SEMICONDUCTOR
TECHNICAL DATA
FEATURES
Low pressure (0~1 )
Easy to use dual in-line package (DIP)
Wide 0~60 compensated temperature range
Span calibration to 2% for low pressure
Zero offset calibration
High performance, stable packaged silicon chip
Gage and differential pressure configurations
KPF010D04~KPF070D04
Semiconductor Pressure Sensor
APPLICATIONS
Medical Equipment
Respiration
HVAC
Level Detection
Flow Measurement
Industrial Control
MODEL NUMBER FOR ORDERING
KP F 000 G 00 A
Package Pin Configuration
No Mark : Standard
A : Type 1
Silicon Pressure Sensor
Package Type
00 : Die
01~ : Package Series
ON/OFF Chip
N:ON Chip (Amplified)
Rated Pressure
F:OFF Chip (Not Amplified) 123
12 10
3
=12,000kPa
Measuring Pressure
A : Absolute Pressure
D : Differential Pressure
G : Gage Pressure
PIP3
MAXIMUM RATING
ITEM
Model No.
Classification
Rated Pressure
0.14
Maximum Pressure Load
Burst Pressure
Bridge Impedance
Operating Temperature
Storage Temperature
0.290
Tenth of Rated Pressure
Fifth of Rated Pressure
3000~6000
-40~125
-55~125
1.015
psi
kPa
kPa
KPF010D04
010
1
SPEC.
KPF020D04
020
2
KPF070D04
070
7
UNIT
-
-
kPa
ELECTRICAL CHARACTERISTICS
ITEM
Classification
Test Condition
Compensational Temperature Range
Full Scale Voltage
Offset Voltage
Linearity
Pressure Hysteresis
Repeatability
Temperature Coefficient Of Offset (TCO)
Temperature Coefficient Of Sensitivity (TCS)
010
Operating Input Current 1.5
SPEC.
020
070
UNIT
-
-
constant, Ambient Temperature Ta=25
0 ~ 60
25~75
2
2.5
0.65
0.3
2.0
2.0
mV
mV
%FS
%FS
%FS
%FS
%FS
Comment) 1. Operating humidity 25~80%RH (unless otherwise noted)
2. Please, consult us when you use any other pressure media except air.
2007. 5. 15
Revision No : 2
1/3
KPF010D04~KPF070D04
RELIABILITY TEST
ITEMS
High Temp. Storage
Low Temp. Storage
Life Test
Steady State Operating
Low Temp. Operating
High Temp. Operating
Temperature / Humidity Operating
Environment Test
Heat Resistance
Temp. Cycle
Vibration
Drop
Mechanical Test
Lead Fatigue
Solderability
120
25
100
40
260
5
, 1000hrs
, 1 million times, Rated Pressure
, 1 million times, Rated Pressure
, 90%RH, 1 million times, Rated Voltage
, 10 seconds
TEST CONDITIONS
-40 , 1000hrs
-20 , 1 million times, Rated Pressure
-40 ~120 , 30minutes/1Cycle, 100Cycles
Amplitude : 1.5mm, Frequency : 10~55Hz,
X, Y, Z(3-directions), 2 hrs each direction
75cm height, 2 times
Tensile Strength : 9.8N(1kgf), 10seconds
Bending Strength : 4.9N(0.5kgf), Right/Left 90 , 1time
230
, 5 seconds
PACKAGE CONFIGURATION AND DIMENSIONS (U
nit : mm
)
Not Used
for Absolute
L = 12.19
8 = 8.38
3.3 OD 2.03ID
2 Tubes
Not Used
for Gage
8
15.24
2.54
7
6
5
3.87
2.54
2.54
2.54
0.9 dia
15.24
Ceramic
Substrate 1.02
8.64 4.45
4.06
0.51 Ref
Cover 9.40 13.97
1
0.51 Typ. 8Pins
3.05
9.40
2
3
4
14.73
8.13
5.08
15
Pin Hole
PIN CONFIGURATION
Pressure Sensor
1
- Out
+
Gain Set
Resistor
ln +
-
6
100K
3.012V
4
5
100K
-
Temminal No.
1
2
3
4
5
6
Meaning
(-) Out
(-) In
(+) Out
(+) In
Gainset resistor
Gainset resistor
2 ln -
+ Out
2007. 5. 15
Revision No : 2
+
3
2/3
KPF010D04~KPF070D04
Note
1. Mounting on printed circuit boards
When mounting a transistor on a printed circuit, it is assumed that
lead wires will be processed or reformed due to space limitation or
relations with other components. Even if no such special
processing reforming is conducted exercise care on the following
points :
(a) Make the spaces of lead wire inserting holes on the printed
circuit board the same as those of lead wires on a transistor.
(b) Even if The spaces are not the same, do not pull the lead
wires or push heavily against the sensor element.
(c) Use a spacer for form a lead maintain space between a sensor
and a printed circuit board, rather than closely contacting
them with each other.
(d) When forming a lead prior to mounting onto a board
- Bend the lead at a point 3mm or more apart from the
body(Lead root).
- Bend one lead wire after securing the other lead wire. (near
the main body)
- Keep space between the sensor main body and and a fixing
jig.
- When bending the lead along the jig, be careful not to
damage it with an edge of the jig.
- Follow other precautions described in respective standard
(e) When mounting a sensor onto a heat sink
- Use the specified accessory.
- Drill threaded holes on the heat kink as per specifications
and keep the surface free from burrs and undulations.
- Use KEC’s recommended silicon grease.
- Tighten the screw within the specified torque.
- Never apply a pneumatic screwdriver to a transistor main
body.
(f) Do not bend or stretch the lead wires repeatedly.
When pulling in the axial directions, apply 500g or 600g
power, depending on the shapes of lead wires.
the sensor lead wires.
(f) When using a soldering iron select those which have less
leakage, and be sure to ground the soldering iron.
3. Cleaning a circuit board
After soldering, circuit boards must be cleaned to remove flux.
Observe the following precautions while cleaning them
(a) When cleaning circuit boards to remove flux, make sure that
no residual reactive ions such as Na or Cl ions remain. Note
that organic solvents react with water to generate hydrogen
chloride and other corrosive gases which can degrade device
performance.
(b) Do not rub the indication marks with a brush or one’s fingers
when cleaning or while a cleaning agent is applied to the
markings.
(c) There are ultrasonic wave cleaning methods which offer a
high cleaning effect within a short time. Since there methods
involve a complicated combination of factors such as the
cleaning bath size, ultrasonic wave vibrator output, and
printed circuit board mounting method, there is fear that the
service life of airtight seal-type sensors may be extremely
shortened. Therefore, as far as possible avoid using the
ultrasonic wave cleaning method.
- Basic requirements of ultrasonic wave cleaning method.
Frequency : 27~29kHz
Output : 300W or less (300W/ or less)
Recommended solvents : Refer to details above
Cleaning time : 30seconds or less
2. Soldering
When soldering a sensor to a printed circuit board, the soldering
temperature is usually so high that it adversely affects the sensor.
Normally, tests are conducted at a soldering temperature of 265
for 10 seconds or 300
for 3 seconds. Be sure to complete
soldering procedures under these conditions of temperature and
time.
Be careful to select a type of flux that will neither corrode the
lead wires nor affect the electrical characteristics of a sensor.
The basic precautions for soldering procedures are as follows :
(a) Complete soldering procedures in a time as short as possible.
(b) Do not apply stress to a sensor after soldering by correcting
or modifying its location or direction.
(c) For a sensor employing a heat sink, mount it on the heat sink
first: then solder this unit to a printed circuit board after
confirming that it is fully secured.
(d) Do not directly solder the heat-radiating portion of a sensor
to a printed circuit board.
(e) In flow solder jobs, sensors are apt to float on the solder due
to solder surface tension. When adjusting the locations of
sensor, be careful not to apply excessive stress to the roots of
2007. 5. 15
Revision No : 2
3/3
FPGA/CPLD
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