temperature Coefficient of Resistance
Temperature Coefficient of Capacitance
Diode Voltage (reverse bias)
Diode Leakage Current (reverse bias)
Signal Voltage
Positive Clamp
Negative Clamp
In−system ESD Withstand Voltage
a) Human Body Model, MIL−STD−883,
Method 3015
b) Contact Discharge per IEC 61000−4−2
Level 4
Clamping Voltage during ESD Discharge
MIL−STD−883 (Method 3015), 8 kV
Positive Transients
Negative Transients
Cut−off Frequency
Z
SOURCE
= 50
W,
Z
LOAD
= 50
W
At 2.5 V DC
I
DIODE
= 10
mA
V
DIODE
= 3.3 V
I
LOAD
= 10 mA
5.6
−1.5
±30
±15
(Notes 2 and 3)
+10
–5
R = 100
W,
C = 30 pF
58
MHz
V
6.8
–0.8
At 2.5 V DC
Parameter
Conditions
Min
80
24
Typ
100
30
1200
−300
6.0
100
9.0
−0.4
Max
120
36
Units
W
pF
ppm/°C
ppm/°C
V
nA
V
V
ESD
(Note 2)
kV
V
CL
f
C
1. T
A
= 25°C unless otherwise specified.
2. ESD applied to input and output pins with respect to GND, one at a time.
3. Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A2, then clamping
voltage is measured at Pin C2.
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3
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