transistor. The input LED and the output transistor are
separated by a 5000V
rms
isolation barrier.
With a LED current of only 1mA, a current transfer
ratio of 1000% to 8000% is guaranteed at the
collector of the 350V Darlington output transistor.
The CPC1301's low input current, high current
transfer ratio, high output voltage capability, and
large isolation barrier rating make it ideal for many
applications such as telecom, industrial, and power
control.
Features
•
•
•
•
5000V
rms
Input/Output Isolation
350V
P
Breakdown Voltage
Small 4-Pin Package
Surface Mount Tape & Reel Version Available
Applications
•
•
•
•
•
•
•
Telecom Switching
Tip/Ring Circuits
Hook Switch
Modem Switching (Laptop, Notebook, Pocket Size)
Loop Detect
Ringing Detect
Current Sensing
Approvals
•
UL 1577 Approved Component: File E76270
•
CSA Certified Component: Certificate 1172007
•
EN 60950 Certified Component:
TUV Certificate B 13 12 82667 003
Ordering Information
Part Number
CPC1301G
CPC1301GR
CPC1301GRTR
Description
4-Pin DIP (100/Tube)
4-Pin Surface Mount (100/Tube)
4-Pin Surface Mount (1000/Reel)
Pin Configuration
A
1
4
C
K
2
3
E
DS-CPC1301-R06
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Absolute Maximum Ratings @ 25ºC
Parameter
Breakdown Voltage, BV
CEO
Reverse Input Voltage
Input Control Current
Peak (10ms)
Input Power Dissipation
1
Phototransistor Power Dissipation
2
Isolation Voltage, Input to Output
Operational Temperature
Storage Temperature
1
2
CPC1301
Ratings
350
5
50
1
150
150
5000
-40 to +85
-40 to +125
Units
V
P
V
mA
A
mW
mW
V
rms
°
C
°
C
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manfacturing testing requirements.
Derate linearly 1.33 mW /
o
C
Derate linearly 1.5 mW /
o
C
Electrical Characteristics @ 25ºC
Parameters
Output Characteristics
Phototransistor Breakdown Voltage
Emitter-Collector Breakdown Voltage
Phototransistor Output (Dark) Current
Saturation Voltage
Current Transfer Ratio
Output Capacitance
Input Characteristics
Input Control Current
Input Voltage Drop
Input Reverse Current
Common Characteristics
Input to Output Capacitance
Conditions
I
CEO
=100µA
I
E
=0.1mA
V
CEO
=200V, I
F
=0mA
I
C
=10mA, I
F
=1mA
I
C
=100mA, I
F
=10mA
I
F
=1mA, V
CE
=1V
V
CEO
=50V, f=1MHz
I
C
=10mA, V
CE
=1V
I
F
=5mA
V
R
=5V
-
Symbol
BV
CEO
BV
ECO
I
CEO
V
CE(Sat)
CTR
C
OUT
I
F
V
F
I
R
C
I/O
Min
350
0.3
-
-
-
1000
-
-
0.9
-
-
Typ
-
-
-
-
-
5500
13
0.07
1.2
-
3
Max
-
-
100
1
1.2
8000
-
1
1.4
10
-
Units
V
P
V
nA
V
%
pF
mA
V
µA
pF
Switching Characteristics @ 25ºC
Characteristic
Rise Time
Fall Time
Turn-On Time
Storage Time
Turn-Off Time
Turn-On Time
Storage Time
Turn-Off Time
Symbol
t
R
t
F
t
on
t
S
t
off
t
on
t
S
t
off
Test Condition
V
CC
=10V
I
F
=10mA
R
L
=100
V
CC
=10V
I
F
=16mA
R
L
=180
Typ
40
2.6
2.75
20
60
1
40
80
Units
I
F
V
CE
t
F
t
R
90%
10%
t
on
t
S
t
off
s
Switching Time Test Circuit
V
CC
R
L
Pulse Width=5ms
Duty Cycle=50%
I
F
V
CE
2
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PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
LED Current (I
F
)
vs. LED Forward Voltage (V
F
)
LED Current (I
F
)
vs. LED Forward Voltage (V
F
)
1.6
LED Forward Voltage (V)
1.5
CPC1301
LED Forward Voltage
vs. Temperature
50
LED Current (mA)
40
30
20
10
100
LED Current (mA)
10
I
F
=50mA
1.4
1.3
1.2
1.1
1.0
-40
I
F
=10mA
I
F
=5mA
I
F
=2mA
-20
0
20
40
60
Temperature (ºC)
80
100
I
F
=20mA
1
0
1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55
LED Forward Voltage (V)
0.1
1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55
LED Forward Voltage (V)
100,000
CTR vs. LED Current (I
F
)
1000
V
CE
=1.5V
Collector Current I
C
(mA)
Collector Current
vs. LED Current (I
F
)
Collector Current I
C
(mA)
375
300
Collector Current vs. Temperature
(V
CE
= 1.2V)
I
F
=10mA
I
F
=5mA
10,000
CTR (%)
100
V
CE
=1.5V
225
150
75
0
1000
V
CE
=1.0V
V
CE
=1.0V
10
100
I
F
=1mA
I
F
=0.5mA
-40
-20
0
20
40
60
80
100
Temperature (ºC)
10
0.1
1
10
100
LED Current (mA)
1
0.01
0.1
1
10
LED Forward Current (mA)
100
Collector Current vs.
Collector-Emitter Voltage
180
Collector Current I
C
(mA)
160
140
120
100
80
60
40
20
0
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
Collector-Emitter Voltage V
CE
(V)
0
-40
I
F
= 2mA
I
F
= 1mA
I
F
= 0.5mA
I
F
= 10mA
Leakage Current (µA)
I
F
= 5mA
3.0
2.5
2.0
1.5
1.0
0.5
Leakage vs. Temperature
(V
CEO
= 350V)
Breakdown Voltage BV
CEO
(V
P
)
450
440
430
420
410
400
390
380
370
Breakdown Voltage vs. Temperature
-20
0
20
40
60
Temperature (ºC)
80
100
120
-40
-15
10
35
Temperature (ºC)
60
85
Switching Time vs. Load Resistance
1000
t
OFF
, I
F
=16mA
Switching Time ( s)
100
t
OFF
, I
F
=1.6mA
10
t
ON
, I
F
=1.6mA
1
t
ON
, I
F
=16mA
0.1
10
100
1K
10K
100K
Load Resistance ( )
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please
contact our application department.
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Manufacturing Information
Moisture Sensitivity
CPC1301
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
CPC1301G
CPC1301GR
Moisture Sensitivity Level (MSL) Rating
MSL 1
MSL 3
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (T
C
) of this product and the maximum dwell time the
body temperature of this device may be above (T
C
- 5)ºC. The classification temperature sets the Maximum Body
Temperature allowed for this device during lead-free reflow processes. Additionally, for the CPC1301GR, the solder
reflow profile given in Technical Brief TB-200
"Pb-Free Solder Reflow Profile for Select Devices"
must be followed.
For the through-hole device, CPC1301G, and any other processes, the guidelines of
J-STD-020
must be observed.
Device
CPC1301GR
Maximum Body Temperature (T
c
)
250ºC
Time
15 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow-up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device, and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
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