Table of Contents
1
INTRODUCTION .................................................................................................................................. 3
1.1
2
Z
YNQ
B
ANK
P
IN
A
SSIGNMENTS
...................................................................................................... 5
FUNCTIONAL DESCRIPTION ............................................................................................................ 6
2.1
EPP ................................................................................................................................................. 6
2.2
M
EMORY
......................................................................................................................................... 6
2.2.1
DDR3 ...................................................................................................................................... 6
2.2.2
SPI Flash ................................................................................................................................ 9
2.2.3
SD Card Interface ..................................................................................................................11
2.3
USB ...............................................................................................................................................12
2.3.1
USB OTG ...............................................................................................................................12
2.3.2
USB-to-UART Bridge ............................................................................................................12
2.3.3
USB-JTAG .............................................................................................................................13
2.3.4
USB circuit protection ...........................................................................................................14
2.4
D
ISPLAY AND
A
UDIO
......................................................................................................................14
2.4.1
HDMI Output.........................................................................................................................14
2.4.2
VGA Connector......................................................................................................................17
2.4.3
I2S Audio Codec ....................................................................................................................18
2.4.4
OLED .....................................................................................................................................19
2.5
C
LOCK SOURCES
.............................................................................................................................19
2.6
R
ESET
S
OURCES
.............................................................................................................................19
2.6.1
Power
‐
on Reset (PS_POR_B)................................................................................................19
2.6.2
Program Push Button Switch .................................................................................................20
2.6.3
Processor Subsystem Reset ....................................................................................................20
2.7
U
SER
I/O ........................................................................................................................................20
2.7.1
User Push Buttons .................................................................................................................20
2.7.2
User DIP Switches .................................................................................................................20
2.7.3
User LEDs .............................................................................................................................21
2.8
10/100/1000 E
THERNET
PHY ........................................................................................................21
2.9
E
XPANSION
H
EADERS
....................................................................................................................22
2.9.1
LPC FMC Connector .............................................................................................................22
2.9.2
Digilent Pmod™ Compatible Headers (2x6).........................................................................23
2.9.3
Agile Mixed Signaling (AMS) Connector, J2 .........................................................................24
2.10 C
ONFIGURATION
M
ODES
................................................................................................................27
2.10.1
JTAG ......................................................................................................................................28
2.11 P
OWER
...........................................................................................................................................29
2.11.1
Primary Power Input .............................................................................................................29
2.11.2
On/Off Switch ........................................................................................................................29
2.11.3
Regulators..............................................................................................................................29
2.11.4
Sequencing .............................................................................................................................30
2.11.5
Power Good LED ..................................................................................................................31
2.11.6
Power Estimation ..................................................................................................................31
2.11.7
Testing ...................................................................................................................................31
2.11.8
Probes ....................................................................................................................................32
3
ZYNQ EPP BANKS ..............................................................................................................................33
3.1
Z
YNQ
EPP B
ANK
V
OLTAGES
..........................................................................................................34
4
5
JUMPER SETTINGS ............................................................................................................................35
MECHANICAL ....................................................................................................................................37
2
1-Aug-2012
1 Introduction
The ZedBoard is an evaluation and development board based on the Xilinx Zynq-7000 Extensible
Processing Platform. Combining a dual Corex-A9 Processing System (PS) with 85,000 Series-7
Programmable Logic (PL) cells, the Zynq-7000 EPP can be targeted for broad use in many
applications. The ZedBoard’s robust mix of on-board peripherals and expansion capabilities
make it an ideal platform for both novice and experienced designers. The features provided by
the ZedBoard consist of:
Xilinx® XC7Z020-1CSG484CES EPP
o
Primary configuration = QSPI Flash
o
Auxiliary configuration options
Cascaded JTAG
SD Card
Memory
o
512 MB DDR3 (128M x 32)
o
256 Mb QSPI Flash
Interfaces
o
USB-JTAG Programming using Digilent SMT1-equivalent circuit
Accesses PL JTAG
PS JTAG pins connected through PS Pmod
o
10/100/1G Ethernet
o
USB OTG 2.0
o
SD Card
o
USB 2.0 FS USB-UART bridge
o
Five Digilent Pmod™ compatible headers (2x6) (1 PS, 4 PL)
o
One LPC FMC
o
One AMS Header
o
Two Reset Buttons (1 PS, 1 PL)
o
Seven Push Buttons (2 PS, 5 PL)
o
Eight dip/slide switches (PL)
o
Nine User LEDs (1 PS, 8 PL)
o
DONE LED (PL)
On-board Oscillators
o
33.333 MHz (PS)
o
100 MHz (PL)
Display/Audio
o
HDMI Output
o
VGA (12-bit Color)
o
128x32 OLED Display
o
Audio Line-in, Line-out, headphone, microphone
Power
o
On/Off Switch
o
12V @ 5A AC/DC regulator
Software
o
ISE® WebPACK Design Software
o
License voucher for ChipScope™ Pro locked to XC7Z020
3
1-Aug-2012
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