DRAMATICALLY INCREASED
GRAPHICS PERFORMANCE
conga-BM67
-
Up to Intel
®
Core
™
i7-2710QE quad core procesor
-
Extreme graphics performance
-
COM Express
™
Type 2 module featuring DisplayPort
and HDMI
Formfactor
CPU
COM Express
™
Basic | (95 x 125 mm) | Type II Connector Layout
Intel
®
Core
™
i7-2710QE (SV)
Intel
®
Core
™
i5 -2510E (SV)
Intel
®
Core
™
i3-2330E
Intel
®
Celeron
®
B810
2,1 GHz
2.5 GHz
2.2 GHz
1.6 GHz
32 nm process
32 nm process
32 nm process
32 nm process
6MB cache
3MB cache
3MB cache
2MB cache
1333 MHz TDP 45 W
1333 MHz TDP 35 W
1333 MHz TDP 35 W
TDP 35 W
rPGA package
rPGA package
rPGA package
rPGA package
Integrated dual channel memory controller | up to 25,6 GByte/sec. memory bandwidth
Integrated Intel
®
HD Graphics with dynamic frequency up to 1100 MHz | Intel
®
Clear Video HD Technology
DRAM
Chipset
Ethernet
I/O Interfaces
Sound
Graphics
2 Sockets | SO-DIMM DDR3 1333 MHz | up to 16 GByte
Mobile Intel
®
6 Series Chipset | Intel
®
QM67 Platform Controller Hub
Gigabit Ethernet | Intel
®
Ethernet PHY with AMT support
6x PCI Express
™
lanes | 4x Serial ATA
®
(AHCI) with RAID support | 1x EIDE (UDMA-66/100) optional | 8x USB 2.0 (EHCI) | PCI Bus 33 MHz Rev. 2.3
LPC bus | I²C bus (fast mode | 400 kHz | multi-master)
Digital High Definition Audio Interface with support for multiple audio codecs
Processor integrated Mobile Intel
®
6 Series HD graphics | OpenGL 3.0 and DirectX 10.1 support | Two independent pipelines for full dual view
support | High performance hardware MPEG-2 decoding | WMV9 (VC-1) and H.264 (AVC) support Blu-ray support @ 40 Mbit/s | hardware motion
compensation (using HDMI 1.4 with 3D) | no PEG support
Dual channel LVDS transmitter | Supports flat panels 2x24 Bit interface | VESA mappings | resolutions up to 1920x1200 | Automatic Panel
Detection via EDID/EPI
3x DisplayPorts 1.1 | max. resolution 2560x1600
3x ports shared
350 MHz RAMDAC | resolutions up to QXGA (2048x1536)
1 x Intel compliant SDVO ports with 200MPixel/sec. Supports external DVI | TV and LVDS transmitter
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | BIOS Setup Data Backup
I²C bus (fast mode | 400 kHz | multi-master) | Power Loss Control
AMI Aptio
®
UEFI 2.x firmware | 8 MByte serial SPI firmware flash
The conga-BM67 can be optionally equipped with a discrete ”Trusted Platform Module” (TPM). It is capable of calculating efficient hash and
RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and
e-commerce will benefit also with improved authentication | integrity and confidence levels.
ACPI 3.0 with battery support
Microsoft
®
Windows 8 | Microsoft
®
Windows7 | Microsoft
®
Windows
®
embedded Standard | Microsoft
®
Windows XP | Linux
Typ. application: Processor TDP: 35 .. 45 W | see manual for full details
Operating: 0 .. +60°C | Storage: -20 .. +80°C
Operating: 10 - 90% r. H. non cond. | Storage: 5 - 95% r. H. non cond.
95 x 125 mm (3.74” x 4.92”)
LVDS
(eDP optional)
DisplayPort
HDMI
CRT Interface
SDVO
congatec Board Controller
Embedded BIOS Features
Security
Power Management
Operating Systems
Power Consumption
Temperature
Humidity
Size
www.congatec.com
conga-BM67
| Block diagram
A-B
Power Management and Control Signals
High Definition Audio (HDA) I/F
Gbit Ethernet
GPIs/GPOs
4x SATA
SM Bus
I2C
LCD I/F
(LVDS)
8x USB 2.0
CRT
6 PCIe Lanes
Intel®
(optional)
TPM
Gigabit Ethernet
PHY 82579LM
LPC Bus
BIOS
(Flash)
Processor
RTC
Board Controller
STMicroelectronics
STM32
1x x1 PCIe Link
Watchdog
CORE
DMI x4
(Direct Media
Interface)
Intel® FDI
(Flexible Display
Interface)
CORE
CORE
SPI
8 PCIe Lanes
1x x1 PCIe Link
Mobile Intel® QM67
Express Chipset
Intel® BD82QM67 PCH
(Intel® BD82HM65 for Celeron™
equipped modules)
1x SATA
Digital Display
Interface
3x HDMI/DVI OR
3x DisplayPort (DP)
CORE
BC SPI
2nd Generation
Intel® Core™ i7
Intel® Core™ i5
Intel® Core™ i3
Intel® Celeron™
Graphics
CORE
Memory
Controller
Hardware Monitoring
and Fan Control Circuitry
PCIe to PCI Bridge
Intel® certified Pericom
Memory Types
(1066 or 1333MHz)
DDR3-SODIMM
Socket (top)
16 GByte Max. Total
DDR3-SODIMM
Socket (bottom)
PI7C9X113SL
C-D
conga-BM67
| Order Information
Article
conga-BM67/i7-2710QE
conga-BM67/i5-2510E
conga-BM67/i3-2330E
conga-BM67/B810
conga-BM67/HSP-HP-B
conga-BM67/HSP-HP-T
conga-BM67/CSP-HP-B
conga-BM67/CSP-HP-T
conga-BM67/CSA-HP-B
conga-BM67/CSA-HP-T
DDR3L-SODIMM-1600 (2GB)
DDR3L-SODIMM-1600 (4GB)
DDR3L-SODIMM-1600 (8GB)
PN
046101
046102
046104
046105
046120
046121
046122
046123
046124
046125
068755
068756
068757
Description
Intel
®
Core
™
i7-2710QE quad core processor with 2.1GHz | 6MB L3 cache and 1600MT/s dual channel DDR3 memory interface
Intel
®
Core
™
i5-2510E dual core processor with 2.5GHz | 3MB L3 cache and 1333MT/s dual channel DDR3 memory interface
Intel
®
Core
™
i3-2330E dual core processor with 2.2GHz | 3MB L3 cache and 1333MT/s dual channel DDR3 memory interface
Intel
®
Celeron
®
B810 dual core processor with 1.6GHz | 2MB L3 cache and 1333MT/s dual channel DDR3 memory interface
Standard heatspreader for high performance COM Express module conga-BM67 with integrated heat pipes. All standoffs are
with 2.7mm bore hole
Standard heatspreader for high performance COM Express module conga-BM67 with integrated heat pipes. All standoffs are
M2.5mm thread
Standard passive cooling solution for high performance COM Express module conga-BM67 with integrated heat pipes
15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole
Standard passive cooling solution for high performance COM Express module conga-BM67 with integrated heat pipes
15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread
Standard active cooling solution for high performance COM Express module conga-BM67 with integrated heat pipes
15mm silver fins | 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole
Standard active cooling solution for high performance COM Express module conga-BM67 with integrated heat pipes
15mm silver fins | 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 2GB RAM
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 8GB RAM
Accessories
conga-CEVAL
conga-Cdebug
conga-LDVI/EPI
conga-HDMI/Display Port adapter
conga-FPA2
065749
047854
011115
500014
047250
Evaluation Carrier Board for COM Express Type 2 modules
COM-Express debugging platform. Including cable for COM | PS/2 and VGA.
LVDS to DVI converter board for digital flat panels with onboard EEPROM
The conga-HDMI/DisplayPort adapter is used fo convert the chipset graphic ports Port-B | Port-C and Port-D to the HDMI or
DisplayPort Interface
Flatpanel prototype adapter to develop your own flatpanel adapter Including cables set.
© 2016 congatec AG. All rights reserved.
All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee
of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their
respective trademark holders. These trademark holders are not affiliated with congatec AG. Rev. December 12, 2016 MR
1x IDE
Fan
Control
PCI Bus
1x SDVO
SATA to IDE
Chip
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