Series LA-B3
Technical
METAL CASE, CASE-MOUNTED
SEMICONDUCTORS
Part Number Series LA-B3
Natural Conv. (°C/W): 12
Forced Air (°C/W): 3.7
Mounting Envelope: 1.63" x 1.29" x .75"
DESCRIPTION OF CURVES
A.
B.
C.
D.
E.
N.C. Horiz. Device Only
Mounted to G-10.
N.C Horiz. & Vert. With
Dissipator.
200 FPM w/Diss.
500 FPM w/Diss.
1000 FPM w/Diss.
•
•
Thermal Resistance Case to Sink is 0.1-0.3
°C/W
w/Joint Compound.
Derate 0.7
°C/watt
for unplated part in natural convection only.
Ordering Information
Unplated
LA000B3U
LAT03B3U
LAIC3B3U
LA407B3U
LA394B3U
CTS IERC PART NO.
Comm'l. Black
Anodize
LA000B3CB
LAT03B3CB
LAIC3B3CB
LA407B3CB
LA394B3CB
Mil. Black
Anodize
LA000B3B
LAT03B3B
LAIC3B3B
LA407B3B
LA394B3B
Semiconductor
Accommodated
Undrilled
TO-3
TO-3 IC
TO-3 (4-pin)
Universal
Hole patt. ref.
no.
--
2
4
5
8
Max. Weight
(Grams)
10.8
10.8
10.8
10.8
10.8
HOLE PATTERNS
2.
Hole Pattern no. 236 accommodates TO-3s. Available in LA-
4.
Hole pattern no. 237 accommodates To-3 ICs. Available in
B series heat dissipators only.
LA-B series heat dissipators only.
5.
Hole pattern no. 407 accommodates TO-3s (4-pin). Available
in LA-B series heat dissipators only.
8.
Hole pattern no. 394 (universal) accommodates TO-3s, TO-
66s, TO-126s, TO-127s, or T)-220s. Available in LA-B series
heat dissipators only.
CTS IERC, Heat Sinks and Thermal Management Solutions
413 North Moss Street, Burbank, California 91502
Tel: (818) 842-7277
Fax: (818) 848-8872
Rev. 08-29-03
微控制器 MCU
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