电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

CA064C151K4GACTU

产品描述Capacitor Arrays & Networks 16volts 150pF C0G 10%
产品类别无源元件   
文件大小2MB,共17页
制造商KEMET(基美)
官网地址http://www.kemet.com
标准
下载文档 详细参数 全文预览

CA064C151K4GACTU在线购买

供应商 器件名称 价格 最低购买 库存  
CA064C151K4GACTU - - 点击查看 点击购买

CA064C151K4GACTU概述

Capacitor Arrays & Networks 16volts 150pF C0G 10%

CA064C151K4GACTU规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
KEMET(基美)
产品种类
Product Category
Capacitor Arrays & Networks
RoHSDetails
端接类型
Termination Style
SMD/SMT
电容
Capacitance
150 pF
系列
Packaging
Cut Tape
系列
Packaging
MouseReel
系列
Packaging
Reel
电容-nF
Capacitance - nF
0.15 nF
工厂包装数量
Factory Pack Quantity
4000

文档预览

下载PDF文档
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Capacitor Array, C0G Dielectric, 10 – 200 VDC
(Commercial & Automotive Grade)
Overview
KEMET’s Ceramic Chip Capacitor Array in C0G dielectric is
an advanced passive technology, where multiple capacitor
elements are integrated into one common monolithic
structure. Array technology promotes reduced placement
costs and increased throughput. This is achieved by
alternatively placing one device rather than two or four
discrete devices. Use of capacitor arrays also saves board
space, which translates into increased board density and
more functions per board. Arrays consume only a portion
of the space required for standard chips, resulting in
savings in inventory and pick/place machine positions.
For added reliability, KEMET's Flexible Termination
technology has been incorporated in order to provide
superior flex performance. This technology was developed
to address flex cracks, which are the primary failure mode
of MLCCs and typically the result of excessive tensile
and shear stresses produced during board flexure and
thermal cycling. Flexible Termination technology inhibits
the transfer of board stress to the rigid body of the MLCC,
therefore mitigating flex cracks which can result in low IR
or short circuit failures.
KEMET’s C0G dielectric features a 125°C maximum
operating temperature and is considered “stable." The
Electronics Industries Alliance (EIA) characterizes C0G
dielectric as a Class I material. Components of this
classification are temperature compensating and are suited
for resonant circuit applications or those where Q and
stability of capacitance characteristics are required. C0G
exhibits no change in capacitance with respect to time and
voltage and boasts a negligible change in capacitance with
reference to ambient temperature. Capacitance change is
limited to ±30 ppm/°C from −55°C to +125°C.
KEMET automotive grade array capacitors meet the
demanding Automotive Electronics Council's AEC-Q200
qualification requirements.
Ordering Information
CA
06
4
X
104
K
4
Rated
Voltage
(VDC)
8 = 10
4 = 16
3 = 25
5 = 50
1 = 100
2 = 200
Click image above for interactive 3D content
Open PDF in Adobe Reader for full functionality
G
Dielectric
G = C0G
A
Failure
Rate/
Design
A = N/A
C
Termination Finish
2
C = 100% Matte Sn
L = SnPb
(5% minimum Pb
content)
TU
Packaging/
Grade (C-Spec)
See
"Packaging
C-Spec
Ordering
Options Table"
below
Ceramic
Case Size
Number of
Specification/
Capacitance Capacitance
Series
Code (pF)
Tolerance
Array
(L" x W")
1
Capacitors
06 = 0612
4=4
X = Flexible
Termination
Two
significant
digits +
number of
zeros
J = ±5%
K = ±10%
M = ±20%
All previous reference to metric case dimension "1632" has been replaced with an inch standard reference of "0612". Please reference all new designs
using the "0612" nomenclature. "CA064" replaces "C1632" in the ordering code.
2
Additional termination finish options may be available. Contact KEMET for details.
2
SnPb termination finish option is not available on automotive grade product.
1
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1016_C0G_ARRAY_SMD • 11/29/2017
1
给大家推荐新的PCB设计软件
自从EAGLE被AUTODESK收购,EAGLE得到了大刀阔斧的改进,现在都更新到V8.2.2版本了,新版本最大的改进就是加入了实时DRC,这样软件的易用性大大的提高,相信随着AUTODESK的不断改进,EAGLE很快就 ......
xiongpb PCB设计
MYZR-IMX6-CB336核心板
620914620913620915620916 ...
明远智睿01 NXP MCU
NEC d78f1203中文资料。
本帖最后由 paulhyde 于 2014-9-15 09:25 编辑 好像还没看到这个芯片的中文资料。 正好,我有。分享下。 也赚点钱了。 ...
chengang0103 电子竞赛
现在注册Flickr 网络相册有1TB超大免费空间
118203 把你拍的照片保存到这里是个不错的选择!...
qinkaiabc 聊聊、笑笑、闹闹
有知道深圳捷开通讯的吗?
如题...
liurse 嵌入式系统
SAM D21开发板试用心得+ 导入一个样例工程
通过USB线将电脑与开发板上的Debug接口连接起来,识别出EGDB调试器的多个设备。174859开始导入一个样例工程。点击欢迎页面的“New Example Project…”如下图174860出现样例工程选择对话框,在 ......
chen8710 单片机

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2420  2814  1749  1183  1574  18  41  38  30  23 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved