PL
IA
N
T
Features
n
Available in E6 series, E12 series optional
n
High inductance up to 15 mH
n
High current up to 5.6 A
n
Gull wing leads
n
RoHS compliant*
F
RE
E
Applications
n
Input/output of DC/DC converters
n
Power supplies for:
*R
oH
S
C
OM
• Portable communication equipment
• Camcorders
• LCD TVs
LE
AD
SRR0908 Series - SMD Shielded Power Inductors
General Specifications
Test
Freq.
(MHz)
I rms
Max.
(A)
I sat
Typ.
(A)
Electrical Specifications
Q
Ref.
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
SRR0908-1R5ML
1.5
SRR0908-2R7ML
2.7
SRR0908-3R9ML
3.9
SRR0908-5R6ML
5.6
SRR0908-7R5ML
7.5
SRR0908-100ML
10
SRR0908-120ML
12
SRR0908-150ML
15
SRR0908-180ML
18
SRR0908-220ML
22
SRR0908-270ML
27
SRR0908-330ML
33
SRR0908-390ML
39
SRR0908-470ML
47
SRR0908-560ML
56
SRR0908-680ML
68
SRR0908-820ML
82
SRR0908-101YL
100
SRR0908-121YL
120
SRR0908-151YL
150
SRR0908-181YL
180
SRR0908-221YL
220
SRR0908-271YL
270
SRR0908-331YL
330
SRR0908-391YL
390
SRR0908-471YL
470
SRR0908-561YL
560
SRR0908-681YL
680
SRR0908-821YL
820
SRR0908-102YL 1000
SRR0908-152YL 1500
SRR0908-222YL 2200
SRR0908-332YL 3300
SRR0908-472YL 4700
SRR0908-682YL 6800
SRR0908-822YL 8200
SRR0908-103YL 10000
SRR0908-153YL 15000
Bourns Part No.
Inductance 1
KHz
µH
Tol. %
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±20
±15
±15
±15
±15
±15
±15
±15
±15
±15
±15
±15
±15
±15
±15
±15
±15
±15
±15
±15
±15
±15
20
20
20
18
18
33
40
45
40
35
45
40
45
40
35
30
30
40
42
45
35
35
30
30
33
30
35
30
35
85
120
95
95
90
90
85
110
130
7.96
7.96
7.96
7.96
7.96
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
2.52
0.796
0.796
0.796
0.796
0.796
0.796
0.796
0.796
0.796
0.796
0.796
0.796
0.252
0.252
0.252
0.252
0.252
0.252
0.252
0.0796
0.0796
65.0
0.014
5.60
10.00
114
50.0
0.019
4.80
7.70
84
35.0
0.021
4.40
6.60
74
25.0
0.027
3.80
5.50
60
15.0
0.032
3.40
4.60
50
11.0
0.040
3.00
4.10
43
11.0
0.050
2.50
4.00
41
8.50
0.065
2.20
3.90
36
8.50
0.075
2.00
3.80
34
6.00
0.080
1.90
3.30
31
6.00
0.090
1.80
2.90
27
5.00
0.10
1.70
2.70
25
5.00
0.135
1.50
2.40
23
4.00
0.15
1.40
2.30
21
3.00
1
0.165
1.35
2.10
8
19
2.50
0.184
1.25
1.90
17
2.40
0.26
1.05
1.90
16
10.5
MARKING
0.28
6.00
1.00
14
101
1.30
(.413)
(PIN 1 SIDE)
5.70
0.34
0.90
1.10
13
4.60
4
0.45
0.80
1.00
5
11
4.20
0.50
0.70
1.00
10
3.80
0.60
0.65
0.95
10
3.40
0.70
0.60
0.75
8
9.5 ± 0.3
3.00
0.55
0.70
8
(.374 ± .012)
0.80
2.60
1.00
0.50
0.65
7.5 ± 0.3
7
(.295 ± .012)
2.30
1.15
0.45
0.62
6
12.5 ± 0.5
(.492 ± .020)
1.50
2.20
0.38
0.55
6
11.0 ± 0.5
2.00
1.70
(.433 ± .020)
0.50
0.35
5
1.90
2.20
0.32
0.45
5
1.90
2.20
0.32
0.45
2.5 ± 0.3
4
2.5 ± 0.3
0.35
(.098 ± .012)
0.7 ± 0.1
0.25
1.30
4.00
4
(.028 ± .004) (.098 ± .012)
1.00
5.00
0.20
0.29
3
0.90
8.00
0.15
0.24
2
0.80
12.00
0.12
0.19
2
0.60
16.50
0.10
0.16
2
0.50
24.00
0.10
0.14
2
0.50
26.00
0.09
0.13
1
0.40
40.00
0.08
0.12
1
3.0
(.118)
2.5 ± 0.3
(.098 ± .012)
SRF
Min.
(MHz)
RDC
Max.
(Ω)
**K-
Factor
Test Voltage .......................................1 V
Reflow Soldering .. 230 °C, 50 sec. max.
Operating Temperature
................................-40 °C to +125 °C
(Temperature rise included)
Storage Temperature
................................-40 °C to +125 °C
Resistance to Soldering Heat
................................. 260 °C for 5 sec.
Moisture Sensitivity Level .....................1
ESD Classification (HBM)................. N/A
Materials
Core ............................... Ferrite DR & RI
Wire ............................Enameled copper
Base ................................................ LCP
Terminal ....................................Cu/Ni/Sn
Adhesive .............................. Epoxy resin
Rated Current
...............Ind. drop of 10 % typ. at Isat
Temperature Rise
.....................40 °C max. at rated Irms
Packaging .................... 400 pcs. per reel
Product Dimensions
1
8
MARKING
(PIN 1 SIDE)
4
101
10.0 ± 0.5
(.394 ± .020)
5
9.5 ± 0.3
(.374 ± .012)
12.5 ± 0.5
(.492 ± .020)
7.5 ± 0.3
(.295 ± .012)
11.0 ± 0.5
(.433 ± .020)
2.5 ± 0.3
(.098 ± .012)
Multiple windings possible (up to four
windings).
**K-Factor: To calculate core flux density, Bp-p
(gauss) = K x L(µH) x
Δ
I (peak-to-peak ripple
current, A), determine core loss from
Core
Loss vs. Flux Density
plot.
Recommended Layout
SRR0908-101Y to -153Y
2.2
10.3
(.087)
(.406)
2.2
(.087)
1.0
(.039)
2.5
(.098)
SRR0908-1R5M to -820M
2.2
10.3
(.087)
(.406)
2.2
(.087)
2.5 ± 0.3
0.7 ± 0.1
(.028 ± .004) (.098 ± .012)
9
(.355)
14.7
(.578)
14.7
(.578)
3.0
(.118)
2.5 ± 0.3
(.098 ± .012)
1
4
1
4
5
8
(.406)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
1
5
2.2
2.5
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
(.087)
(.098)
Users should verify actual device performance in their specific applications.
4
8
1.0
(.039)
2.2
(.087)
MM
DIMENSIONS:
(INCHES)
10.3
10.3
(.406)
2.2
(.087)
2.2
(.087)
9
(.355)
14.7
14.7
1
8
MARKING
(PIN 1 SIDE)
4
101
5
10.5
(.413)
SRR0908 Series - SMD Shielded Power Inductors
9.5 ± 0.3
(.374 ± .012)
Core Loss vs. Flux Density
10000
12.5 ± 0.5
(.492 ± .020)
7.5 ± 0.3
(.295 ± .012)
11.0 ± 0.5
(.433 ± .020)
2.5 ± 0.3
(.098 ± .012)
2.5 ± 0.3
0.7 ± 0.1
(.028 ± .004) (.098 ± .012)
1000
Core Loss (mW)
100
10
1
0.10
1 MHz
800 KHz
500 KHz
400 KHz
300 KHz
200 KHz
100 KHz
3.0
(.118)
2.5 ± 0.3
(.098 ± .012)
2.2
(.087)
10.3
0.01
(.406)
10
2.5
(.098)
10.3
(.406)
2.2
(.087)
100
9
(.355)
1000
2.2
(.087)
1.0
(.039)
2.2
Flux Density Bp-p (gauss)
(.087)
(.578)
Electrical Schematics
SRR0908-101Y to -153Y
1
4
1
4
14.7
14.7
(.578)
SRR0908-1R5M to -820M
5
1
8
8
1
4
5
4
8
5
TOP VIEW (Typical Layout)
Termination of each individual winding may be either
Pin 1, 2, 3, or 4.
Termination of opposite end of each individual winding
may be either Pin 5, 6, 7, or 8
Windings will not be terminated to the same pin.
See "Recommended Layout" for SRR0908-1R5M to 820M.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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