,
nRF9E5
433/868/915MHz RF Transceiver with
Embedded 8051 Compatible Microcontroller
and 4 Input, 10 Bit ADC
Product Specification
Key Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
nRF905 433/868/915 MHz transceiver
8051 compatible microcontroller
4 input, 10bit 80ksps ADC
Single 1.9V to 3.6V supply
Small 32 pin QFN (5x5mm) package
Extremely low cost Bill of Material (BOM)
Internal VDD monitoring
2.5µA standby with wakeup on timer or external pin
Adjustable output power up to 10dBm
Channel switching time less than 650µs
Low TX supply current, typical 9mA @-10dBm
Low RX supply current typical 12.5mA peak
Low MCU supply current, typically 1mA at 4MHz
@3volt
Suitable for frequency hopping
Carrier Detect for “listen before transmit protocol”
Applications
•
•
•
•
•
•
•
•
•
Sports and leisure equipment
Alarm and security system
Industrial sensors
Remote control
Surveillance
Automotive
Telemetry
Keyless entry
Toys
All rights reserved.
Reproduction in whole or in part is prohibited without the prior written permission of the copyright holder.
April 2008
nRF9E5 Product Specification
Liability disclaimer
Nordic Semiconductor ASA reserves the right to make changes without further notice to the product to
improve reliability, function or design. Nordic Semiconductor ASA does not assume any liability arising out
of the application or use of any product or circuits described herein.
All application information is advisory and does not form part of the specification.
Limiting values
Stress above one or more of the limiting values may cause permanent damage to the device. These are
stress ratings only and operation of the device at these or at any other conditions above those given in the
specifications are not implied. Exposure to limiting values for extended periods may affect device reliability.
Life support applications
These products are not designed for use in life support appliances, devices, or systems where malfunction
of these products can reasonably be expected to result in personal injury. Nordic Semiconductor ASA cus-
tomers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Nordic Semiconductor ASA for any damages resulting from such improper use or sale.
Data sheet status
Objective product specification
This product specification contains target specifications for product
development.
Preliminary product specification This product specification contains preliminary data; supplementary
data may be published from Nordic Semiconductor ASA later.
Product specification
This product specification contains final product specifications. Nordic
Semiconductor ASA reserves the right to make changes at any time
without notice in order to improve design and supply the best possible
product.
Contact details
Visit
www.nordicsemi.no
for Nordic Semiconductor sales offices and distributors worldwide
Main office:
Otto Nielsens vei 12
7004 Trondheim
Phone: +47 72 89 89 00
Fax: +47 72 89 89 89
www.nordicsemi.no
Revision 1.4
Page 2 of 103
nRF9E5 Product Specification
Writing conventions
This product specification follows a set of typographic rules that makes the document consistent and easy
to read. The following writing conventions are used:
•
•
•
Commands, bit state conditions, and register names are written in
Courier.
Pin names and pin signal conditions are written in
Courier bold.
Cross references are
underlined and highlighted in blue.
Revision history
Date
June 2006
April 2008
Version
1.3
1.4
Description
•
•
•
Restructured layout in the new template
Updated package information
Added moisture sensitivity level to the absolute maximum ratings
Attention!
Observe precaution for handling
Electrostatic Sensitive Device.
Datasheet order code: 051005nRF9E5
Revision 1.4
Page 3 of 103
nRF9E5 Product Specification
Contents
1
Introduction ...............................................................................................
2
Quick reference data.................................................................................
3
Block diagram ...........................................................................................
4
Architectural overview..............................................................................
4.1
Microcontroller......................................................................................
4.1.1
Memory configuration ......................................................................
4.1.2
Boot EEPROM/FLASH ....................................................................
4.1.3
Register map ...................................................................................
4.2
PWM ....................................................................................................
4.3
SPI .......................................................................................................
4.4
Port logic ..............................................................................................
4.5
Power management .............................................................................
4.6
LF clock, RTC wakeup timer, GPIO wakeup and watchdog ................
4.7
Crystal oscillator ...................................................................................
4.8
AD converter ........................................................................................
4.9
Radio transceiver .................................................................................
5
Absolute maximum ratings ......................................................................
6
Electrical specifications ..........................................................................
6.1
Current information for all operating modes .........................................
7
Pin information..........................................................................................
7.1
Pin assignment.....................................................................................
7.2
Pin function ..........................................................................................
8
System clock .............................................................................................
9
Digital I/O ports .........................................................................................
9.1
I/O port behavior during RESET ..........................................................
9.2
Port 0 (P0) ............................................................................................
9.2.1
High current drive capability ............................................................
9.3
Port 1 (P1 or SPI port)..........................................................................
10
Analog interface ........................................................................................
10.1
Crystal specification .............................................................................
10.2
Antenna output .....................................................................................
10.3
ADC inputs ...........................................................................................
10.4
Current reference ................................................................................
10.5
Digital power de-coupling .....................................................................
11
Internal interface; AD converter and transceiver ...................................
11.1
P2 - radio general purpose I/O port......................................................
11.1.1
Controlling the transceiver through the SPI .....................................
11.1.2
P2 port behavior during RESET ......................................................
12
Transceiver subsystem (nRF905)............................................................
12.1
RF modes of operation.........................................................................
12.1.1
Active modes ..................................................................................
12.1.2
Power saving mode ........................................................................
12.2
nRF ShockBurst™ mode .....................................................................
12.2.1
Typical ShockBurst™ TX: ...............................................................
8
9
10
11
11
11
11
11
12
12
12
12
13
13
13
13
15
16
19
20
20
21
22
23
23
23
24
24
26
26
26
26
27
27
28
28
29
29
30
30
30
30
30
30
Revision 1.4
Page 4 of 103
nRF9E5 Product Specification
12.2.2
Typical ShockBurst™ RX:................................................................
12.3
Standby mode ......................................................................................
12.4
Output power adjustment .....................................................................
12.5
Modulation ............................................................................................
12.6
Output frequency ..................................................................................
12.7
Carrier detect........................................................................................
12.8
Address match......................................................................................
12.9
Data ready ............................................................................................
12.10
Auto retransmit .....................................................................................
12.11
RX reduced power mode......................................................................
13
AD converter subsystem .........................................................................
13.1
AD converter.........................................................................................
13.2
AD converter usage..............................................................................
13.2.1
Measurements with external reference............................................
13.2.2
Measurements with internal reference.............................................
13.2.3
Supply voltage measurement ..........................................................
13.3
AD converter sampling and timing........................................................
14
Transceiver and AD converter configuration ........................................
14.1
Internal SPI register configuration .......................................................
14.2
SPI instruction set.................................................................................
14.3
SPI timing .............................................................................................
14.4
RF – configuration register description.................................................
14.5
ADC – configuration register description ..............................................
14.6
Status register description ....................................................................
14.7
RF – configuration register contents.....................................................
14.8
ADC – configuration register contents .................................................
14.9
ADC – data register contents ..............................................................
14.10
Status register contents .......................................................................
15
Transceiver subsystem timing.................................................................
15.1
Device switching times .........................................................................
15.2
ShockBurstTM TX timing......................................................................
15.3
ShockBurstTM RX timing .....................................................................
15.4
Preamble ..............................................................................................
15.5
Time on air............................................................................................
16
SPI...............................................................................................................
17
PWM............................................................................................................
18
Interrupts....................................................................................................
18.1
Interrupt SFRs ......................................................................................
18.2
Interrupt processing..............................................................................
18.3
Interrupt masking..................................................................................
18.4
Interrupt priorities..................................................................................
18.5
Interrupt sampling.................................................................................
18.6
Interrupt latency....................................................................................
18.7
Interrupt latency from power down state. .............................................
18.8
Single step operation............................................................................
19
LF clock wakeup functions and watchdog .............................................
32
34
34
34
34
35
35
35
36
36
37
37
37
37
38
39
39
41
41
42
43
44
45
46
46
47
47
47
49
49
49
50
50
50
51
52
53
53
56
56
56
57
57
57
57
58
Revision 1.4
Page 5 of 103