POWERFUL AND SMALL
conga-MA3
-
3
rd
Gen. Intel
®
Atom
™
| Intel
®
Celeron
®
processor family
-
COM Express Mini Type 10 module
-
High resolution Intel
®
Gen. 7 graphics
-
Temperature range up to -40°C .. +85°C
Formfactor
CPU
Formfactor COM Express
®
Mini | (55 x 84 mm) | Type 10
Intel
®
Atom
™
E3845
Intel
®
Atom
™
E3827
Intel
®
Atom
™
E3826
Intel
®
Atom
™
E3815
Intel
®
Celeron
®
N2807
Intel
®
Celeron
®
N2930
1.91GHz Quad Core
1.75GHz Dual Core
1.46GHz Dual Core
1.46GHz Single Core
1.58GHz Single Core
1.86GHz Quad Core
L2 cache 2MB
L2 cache 1MB
L2 cache 1MB
L2 cache 512kB
L2 cache 1MB
L2 cache 2MB
10W TDP
8W TDP
7W TDP
5W TDP
4.3W TDP
7.5W TDP
DRAM
Chipset
Onboard storage
Ethernet
I/O Interfaces
Sound
Graphics
LVDS
Digital Display Interface
congatec Board Controller
Embedded BIOS Features
Power Management
Operating Systems
Onboard DDR3L memory support for up to 8 GByte with 1333MT/s
Integrated in SoC
eMMC 4.51 interface | up to 64GB of MLC NAND | up to 4GB of SLC NAND
Intel I210 Gigabit Ethernet
Up to 4x PCIe x1 lanes with 5 Gb/s PCI Express 2.0 | 2x SATA 2.0 3Gb/s ports | 7x USB 2.0 | 1x USB 3.0 | LPC | SPI | I²C bus (fast mode 400 kHz,
multi-master) | SDIO
Digital High Definition Audio Interface
Intel
®
HD Graphics Gen 7 | Full hardware acceleration for MPEG2 | H.264 | DirectX11 | OCL 1.2 | OGL 3.2 | WMV9 and VC1
Single channel LVDS transmitter | support for flat panels with 1x18 bit/1x24 bit data mapping up to a resolution of 1920x1200@60Hz.
Displayport 1.1 up to 2560x1600 or HDMI 1.4a / DVI up to 1920x1200
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | BIOS Setup Data Backup
I²C bus (fast mode, 400 kHz, multi-master) | Power Loss Control
OEM Logo | OEM CMOS Defaults | LCD Control | Display Auto Detection | Backlight Control | Flash Update | based on AMI Aptio UEFI
ACPI 5.0 with battery support
Microsoft
®
Windows 10 | Microsoft
®
Windows 10 IoT Enterprise | Microsoft
®
Windows 10 IoT Core | Microsoft
®
Windows
®
8 |
Microsoft
®
Windows
®
7 | Linux | Microsoft
®
Windows
®
Embedded Standard | Microsoft
®
Windows
®
7 Embedded Compact |
Android | Yokto | MoonIsland / WindRiver IDP
Typ. application: see user’s guide for full details
Commercial : Operating: 0 to +60°C | Storage: -20 to +80°C
Industrial : Operating: -40 to +85°C | Storage: -45 to +85°C
Operating: 10 - 90% r. H. non cond. | Storage: 5 - 95% r. H. non cond.
55 x 84 mm (2.17” x 3.31”)
Power Consumption
Temperature
Humidity
Size
www.congatec.com
conga-MA3
| Block diagram
COM Express 2.1
Type 10
A-B Connector
DDIO
DDIO
eDP (Assembly Option)
Intel Bay Trail SoC
COMPUTE UNIT
PROCESSOR CORE
Tri-gate 3-D 22nm Quad core SoC
eDP1
VGA
X
conga-MA3
conga-MA3E
8 On-module DDR3L
(Up to 8GB)
LVDS/eDP
1x24bpp
LVDS
eDP to LVDS
MUX
1MB L2 cache shared by 2 cores
Core #1
Core #2
Core #4
AVX
VT-x
CH0
4 On-module DDR3L
(Up to 4GB)
PCIe Port 0
PCIe Port 1
PCIe Port 2
PCIe Port 3
Ethernet
MUX
PCIe to GBE
PCIe0 x1
PCIe1 x1
PCIe2 x1
PCIe3 x1
Core #3
SSE4.2
AES
CH1
SoC TRANSACTION ROUTER
DisplayPort
MPEG-2
H.264
LVDS
SAMU
MVC
MEMORY CONTROLLER
(1066 or 1333 MT/s)
high performance
low power
DISPLAY & GRAPHICS
Interfaces
HDMI/DVI
VGA
Multimedia Features
WMV9
SVC
DivX
WMV
4 On-module DDR3L
(Up to 4GB)
1333 MT/s, non-ECC
1 On-module DDR3L
(ECC module)
1333 MT/s, ECC
USB 3.0 Port 0
USB Port 0
USB Port 1
USB Port 5
USB Port 2 3 4 6
HDA I/F
SATA Port 0..1
BIOS Flash
USB
4 Port Hub
USB SuperSpeed 0
USB0 2.0
USB1 2.0
USB2 2.0
USB3 2.0
DirectX 11
OpenGL 3.0 OpenGLES 2.0
OpenCL 1.2
IMAGE PROCESSING
NOTE:
The conga-MA3 supports up to 4 GB single channel or
up to 8 GB dual channel non-ECC DDR3L-1333 MT/s.
The conga-MA3E supports up to 8 GB single channel
ECC DDR3L-1333 MT/s .
MIPI-CSI 2.0 Up to 24MP
ISP
Full HD
2x SATA 3G
INTEGRATED I/O
Integrated I/O Interfaces
SATA
USB 2.0
LPC Bus
SPI
USB 3.0
GPIOs
PCU
eMMC 4.5
eMMC Flash
(optional)
SPI Bus
2x UART
SDIO/GPIOs
LPC Bus
MUX
SPI
UART1,2
SDIO
PCIe
HD Audio
LPC
GPI/GPO
SM Bus
I2C Bus
LID#/SLEEP#
Fan Control
SM Bus
I2C
LID#/SLEEP#
FAN
congatec
Board Controller
conga-MA3
| Order Information
Article
conga-MA3/E3845-4G
eMMC8
conga-v MA3/E3827-2G
eMMC4
conga-MA3/E3826-2G
eMMC4
conga-MA3/E3815-2G
conga-MA3/N2930-2G
conga-MA3/N2807-2G
conga-MA3/i-E3845-4G
eMMC8
conga-MA3/i-E3827-2G
eMMC4
conga- MA3/i-E3845-2G
eMMC4
conga-MA3/i-E3815-2G
conga-MA30/HSP-T
conga-MA30/HSP-B
conga-MA30/CSP-T
conga-MA30/CSP-B
PN
047400
047401
047402
047404
047406
047407
047410
047411
047413
047414
047450
047451
047452
047453
Description
Intel
®
Atom
™
E3845 quad core processor with 1.91GHz | 2MB L2 cache | 4GB 1333MT/s DDR3L onboard memory and 8GB eMMC
onboard flash.
Intel
®
Atom
™
E3827 dual core processor with 1.75GHz | 1MB L2 cache | 2GB 1333MT/s DDR3L onboard memory and 4GB eMMC
onboard flash.
Intel
®
Atom
™
E3826 dual core processor with 1.46GHz | 1MB L2 cache | 2GB 1066MT/s DDR3L onboard memory and 4GB eMMC
onboard flash.
Intel
®
Atom
™
E3815 single core processor with 1.46GHz | 512kB L2 cache | 2GB 1066MT/s DDR3L onboard memory.
Intel
®
Celeron
®
N2930 quad core processor with 1.83GHz up to 2.16GHz | 2MB L2 cache and 2GB 1333MT/s DDR3L onboard memory.
Low power consumption with 7.5W TDP
Intel
®
Celeron
®
N2807 single core processor with 1.58GHz up to 2.16GHz | 1MB L2 cache and 2GB 1333MT/s DDR3L onboard memory.
Low power consumption with 4.3W TDP
Intel
®
Atom
™
E3845 quad core processor with 1.91GHz | 2MB L2 cache | 4GB 1333MT/s DDR3L onboard memory and 8GB eMMC
onboard flash. Industrial grade temperature range from -40°C to 85°C.
Intel
®
Atom
™
E3827 dual core processor with 1.75GHz | 1MB L2 cache | 2GB 1333MT/s DDR3L onboard memory and 4GB eMMC
onboard flash. Industrial grade temperature range from -40°C to 85°C
Intel
®
Atom
™
E3845 quad core processor with 1.91GHz | 2MB L2 cache | 2GB 1333MT/s DDR3L onboard memory and 4GB eMMC
onboard flash. Industrial grade temperature range from -40°C to 85°C.
Intel
®
Atom
™
E3815 single core processor with 1.46GHz | 512kB L2 cache | 2GB 1066MT/s DDR3L onboard memory. Industrial grade
temperature range from -40°C to 85°C.
Standard heatspreader for COM Express Type 10 module conga-MA3. All standoffs are M2.5 thread.
Standard heatspreader for COM Express Type 10 module conga-MA3. All standoffs are 2.7mm bore hole.
Standard passive cooling solution for COM Express Type 10 module conga-MA3 with fins. All standoffs are M2.5mm thread.
Standard passive cooling solution for COM Express Type 10 module conga-MA3 with fins. All standoffs are 2.7mm bore hole.
Accessories
conga-MEVAL
conga-LDVI/EPI
COM-Express-carrier-
board-Socket-5
COM-Express-carrier-
board-Socket-8
065400
011115
400007
400004
Evaluation carrier board for Type 10 COM-Express-modules
LVDS to DVI converter board for digital flat panels with onboard EEPROM
Connector for COM-Express carrier boards | height 5mm | packing unit 4 pieces
Connector for COM-Express carrier boards | height 8mm | packing unit 4 pieces
© 2018 congatec AG. All rights reserved.
All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee
of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their
respective trademark holders. These trademark holders are not affiliated with congatec AG. Rev. Jan 09, 2018 JK
www.congatec.com
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