AS5115
Programmable 360° Magnetic Angle
Encoder with Buffered Sine and Cosine
Output Signals
General Description
The AS5115 is a contactless rotary encoder sensor for accurate
angular measurement over a full turn of 360° and over an
extended ambient temperature range of -40°C to 150°C.
Based on an integrated Hall element array, the angular position
of a simple two-pole magnet is translated into analog output
voltages. The angle information is provided by means of
buffered sine and cosine voltages. This approach gives
maximum flexibility in system design, as it can be directly
integrated into existing architectures and optimized for various
applications in terms of speed and accuracy.
An SSI Interface is implemented for signal path configuration
as well as a one time programmable register block (OTP), which
allows the customer to adjust the signal path gain to adjust for
different mechanical constraints and magnetic field.
Ordering Information
and
Content Guide
appear at end of
datasheet.
Key Benefits & Features
The benefits and features of AS5115, Programmable 360°
Magnetic Angle Encoder with Buffered Sine and Cosine Output
Signals are listed below:
Figure 1:
Added Value of Using AS5115
Benefits
•
Highest reliability and durability
•
Simple programming
•
High precision analog output
•
Very low average power consumption
•
Easy setup
•
Fully automotive qualified
•
Small form factor
•
Robust environmental tolerance
Features
•
Contactless high resolution rotational position
encoding over a full turn of 360 degrees
•
Simple user-programmable over serial interface (SSI)
•
Buffered sine and cosine output signals
•
Low Power mode
•
Serial read-out of multiple interconnected devices
using daisy chain mode
•
AEC-Q100, grade 0
•
SSOP 16
•
Wide temperature range: -40°C to 150°C
ams Datasheet
[v1-16] 2016-Nov-17
Page 1
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AS5115 −
General Description
Applications
The AS5115 is ideal for several automotive and industrial
applications such as
•
Microcontroller-based systems
•
Contactless rotary position sensing
•
General purpose for automotive and industrial
applications
Block Diagram
The functional blocks of this device are shown below:
Figure 2:
AS5115 Block Diagram
PROG
OTP Register
Digital Part
AS5115
VDD
VSS
CS
DCLK
DIO
SSI Interface
Power
Management
Buffer Stage
SINP/SINN
SINN/SINP/CM_SIN
Buffer Stage
Hall Array
&
Frontend
Amplifier
COSP/COSN
COSN/COSP/CM_COS
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ams Datasheet
[v1-16] 2016-Nov-17
AS5115 −
Pin Assignments
Pin Assignments
Figure 3:
Pin Diagram (Top View)
DCLK
CS
DIO
TC
A_TST
PROG
VSS
SINP/SINN
1
2
3
4
5
6
7
8
16
15
14
VDD
TB0
TB1
TB2
TB3
COSN/COSP/CM_COS
COSP/COSN
SINN/SINP/CM_SIN
AS5115
13
12
11
10
9
Pin Description
Figure 4:
Pin Description
Pin Name
DCLK
CS
DIO
TC
A_TST
PROG
VSS
SINP/SINN
SINN/SINP/CM_SIN
COSP/COSN
COSN/COSP/CM_COS
Pin
Number
1
2
3
4
5
6
Supply pad
7
8
9
Pin Type
Description
Clock input for digital interface
Digital input with Schmitt trigger
Clock input for digital interface,
Scan enable
Data I/O for digital interface, Scan
input
Test coil
Analog test pin, Scan output
OTP programming pad
Also used as VSS of test coil +
EasyZapp (double bond)
Digital input/output
Analog input/output
Analog output/Digital output
Analog output
10
11
Buffered analog output
ams Datasheet
[v1-16] 2016-Nov-17
Page 3
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AS5115 −
Absolute Maximum Ratings
Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only. Functional operation of the device at these or any
other conditions beyond those indicated under
Operating
Conditions
is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device
reliability.
Figure 5:
Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Units
Comments
Electrical Parameters
V
DD
V_in
Supply voltage
Input pin voltage
Input current
(latchup
immunity)
-0.3
-0.3
7
V
DD
+ 0.3
100
V
V
I_scr
-100
mA
EIA/JESD78 Class II Level A
Electrostatic Discharge
ESD
HBM
Electrostatic
discharge
±2
kV
JESD22-A114E
Continuous Power Dissipation
P
tot
Q_JA
Total power
dissipation
Package thermal
resistance
275
110
mW
°C/W
Velocity =0; Multi Layer PCB; Jedec
Standard Testboard
Temperature Ranges and Storage Conditions
T_strg
Storage
temperature
-65
150
°C
IPC/JEDEC J-STD-020.
The reflow peak soldering temperature
(body temperature) specified is in
accordance with IPC/JEDEC J-STD-020
“Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid
State Surface Mount Devices”. The lead
finish for Pb-free leaded packages is
matte tin(100% Sn).
T_body
Package body
temperature
260
°C
RH
NC
Relative humidity
non-condensing
Moisture
sensitivity level
5
85
%
Represents a maximum floor time of
168h
MSL
3
ams Datasheet
[v1-16] 2016-Nov-17
Page 5
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