Reference:CMV12000-datasheet-v2.12
CMV12000 v2 Datasheet
Page 1 of 79
12 Megapixel machine vision CMOS image sensor
Datasheet
© 2016 CMOSIS bvba
Reference:CMV12000-datasheet-v2.12
CMV12000 v2 Datasheet
Change record
Issue
v2.0
Date
10/9/2013
Modification
Origination
Splitting up the datasheets for v1 (300MHz) and v2
(600MHz) devices.
Removed:
- High-grade variant from ordering info as all devices
are now high grade.
Updated:
- Supply settings
- Figures 21, 23
- Title of 4.3
- References
Added:
- Chapter 5.13: Power Control
Updated:
- Frame rate formula (ch 3.6) of XY-subsampling
(frame rate x2)
- Frame rate overview (ch 3.6)
- Additional required register settings (ch 5.17)
- Offset register values (ch 5.14.1)
Removed:
- Preliminary annotations
Updated:
- Figure 54: Color binning, pixel to output remapping
- Exposure time calculation and FOT overlap
Added:
- ADC range multipliers for slow clock speeds
- ADC range vs. clock speed plot
Updated:
- VDD18 peak current
1.7A
- ADC_range vs. clock speed for 8bit
- Minimum exposure times
- Temperature sensor description
- Power consumption 2.2W
4.2W
Added:
- Typical LVDS output skew (Figure 35)
- Self-heating
Updated:
- Temperature sensor formulas now using the CLK_IN
frequency.
- Digital gain; more detailed
- ADC range vs. clock speed charts
- Recommended ADC range setting for 8bit to 205
(matches 10b/12b more closely)
- Register 110: Set to 12368
- Register 112: Set to 227
- Additional required registers in 5.17 (increase fps
and IQ for binning and XY-subsampling, decrease
FOT and min. exposure time, less variation in
settings)
Added:
- Reg 107[14:7] vs. clock speed
Page 2 of 79
V2.1
20/01/2014
V2.2
14/02/2014
V2.3
13/03/2014
V2.4
04/07/2014
V2.5
08/08/2014
© 2016 CMOSIS bvba
Reference:CMV12000-datasheet-v2.12
CMV12000 v2 Datasheet
Issue
V2.6
Date
22/08/2014
Modification
Updated:
- Reg 83, 113, 114 for 10bit normal mode (ch 5.17.3)
- Reg 112 = 277
Updated:
- Figures for multiple slopes. The figures are also
correct when using only 1 knee point.
- Temperature sensor offset in DN instead of °C/DN
- Register 102 to 8302 to decrease column FPN
Added:
- Tilt and rotation of die in assembly drawing
- SPI I/O’s pulled low when not used/enabled.
- QE and part number of NIR device
Updated:
- Binning sums the pixels in the analog domain
- In binning mode, only PGA /3 is useable
- Changed registers 82, 84, 85, 86, 113, 114 in 5.17.4
for 12b normal mode when using 32 channels per
side to increase the useable swing. Maximum frame
rate decreases from 140 to 132 fps.
Added:
- Internal PLL
Updated:
- Connect pins C5 & D6 to ground (see also AN10)
- Reg98 35852
36364 for 12b Subsampling in X
and Y mode in chapter 5.17.4.
Removed:
- Internal PLL because of instability (see also ES01)
Updated:
- Window size limitations depending on mode
- Pins E4, F4, G3, H4: connect to ground
- ADC range example
- CLK_IN optional, only for temp. sensor
- Reflow solder profile
- Test Pattern for 8b mode
- Register 99: 34952
34956
Added:
- MSL3 rating
- Excessive light caution
Updated:
- QE and SR plots
- Dark current and DSNU figures
- Typical slope temperature sensor units
Added:
- Test Pattern for 8b
- Angular response
- Package materials
Disclaimer
Page 3 of 79
V2.7
18/12/2014
V2.8
10/02/2015
V2.9
04/03/2015
2.10
2.11
27/10/2015
15/03/2016
2.12
03/10/2016
© 2016 CMOSIS bvba
Reference:CMV12000-datasheet-v2.12
CMV12000 v2 Datasheet
Page 4 of 79
CMOSIS reserves the right to change the product, specification and other information contained in this document
without notice. Although CMOSIS does its best efforts to provide correct information, this is not warranted
© 2016 CMOSIS bvba
Reference:CMV12000-datasheet-v2.12
CMV12000 v2 Datasheet
Page 5 of 79
Table of Contents
1 Introduction ...........................................................................................................................................................9
1.1 Overview ............................................................................................................................................................... 9
1.2 Features ................................................................................................................................................................ 9
1.3 Specifications ........................................................................................................................................................ 9
1.4 Connection diagram ........................................................................................................................................... 10
2 Sensor architecture .............................................................................................................................................. 11
2.1 Pixel array ........................................................................................................................................................... 11
2.2 Analog front end ................................................................................................................................................. 12
2.3 LVDS block .......................................................................................................................................................... 12
2.4 Sequencer ........................................................................................................................................................... 12
2.5 SPI interface ........................................................................................................................................................ 12
2.6 Temperature sensor ........................................................................................................................................... 12
3 Driving the CMV12000 ......................................................................................................................................... 14
3.1 Supply settings .................................................................................................................................................... 14
3.2 Biasing ................................................................................................................................................................. 14
3.3 Digital input pins ................................................................................................................................................. 14
3.4 electrical IO specifications .................................................................................................................................. 15
3.4.1
3.4.2
3.4.3
Digital IO CMOS/TTL DC specifications ...................................................................................................................... 15
LVDS receiver specifications ...................................................................................................................................... 15
LVDS driver specifications.......................................................................................................................................... 16
3.5 Input clock .......................................................................................................................................................... 16
3.6 Frame rate .......................................................................................................................................................... 16
3.7 Start-up sequence............................................................................................................................................... 17
3.8 Reset sequence ................................................................................................................................................... 17
3.9 SPI programming ................................................................................................................................................ 18
3.9.1
3.9.2
SPI write..................................................................................................................................................................... 18
SPI read ...................................................................................................................................................................... 19
3.10 Requesting a frame ............................................................................................................................................. 19
3.10.1 Internal exposure control .......................................................................................................................................... 19
3.10.2 External exposure control ......................................................................................................................................... 21
4 Reading out the sensor ........................................................................................................................................ 22
4.1 LVDS data outputs .............................................................................................................................................. 22
4.2 Low-level read out timing ................................................................................................................................... 22
4.3 Pixel read-out ..................................................................................................................................................... 23
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