*“OPIC ” ( Optical IC ) is a trademark of the SHARP Corporation.
An OPIC consists of a light-detecting element and signal-
processing circuit integrated onto a single chip.
s
Absolute Maximum Ratings
Parameter
Supply voltage
Output voltage
Output
Output current
*1
GL output
Output voltage
Power dissipation
Operating temperature
Storage temperature
*2
Soldering temperature
Symbol
V
CC
V
O
I
O
V
GL
P
T
opr
T
stg
T
sol
( Ta= 25˚C)
Rating
- 0.5 to 16
16
50
16
250
- 25 to + 60
- 40 to +100
260
Unit
V
V
mA
V
mW
˚C
˚C
˚C
*1 Applies to GL
out
terminal
*2 For 5 seconds at the position shown in the right figure
“
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.
”
0.3
MAX.
s
Applications
1.8 1.7
±
0.3
Resin portion
Soldering portion
(Immersed up to bending portion )
IS471F
s
Electro-optical Characteristics
Parameter
Operating supply voltage
Supply current
Low level output voltage
Output
High level output voltage
Output short circuit current
Low level output current
GL
*4
Pulse cycle
output
*4
Pulse width
*5
“ Low→High ” threshold irradiance
*5
“ High→Low ” threshold irradiance
Hysteresis
“ High→Low”
Response
propagation delay time
“ Low→High”
time
propagation dealy time
*7
External disturbing light illuminance
Symbol
V
CC
I
CC
V
OL
V
OH
I
OS
I
GL
t
p
t
W
E
ePLH
E
ePHL
E
ePLH
/E
ePHL
t
PHL
t
PLH
E
VDX
Conditions
-
V
O
, GL
out
terminals shall be opened.
I
OL
= 16mA, E
VP
= 500lx, E
VD
= 0
*3
E
VD
= E
VP
= 0
*3
E
VP
= E
VD
= 0
*3
V
GL
= 1.2V
-
-
E
eD
= 0
*3
Light emitting
diode (
λ
p= 940nm )
*6
( V
CC
= 5V, Ta= 25˚C )
MIN.
4.5
-
-
4.97
0.25
40
70
4.4
-
-
0.45
-
-
2000
TYP.
-
3.5
0.15
-
0.5
55
130
8
0.4
0.7
0.65
400
400
7500
MAX.
16
7.0
0.35
-
1.0
70
220
13.7
2.66
2.8
0.95
670
670
-
Unit
V
mA
V
V
mA
mA
µ
s
µ
s
µ
W/mm
2
µ
W/mm
2
-
µ
s
µ
s
lx
*6
*6
Eep= 7.5
µ
W/mm
2
,
*3
λ
p= 940nm
*3 E
eP
represents illuminance of signal light in sync with the low level timing of output at GL
out
terminal.
E
eD
represents illuminance of DC light. For detail, see Fig. 1.
Light source: Infrared light emitting diode (
λ
p= 940nm )
E
VP
represents illuminance of signal light in sync with the low level timing of output at GL
out
terminal.
E
VD
represents illuminance of DC light. Note that the light source is CIE standard light source A.
Fig.1
E
eP
E
e
E
eD
Time
( Note ) Fig. 1 shows the output waveform at GL
out
terminal with
IS471F
connected as shown in
Fig. 3.
0
Output waveform
at GL
out
terminal
*4 Pulse cycle (t
P
) , pulse width (t
W
) are defined as shown in Fig. 2.
The waveform shown in Fig. 2 is the output voltage waveform at GL
out
terminal with
IS471F
connected as
shown in Fig. 3
Fig.2
Fig.3
5V
0V
t
W
t
P
V
CC
1
V
O
2
GL
out
IS471F
4
GND
3
280Ω
0.33
µF
5V
*5 Defined as E
ep
that causes the output to go“ Low to High” ( or“ High to Low” ) .
IS471F
*6 Test circuit for response time, threshold irradiance is shown in Fig. 4.
Fig. 4
Vin
V
CC
Light
emitting
diode
IS471F
Switch
4
GL
out
Light emitting diode : peak emission wavelengh
λ
P
= 940nm
3
0.33
µF
GND
Output
1.5V
V
OL
1
2
V
O
280Ω
Switch
ON
5V
t
PHL
t
PLH
V
OH
OFF
*7 E
VDX
: Defined
as the E
VD
at the limit of normal operation range.
Fig. 5 Power Dissipation vs.
Ambient Temperature
300
Fig. 6 Low Level Output Voltage vs.
Low Level Output Current
1
0.5
V
CC
= 5V
T
a
= 25˚C
200
Low level output voltage V
OL
( V )
250
Power dissipation P ( mW )
0.2
0.1
0.05
150
100
50
0
- 25
0.02
0.01
0
25
50 60
75
100
125
1
2
5
10
20
OL
50
( mA )
100
Ambient temperature T
a
( ˚C )
Low level output current I
Fig. 7 Low Level Output Voltage vs.
Ambient Temperature
0.6
V
CC
= 5V
Low level output voltage V
OL
( V )
0.5
Fig. 8 Supply Current vs. Supply Voltage
8
7
Supply current I
cc
( mA )
T
a
=-
6
25˚C
0.4
25˚C
5
0.3
I
OL
= 30mA
0.2
16mA
0.1
5mA
0
- 25
60˚C
4
3
2
0
25
50
75
100
0
2
4
6
8
10
12
(V)
14
16
Ambient temperature T
a
( ˚C )
Supply voltage V
cc
IS471F
Fig. 9 Low Level Output Current vs.
Supply Voltage
80
Low level output current I
OL
( mA )
70
60
50
60˚C
40
30
20
10
0
2
4
6
8
10
12
14
16
18
- 50˚
- 60˚
- 70˚
- 80˚
- 90˚
0
Angular displacement
θ
20
T
a
=-25˚C
25˚C
- 40˚
- 30˚
Fig.10 Sensitivity Diagram
( T
a
= 25˚C )
-20˚
-10˚
0˚
100
(%)
+30˚
80
+10˚
+20˚
Relative sensitivity
60
+40˚
40
+50˚
+60˚
+70˚
+80˚
+90˚
Supply voltage V
cc
( V )
Fig.11 Spectral Sensitivity
100
T
a
= 25˚C
90
80
Relative sensitivity ( % )
70
60
50
40
30
20
10
0
400 500 600 700 800 900 1000 1100 1200 1300 1400
Wavelength
λ
( nm )
s
Basic Circuit
Voltage regulator
Comparator
Sync.detector
circuit
Demodulator
circuit
Amp.
Oscillator
V
cc
( Power supply)
V
o
( Signal output)
g
C
=
0.33
µ
F
Infrared light
emitting diode
g
In order to stabilize power supply line, connect a by-pass capacitor of 0.33µ F
or more between Vcc and GNP near the device.
q
Please refer to the chapter “Precautions for Use.”
Application Circuits
NOTICE
qThe
circuit application examples in this publication are provided to explain representative applications of
SHARP devices and are not intended to guarantee any circuit design or license any intellectual property
rights. SHARP takes no responsibility for any problems related to any intellectual property right of a
third party resulting from the use of SHARP's devices.
qContact
SHARP in order to obtain the latest device specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials,
structure, and other contents described herein at any time without notice in order to improve design or
reliability. Manufacturing locations are also subject to change without notice.
qObserve
the following points when using any devices in this publication. SHARP takes no responsibility
for damage caused by improper use of the devices which does not meet the conditions and absolute
maximum ratings to be used specified in the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and
safety when SHARP devices are used for or in connection with equipment that requires higher
reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
qContact
a SHARP representative in advance when intending to use SHARP devices for any "specific"
applications other than those recommended by SHARP or when it is unclear which category mentioned
above controls the intended use.
qIf
the SHARP devices listed in this publication fall within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export
such SHARP devices.
qThis
publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in whole or in part, without the express written
permission of SHARP. Express written permission is also required before any use of this publication
may be made by a third party.
qContact
and consult with a SHARP representative if there are any questions about the contents of this
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