PL
IA
NT
Features
n
Unit height of 2.9 mm
n
Inductance range: 1500 to 10,000 μH
n
Rated current up to 0.12 A
n
RoHS compliant*
Applications
n
DC/DC converters
n
Power supplies for:
*R
oH
S
C
OM
• Portable communication equipment
• Laptop computers
• Camcorders, HDTV
LE
AD
F
RE
E
Electrical Characteristics
Inductance
@ 100 KHz
L (μH)
±20 %
1500
2200
3300
4700
6800
10,000
Ro VE LEA
HS RS D
C ION FRE
OM S E
PL AR
IA E
NT
*
Bourns Part No.
SRE6603-152M
SRE6603-222M
SRE6603-332M
SRE6603-472M
SRE6603-682M
SRE6603-103M
**K-Factor: To calculate core flux density, Bp-p (gauss) = K x L(µH) x
Δ
I (peak-to-peak ripple current, A),
determine core loss from
Core Loss vs. Flux Density
plot.
Core Loss vs. Flux Density
2
22
Q
(Ref.)
50
50
50
50
50
50
Test
Freq.
(KHz)
100
100
100
100
100
100
10
1
0.1
0.01
0.001
100
1000
SRE6603 Series - Shielded SMD Power Inductors
General Specifications
SRF
(MHz)
Typ.
2
2
1
1
1
0.8
DCR
(W)
Max.
4.2
8.5
11
13.9
25
32.8
I rms
(A)
0.12
0.10
0.08
0.06
0.04
0.02
6.60
(0.260)
MAX.
I sat
(A)
0.035
0.028
0.024
0.021
0.019
0.017
**K
-Factor
82
68
53
48
37
31
Test Voltage ....................................0.1 V
Reflow Soldering ... 230 °C, 50 sec max.
Operating Temperature
................................-25 °C to +105 °C
(Temperature rise included)
Storage Temperature
................................-40 °C to +125 °C
Resistance to Soldering Heat
............................... 260 °C for 10 sec.
Moisture Sensitivity Level .....................1
ESD Classification (HBM)................. N/A
Materials
Core ..............................................Ferrite
Wire ............................Enameled copper
Base ..........................................Ceramic
Adhesive .............................. Epoxy resin
Terminal ....................................Ag/Ni/Au
Rated Current
...............Ind. drop of 30 % typ. at Isat
Temperature Rise ...40 °C typical at Irms
Packaging ..... 2000 pcs. per 13-inch reel
Product Dimensions
6.60
(0.260)
MAX.
4.45
(0.175)
MAX.
1.27 ± 0.2
(0.050 ± 0.008)
Core Loss (mW)
4.32 ± 0.3
(0.170 ± 0.012)
1.02 ± 0.2
(0.040 ± 0.008)
3.90 ± 0.3
(0.154 ± 0.012)
1 MHz
800 KHz
500 KHz
400 KHz
300 KHz
200 KHz
100 KHz
4.45
(0.175)
MAX.
2.92
(0.115)
MAX.
1.27 ± 0.2
(0.050 ± 0.008)
10000
Flux Density Bp-p (gauss)
Schematic
Recommended Layout
3.56
(0.140)
6.86
REF.
(0.270)
4.32 ± 0.3
(0.170 ± 0.012)
1.02 ± 0.2
(0.040 ± 0.008)
3.90 ± 0.3
(0.154 ± 0.012)
2.92
(0.115)
MAX.
1.4
(0.055)
4.06
(0.160)
1.4
(0.055)
MM
DIMENSIONS:
(INCHES)
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
6.86
3.56
REF.
Users should verify actual device performance in their specific applications.
(0.270)
(0.140)
SRE6603 Series - Shielded SMD Power Inductors
Soldering Profile
275
225
175
125
75
25
<1> Maximum of 10 seconds
between +255 °C and +260 °C
<1> 255 °C
220 °C
60 seconds
maximum
Ramp Down
5 °C/second
260 °C peak
275
225
175
125
75
25
<1> 5 seconds maximum
at +245 °C
<1> 245 °C
170 °C
150 °C
120 -150 seconds
Temperature (°C)
190°C
150 °C
120-150 seconds
Temperature (°C)
183 °C
60 seconds
maximum
10 seconds minimum
10 seconds mini
Ramp Up
4 °C/second maximum
0
50
100
150
Ramp Up
4 °C/second maximum
0
50
100
150
200
250
300
20
Time (Seconds)
Time (Seconds)
Packaging Specifications
330.0
(13.00)
DIA.
2.0 ± 0.5
(.079 ± .020)
THICKNESS
0.10
(.004)
MAX.
100.0 ± 2.0
(3.94 ± .079)
13.5 ± 0.5
DIA.
(.53 ± .020)
EMBOSSED
CARRIER
EMBOSSED
CAVITY
13.5 ± 0.5
(0.53 ± .020)
DIA.
16.5 ± 0.5
(0.65 ± 0.020)
1.75 ± 0.1
(0.069 ± 0.004)
4.0 ± 0.1
(0.157 ± 0.004)
2.0 ± 0.1
(0.079 ± 0.004)
1.5 ± 0.1
(0.059 ± 0.004)
16.0 ± 0.3
(0.629 ± 0.012)
7.5 ± 0.1
(0.295 ± 0.004)
8.0 ± 0.1
(0.315 ± 0.004)
0.35 ± 0.05
(0.014 ± 0.002)
4.4 ± 0.1
(0.173 ± 0.004)
6.7 ± 0.1
(0.264 ± 0.004)
MM
DIMENSIONS:
(INCHES)
3.2 ± 0.1
(0.126 ± 0.004)
USER DIRECTION OF FEED
QTY: 2000 PCS. PER REEL
REV. 03/18
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
