Intel® Solid-State Drive 530 Series (M.2)
Product Specification
Capacities:
80GB, 120GB, 180GB, 240GB, 360GB
Power
Management
Components:
1
3.3 V SATA Supply Rail
SATA Link Power Management (LPM)
Device Sleep (DevSleep)
Active (BAPCo MobileMark* 2007 Workload):
140 mW
Idle
3
: 55 mW
DevSleep: 200 µW
Operating
4
: 0
o
C to 70
o
C
Non-Operating: -55
o
C to 95
o
C
Uncorrectable Bit Error Rate (UBER):
<1 sector per 10
16
bits read
Mean Time Between Failure (MTBF):
1,200,000 hours
Shock (operating and non-operating):
1,000 G/0.5 msec
Operating: 2.17 G
RMS
(5-700 Hz)
Non-operating: 3.13 G
RMS
(5-800 Hz)
and Declarations:
UL*
CE*
C-Tick*
BSMI*
KCC*
Microsoft* WHCK
VCCI*
SATA-IO*
Ecological Compliance
RoHS*
Intel® 20 nm NAND Flash Memory
Multi-Level Cell (MLC)
Factors:
80mm (single-sided) 2280-S2-B-M (80GB and
180GB) and (double-sided) 2280-D2-B-M
(120GB, 240GB and 360GB)
42mm (double-sided) 2242-D2-B-M (120GB)
up to 3.58 mm
< 10 grams
Form
Power
Thickness:
Weight:
SATA
Temperature
6 Gb/s Bandwidth Performance
(IOMeter* Queue Depth 32)
—
—
—
Reliability
Sustained Sequential Read: up to 540 MB/s
Sustained Sequential Write: up to 490 MB/s
1
Read
and Write IOPS
(IOMeter Queue Depth 32)
Random 4 KB Reads: up to 41,000 IOPS
Random 4 KB Writes: up to 80,000 IOPS
2
Compression
Data Protection
256-bit Encryption
Data
AES
Vibration
—
—
End-to-End
Compatibility
Certifications
Intel® SSD Toolbox with Intel® SSD Optimizer
Intel® Data Migration Software
Intel® Rapid Storage Technology
SATA Revision 3.0
ACS-2 (ATA/ATAPI Command Set 2)
SSD Enhanced SMART ATA feature set
Product
NOTES:
1.
2.
3.
4.
Performance values vary by capacity.
Random 4 KB writes measured using out-of-box SSD.
Non-DevSleep idle power with SATA Link Power Management (LPM) enabled.
As measured by temperature sensor, SMART Attribute BEh. Active airflow is recommended within
the system for maintaining proper device operating temperatures on heavier workloads.
Order Number: 329213-005US
Intel® Solid-State Drive 530 Series (M.2)
Ordering Information
Contact your local Intel sales representative for ordering information.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the
absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future
definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The
information here is subject to change without notice. Do not finalize a design with this information.
The products described in this document may contain design defects or errors known as errata which may cause the product to
deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained
by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.html
Low Halogen applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel
components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB/substrate
meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for
the environment.
Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2015 Intel Corporation. All rights reserved.
Product Specification
2
April 2015
329213-005US
Intel® Solid-State Drive 530 Series (M.2)
Contents
Revision History ............................................................................................................................................................................ 4
1
1.1
1.2
2
2.1
2.2
2.3
2.4
Introduction ................................................................................................................................................................... 5
Terminology ...................................................................................................................................................................................................6
Reference Documents ...............................................................................................................................................................................7
Product Specifications ................................................................................................................................................. 8
Capacity ...........................................................................................................................................................................................................8
Performance ..................................................................................................................................................................................................8
Electrical Characteristics ..........................................................................................................................................................................9
Environmental Conditions ................................................................................................................................................................... 10
2.4.1
Temperature, Shock, Vibration .................................................................................................................................... 10
2.4.2
Altitude .................................................................................................................................................................................... 10
Product Regulatory Compliance ....................................................................................................................................................... 11
Reliability ...................................................................................................................................................................................................... 11
Mechanical Information............................................................................................................................................. 12
Pin and Signal Descriptions ...................................................................................................................................... 14
Pin Locations .............................................................................................................................................................................................. 15
Signal Descriptions .................................................................................................................................................................................. 16
Device Sleep Feature .............................................................................................................................................................................. 17
Supported Command Sets ........................................................................................................................................ 18
ATA General Feature Command Set................................................................................................................................................ 18
Power Management ................................................................................................................................................................................ 19
Security Mode Feature Set ................................................................................................................................................................... 19
SMART Command Set ............................................................................................................................................................................ 20
5.4.1
SMART Attributes ............................................................................................................................................................... 20
5.4.2
SMART Logs .......................................................................................................................................................................... 23
Device Statistics ........................................................................................................................................................................................ 23
SMART Command Transport .............................................................................................................................................................. 24
Data Set Management Command Set ............................................................................................................................................. 24
Host Protected Area Command Set ................................................................................................................................................. 24
48-Bit Address Command Set ............................................................................................................................................................ 24
General Purpose Log Command Set ............................................................................................................................................... 24
Native Command Queuing ................................................................................................................................................................... 24
Software Settings Preservation ......................................................................................................................................................... 24
SATA Link Power Management (LPM) ............................................................................................................................................ 24
Certifications and Declarations ................................................................................................................................ 25
Appendix....................................................................................................................................................................... 26
2.5
2.6
3
4
4.1
4.2
4.3
5
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
5.12
5.13
6
7
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Product Specification
3
Intel® Solid-State Drive 530 Series (M.2)
Revision History
Revision
Number
001
002
003
004
005
Initial release
Added 120GB capacity
Added 42mm Form Factor
Added 240GB capacity
Adjusted 360GB capacity performance numbers
Description
Revision Date
July 2013
September 2013
October 2014
November 2014
April 2015
Product Specification
4
April 2015
329213-005US
Intel® Solid-State Drive 530 Series (M.2)
1
Introduction
This document describes the specifications and capabilities of the Intel® Solid-State Drive 530 Series (Intel® SSD
530 Series).
The Intel SSD 530 Series is a case-less, M.2, next generation storage solution designed for Ultrabook™. The new
M.2 form factor allows ultra-compact solutions which deliver leading performance for Serial Advanced Technology
Attachment (SATA)-based computers in capacities ranging up to 360GB.
The latest feature addition is the DevSleep functionality, a low power drive state controlled by the host via the
DevSleep pin. The drive will consume a mere 200 µW while in this state.
As compared to standard SATA HDDs, Intel SSD 530 Series offers these key features:
High I/O and throughput performance
Low power consumption
Increased system responsiveness
High reliability
Enhanced ruggedness
Small form-factor
Minimum weight
The Intel SSD 530 Series also offers additional key features such as:
Advanced Encryption Standard (AES) 256-bit Encryption
AES 256-bit encryption is an industry standard in data security, providing a hardware-based mechanism for
encryption and decryption of user data. Utilizing a 256-bit encryption key, AES encryption—when combined with
an ATA drive password—helps protect user data.
End-to-End Data Protection
End-to-end data protection helps protect data from being corrupted across the data path by using cyclic
redundancy check (CRC), parity, and error correction code (ECC) checks in the data path from the host interface
to the NAND, and back.
Data Compression
Data compression helps improve performance and endurance by automatically compressing information sent
to the SSD so that less data has to be processed and stored on the NAND. The amount of data that can be
compressed depends on the type of data.
April 2015
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Product Specification
5
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