IO
SOCKETS
SERIES 896, 897 • UNIVERSAL SERIAL BUS 3.0 • SOCKETS
•
USB 3.0 receptacles for through-hole mount
•
Plug retention tabs
.236
.543
•
Kinked locating legs for secure PCB retention
•
Fully shielded
•
Fully backwards compatible with USB 2.0
.492
PIN 5
.118
.650
•
10X faster than USB 2.0 and provides
.275
PIN 9
PIN 1
.202
PIN 4
.110
.276
•
optimized power efficiency
Packaged in trays:
896-46-009-90-300000 - 100 pieces per tray
897-46-009-90-300000 - 80 pieces per tray
.039 (2x)
.138 (2x)
.517
.618
.079 (2x)
.157 (2x)
.079
.138
.402
ORDERING INFORMATION
USB 3.0 Type A Receptacle, Single, Through-Hole
.079 (5x)
.101
9
8
2
7
3
6
4
5
FIG. 1
Ø.028±.002
(8 PLC)
.079
Ø.036±.004
(2 PLC)
896-46-009-90-300000
USB 3.0 Type B Receptacle, Single, Through-Hole
.059
1
.121
.098 (2x)
.517
FIG. 2
897-46-009-90-300000
FIG. 1
.472
.333
.112
.472
.594
.474
.335
.098
.069
.070
5
6
2
7
1
8
9
.079 (2x)
.150
.049 (4x)
.079
Ø.028±.002
(5 PLC)
Ø.036±.004
(4 PLC)
Ø.091±.004
(2 PLC)
.079
.079
.107
.188
.237
3 4
.098
.049
FIG. 2
Mill-Max Mfg. Corp. • 190 Pine Hollow Road, P.O. Box 300, Oyster Bay, NY 11771 • 516-922-6000 • Fax: 516-922-9253 • www.mill-max.com
PAGE 147 | IO SOCKETS
Materials:
RoHS - 2
2011/65/EU
Terminals: Copper Alloy, Tin-Plated
Contacts: Copper Alloy, Gold Flash over PdNi
Casing and Shield: Stainless Steel
Insulator material: High temperature thermoplastic rated UL94V-0
Ratings:
Voltage: 30VAC (rms)
Current: 1.5A PWR/GND pins
All housing materials rated for “lead-free” soldering up to 260º C
Electrical:
Contact resistance: 30mW max. for power and ground pins
50mW max. for all others
Insulation resistance: 100MW min.
Dielectric withstanding voltage: 100VAC at sea level
Capacitance: 2pF max.
Mechanical:
Random vibration: No discontinuity >1μs per EIA 364-28, cond. VII, letter D
Physical shock: No discontinuity >1μs per EIA 364-27, condition H
Durability: 5000 cycles min. per EIA 364-09
Mating force: 35 Newtons max. per EIA 364-13
Unmating force: Initial - 10 Newtons min. per EIA 364-13
After test - 8 Newtons min. per EIA 364-13
Environmental:
Thermal shock per EIA 364-32, condition I
Humidity per EIA 364-31
Temperature life per EIA 364-17, method A
Solderability per EIA 364-52, category 2
Technical Specifications
.425
.406
.726
.508