FCT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, LCC20,.35SQ |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 系列 | FCT |
| JESD-30 代码 | S-CQCC-N20 |
| JESD-609代码 | e0 |
| 长度 | 8.89 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.048 A |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 输出极性 | INVERTED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC20,.35SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 5.2 ns |
| 传播延迟（tpd） | 8.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.905 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 8.89 mm |
| Base Number Matches | 1 |
| 74FCT533ALCQR | 74FCT533APCQR | 74FCT533ALC | 74FCT533AFCQR | 74FCT533AFC | 74FCT533ASCQR | |
|---|---|---|---|---|---|---|
| 描述 | FCT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20 | FCT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDIP20, PLASTIC, DIP-20 | IC FCT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20, Bus Driver/Transceiver | FCT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDFP20, CERAMIC, FP-20 | FCT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, CDFP20, CERAMIC, FP-20 | IC FCT SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDSO20, SOIC-20, Bus Driver/Transceiver |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | QLCC | DIP | QLCC | DFP | DFP | SOIC |
| 包装说明 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 | QCCN, LCC20,.35SQ | DFP, FL20,.3 | DFP, FL20,.3 | SOP, SOP20,.4 |
| 针数 | 20 | 20 | 20 | 20 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 系列 | FCT | FCT | FCT | FCT | FCT | FCT |
| JESD-30 代码 | S-CQCC-N20 | R-PDIP-T20 | S-CQCC-N20 | R-GDFP-F20 | R-GDFP-F20 | R-PDSO-G20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | 0.048 A | 0.048 A | 0.048 A | 0.048 A | 0.048 A | 0.048 A |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED | INVERTED |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | QCCN | DIP | QCCN | DFP | DFP | SOP |
| 封装等效代码 | LCC20,.35SQ | DIP20,.3 | LCC20,.35SQ | FL20,.3 | FL20,.3 | SOP20,.4 |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | CHIP CARRIER | FLATPACK | FLATPACK | SMALL OUTLINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | 5.2 ns | 5.2 ns | 5.2 ns | 5.2 ns | 5.2 ns | 5.2 ns |
| 传播延迟（tpd） | 8.5 ns | 8.5 ns | 8.5 ns | 8.5 ns | 8.5 ns | 8.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.905 mm | 5.08 mm | 1.905 mm | 2.286 mm | 2.286 mm | 2.65 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD | THROUGH-HOLE | NO LEAD | FLAT | FLAT | GULL WING |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | QUAD | DUAL | DUAL | DUAL |
| 宽度 | 8.89 mm | 7.62 mm | 8.89 mm | 6.731 mm | 6.731 mm | 7.5 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | - |
| Is Samacsys | N | - | N | N | N | - |
| 长度 | 8.89 mm | 24.892 mm | 8.89 mm | - | - | 12.8 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
