Performance values vary by capacity and form factor
Performance specifications apply to both compressible and incompressible data
4KB = 4,096 bytes; 8KB = 8,192 bytes
MB/s = 1,000,000 bytes/second.
Based on Random 4KB QD=1 workload, measured as the time taken for 99.9 percentile of commands to finish the round-trip from host to drive and back to host
Measurement taken once the workload has reached steady state but including all background activities required for normal operation and data reliability
Defaults to 12V, if both 12V and 5V are present
Based on 5V supply
Please contact your Intel representative for details on the non-operating temperature range
Altitude pressure is simulated in a test chamber; excludes soft error
Extended operation at a higher altitude might impact reliability.
Based on JESD218 standard
Order Number: 328860-008US
Intel
®
Solid-State Drive DC S3500 Series
Ordering Information
Contact your local Intel sales representative for ordering information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY
INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL
ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING
LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER
INTELLECTUAL PROPERTY RIGHT.
A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE
OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND
AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE
ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH
MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL
PRODUCT OR ANY OF ITS PARTS.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or
instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising
from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications.
Current characterized errata are available on request.
Intel Non-Volatile Memory Solutions Group (NSG) states that, through our Software Legal Compliance (SWLC) process, we have examined and evaluated firmware and
software components that may accompany this Intel Solid-State Drive product, including embedded SSD firmware and any Intel-provided drivers. We conclude that there are
no Open Source elements contained in these components. For more information about our SWLC process, please contact your Intel Representative.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to:
http://www.intel.com/design/literature.htm
Low Halogen applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on
the finished assembly meet JS-709 requirements, and the PCB/substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC
may not be better for the environment.
Intel and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others.
Revision History ........................................................................................................................................................................ 4
Related Documents .................................................................................................................................................................. 4
Terms and Acronyms ............................................................................................................................................................... 5
Temperature Sensor ............................................................................................................................................................ 14
Power Loss Capacitor Test ................................................................................................................................................ 14
Hot Plug Support ................................................................................................................................................................... 14
Mechanical Information ......................................................................................................................................... 15
Pin and Signal Descriptions .................................................................................................................................. 17
4.1
4.2
4.3
4.4
2.5-inch Form Factor Pin Locations .............................................................................................................................. 17
1.8-inch Form Factor Pin Locations .............................................................................................................................. 17
Connector Pin Signal Definitions .................................................................................................................................... 18
Power Pin Signal Definitions............................................................................................................................................. 18
ATA General Feature Command Set ............................................................................................................................. 20
Power Management Command Set............................................................................................................................... 20
Security Mode Feature Set ................................................................................................................................................ 21
SMART Command Set ......................................................................................................................................................... 21
SMART Command Transport (SCT) ............................................................................................................................... 28
Data Set Management Command Set .......................................................................................................................... 28
Host Protected Area Command Set .............................................................................................................................. 28
48-Bit Address Command Set ......................................................................................................................................... 28
General Purpose Log Command Set............................................................................................................................. 29
Certifications and Declarations ............................................................................................................................ 30
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
