EVALUATION KIT AVAILABLE
MAX11190
4-Channel, Dual, Simultaneous Sampling,
2.2V to 3.6V, 12-Bit, 3Msps SAR ADC in Tiny
3mm x 3mm TQFN Package
Benefits and Features
● Integration and Packaging Save Space
• Simultaneous Sampling
• Dual, 4-Channel, Single-Ended 12-Bit Resolution
ADC (2 x 2)
• 16-Pin, 3mm x 3mm TQFN Package
● Excellent Performance Ideal for Motor Control
Applications
• 72dB SNR
• 3Msps Conversion Rate without Pipeline Delay
• External Reference Inputs
• Wide -40°C to +125°C Operation
● Low Power Design Simplifies Power-Supply
Requirements
• Very Low Power Consumption at 5μA/ksps
• 10.5mW at 3Msps
• 2.2V to 3.6V Supply Voltage
• 2.6μA Power-Down Current
● Dual SPI Ports Simplifies System Design
• SPI-/QSPI-/MICROWIRE-Compatible Serial
Interface with Two DOUTA/DOUTB Pins
• Dedicated Digital Output Supply Allows Serial
Interface to Directly Connect to 1.5V, 1.8V, 2.5V, or
3V Digital Systems
General Description
The MAX11190 is a 4-channel, dual, multiplexed, 12-bit,
compact, high-speed, low-power, successive approxi-
mation analog-to-digital converter (ADC). This high-
performance dual ADC includes high-dynamic range
sample-and-holds and a high-speed serial interface. This
ADC accepts a full-scale input from 0V to the reference
voltage.
The device features two dual, single-ended analog inputs
connected to two ADC cores using 2:1 MUXs. The device
also includes a separate supply input for data interface
and dedicated inputs for reference voltage.
This device operates from a 2.2V to 3.6V supply and
consumes only 10.5mW at 3Msps. The device includes
full power-down mode and fast wake-up for optimal
power management and a high-speed 3-wire serial inter-
face. The 3-wire serial interface directly connects to SPI,
QSPI™, and MICROWIRE
®
devices without external
logic. Each of the two internal ADCs has its own dedicated
DOUTA/DOUTB for faster data communication.
Excellent dynamic performance, low voltage, low power,
ease of use, and small package size make this converter
ideal for simultaneous data-acquisition applications, and
for other applications that demand low power consump-
tion and minimal space.
The device is available in a 3mm x 3mm, 16-pin TQFN
package and operates over the -40ºC to +125ºC tempera-
ture range.
Functional Diagram
V
DD
OVDD
Applications
●
●
●
●
SAR-A
OUTPUT
BUFFER
DOUTA
Motor Control
Simultaneous Data Acquisition
Medical Instrumentation
Process Control
AIN1A
AIN2A
CHSEL
REFA
REFB
AIN1B
AIN2B
MUX
CDAC-A
CONTROL
LOGIC
CS
MAX11190
MUX
CDAC-B
CONTROL
LOGIC
SCLK
Ordering Information
appears at end of data sheet.
For related parts and recommended products to use with this part, refer
to
www.maximintegrated.com/MAX11190.related.
SAR-B
QSPI is a trademark of Motorola, Inc.
MICROWIRE is a registered trademark of National
Semiconductor Corporation
GND
OUTPUT
BUFFER
DOUTB
19-6743; Rev 2; 12/14
MAX11190
4-Channel, Dual, Simultaneous Sampling,
2.2V to 3.6V, 12-Bit, 3Msps SAR ADC in Tiny
3mm x 3mm TQFN Package
TABLE OF CONTENTS
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Benefits and Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Functional Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Typical Operating Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Typical Operating Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Detailed Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Analog Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
ADC Transfer Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Operation Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Power-Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Entering Power-Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Exiting Power-Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Supply Current vs. Sampling Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Dual-Channel Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
14-Cycle Conversion Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Applications Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Layout, Grounding, and Bypassing
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Choosing an Input Amplifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Choosing a Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Integral Nonlinearity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Differential Nonlinearity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Offset Error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Gain Error . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Aperture Jitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Aperture Delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Aperture Delay Matching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Signal-To-Noise Ratio (SNR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Signal-To-Noise Ratio and Distortion (SINAD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Total Harmonic Distortion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Spurious-Free Dynamic Range (SFDR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
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Maxim Integrated
│
2
MAX11190
4-Channel, Dual, Simultaneous Sampling,
2.2V to 3.6V, 12-Bit, 3Msps SAR ADC in Tiny
3mm x 3mm TQFN Package
TABLE OF CONTENTS (continued)
Full-Power Bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Full-Linear Bandwidth
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Intermodulation Distortion. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Chip Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
LIST OF FIGURES
Figure 1. Interface Signals for Maximum Throughput . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 2. Setup Time After SCLK Falling Edge
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 3. Hold Time After SCLK Falling Edge
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 4. SCLK Falling Edge DOUTA/DOUTB Three-State
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 5. Analog Input Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 6. Normal Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 7. Entering Power-Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 8. Exiting Power-Down Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 9. ADC Transfer Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 10. Supply Current vs. Sample Rate (Normal Operating Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 11. Supply Current vs. Sample Rate (Device Powered Down Between Conversions) . . . . . . . . . . . . . . . . . . 14
Figure 12. Channel Select Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 13. 14-Clock Cycle Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 14. Typical Application Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
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Maxim Integrated
│
3
MAX11190
4-Channel, Dual, Simultaneous Sampling,
2.2V to 3.6V, 12-Bit, 3Msps SAR ADC in Tiny
3mm x 3mm TQFN Package
Multilayer Board Max Power Dissipation (T
A
= +70ºC)
TQFN (derate 20.8mW/ºC above +70ºC) ..................1667mW
Operating Temperature Range ..........................-40ºC to +125ºC
Storage Temperature Range .............................-65ºC to +150ºC
Lead Temperature (soldering, 10s)
................................. +300ºC
Soldering Temperature (reflow) ....................................... +260ºC
Absolute Maximum Ratings
V
DD
to GND ....................................................................... -0.3V to +4V
AIN1A, AIN2A to GND ....-0.3V to the lower of (V
DD
+ 0.3V) and +4.0V
REFA, OVDD to GND ....-0.3V to the lower of (V
DD
+ 0.3V) and +4.0V
AIN1B, AIN2B to GND....-0.3V to the lower of (V
DD
+ 0.3V) and +4.0V
REFB to GND .................-0.3V to the lower of (V
DD
+ 0.3V) and +4.0V
CS, SCLK to GND
..... -0.3V to the lower of (V
OVDD
+ 0.3V) and +4.0V
CHSEL to GND
......... -0.3V to the lower of (V
OVDD
+ 0.3V) and +4.0V
DOUTA to GND........... -0.3V to the lower of (V
OVDD
+ 0.3V) and +4.0V
DOUTB to GND .......... -0.3V to the lower of (V
OVDD
+ 0.3V) and +4.0V
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 1)
TQFN
Junction-to-Ambient Thermal Resistance (θ
JA
) ..........48°C/W
Junction-to-Case Thermal Resistance (θ
JC
) ...............10°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
(V
DD
= +2.2V to +3.6V, REFA = REFB = V
DD
, OVDD = V
DD
, unless otherwise noted. f
SCLK
= 48MHz, 3Msps, 50% duty cycle.
Reference pins are independent, C
DOUTA/DOUTB
= 10pF. T
A
= -40ºC to 125ºC, unless otherwise noted. Typical values are at
T
A
= +25ºC.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
12
±1
No missing codes over temperature
±1
Excluding offset and reference errors
TUE
±1
±1.5
±0.3
±0.3
±1
±4.0
±4.0
TYP
MAX
UNITS
Bits
LSB
LSB
LSB
LSB
LSB
LSB
LSB
DC ACCURACY
Resolution
Integral Nonlinearity
Differential Nonlinearity
Offset Error
Gain Error
Total Unadjusted Error
Channel-to-Channel Offset Matching
Channel-to-Channel Gain Matching
DYNAMIC PERFORMANCE
Signal-to-Noise Plus Distortion
(Note 3)
Signal-to-Noise Ratio
Total Harmonic Distortion
Spurious-Free Dynamic Range
Intermodulation Distortion
Full-Power Bandwidth
Full-Linear Bandwidth
Small-Signal Bandwidth
Crosstalk
Channel to channel
SINAD
SNR
THD
SFDR
IMD
f
IN
= 1MHz
f
IN
= 1MHz
f
IN
= 1MHz
f
IN
= 1MHz
f
IN1
= 1.0003MHz, f
IN2
= 0.99955MHz
-3dB point
SINAD > 68dB
76
70
70.5
72
72
-85
85
-84
40
2.5
45
-90
-75
dB
dB
dB
dB
dB
MHz
MHz
MHz
dB
INL
DNL
12 bit
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Maxim Integrated
│
4
MAX11190
4-Channel, Dual, Simultaneous Sampling,
2.2V to 3.6V, 12-Bit, 3Msps SAR ADC in Tiny
3mm x 3mm TQFN Package
Electrical Characteristics (continued)
(V
DD
= +2.2V to +3.6V, REFA = REFB = V
DD
, OVDD = V
DD
, unless otherwise noted. f
SCLK
= 48MHz, 3Msps, 50% duty cycle.
Reference pins are independent, C
DOUTA/DOUTB
= 10pF. T
A
= -40ºC to 125ºC, unless otherwise noted. Typical values are at
T
A
= +25ºC.) (Note 2)
PARAMETER
CONVERSION RATE
Throughput
Conversion Time
Acquisition Time
Aperture Delay
Aperture Delay Matching
Aperture Jitter
Serial-Clock Frequency
f
CLK
V
INA
V
INB
I
ILA
C
AIN_
Track
Hold
AIN1A and AIN2A pins
AIN1B and AIN2B pins
0.48
0
0
0.002
20
4
ANALOG INPUT (AIN1A, AIN2A, AIN1B, and AIN2B)
Input Voltage Range
Input Leakage Current
Input Capacitance
V
REFA
V
REFB
±1
V
V
µA
pF
t
ACQ
16 cycles
13 cycles
Track time = 2.5 cycles
From
CS
falling edge
0.03
260
52
4
150
15
48
3
Msps
ns
ns
ns
ps
ps
MHz
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
EXTERNAL REFERENCE (REFA and REFB)
Input Voltage Range
Input Leakage Current
Input Capacitance
DIGITAL INPUTS (SCLK,
CS,
CHSEL)
Input High Voltage
Input Low Voltage
Input Hysteresis
Input Leakage Current
Input Capacitance
Output High Voltage
Output Low Voltage
Three-State Leakage Current
Three-State Output Capacitance
(Without Pad Metal)
DIGITAL OUTPUT (DOUTA and DOUTB)
V
OH
V
OL
I
OL
C
OUT
5
I
SOURCE
= 1mA
I
SINK
= 5mA
0.85 x V
OVDD
0.15 x V
OVDD
±1.0
V
V
µA
pF
V
REFA
V
REFB
I
ILR
C
REFA
C
REFB
V
IH
V
IL
V
HYST
I
IL
C
IN
Inputs at 0V or V
OVDD
Conversion stopped
1
0.005
5
V
DD
+ 0.05
±1
V
µA
pF
0.75 x V
OVDD
0.25 x V
OVDD
0.15 x V
OVDD
0.001
2
±1
V
V
%OVDD/
V
DD
µA
pF
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Maxim Integrated
│
5
嵌入式系统
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