4-CHANNEL, DIFFERENTIAL MULTIPLEXER, CDIP16
IH6208 | IH6208CJE | IH6208MFE/883B | IH6208CPE | IH6208MJE/883B | IH6208MJE | |
---|---|---|---|---|---|---|
描述 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, CDIP16 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, CDIP16 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, CDIP16 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, CDIP16 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, CDIP16 | 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, CDIP16 |
是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | - | Harris | Harris | Harris | Harris | Harris |
包装说明 | - | DIP, DIP16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | - | unknown | unknown | unknow | unknow | unknow |
模拟集成电路 - 其他类型 | - | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER | DIFFERENTIAL MULTIPLEXER |
JESD-30 代码 | - | R-GDIP-T16 | R-CDFP-F16 | R-PDIP-T16 | R-GDIP-T16 | R-GDIP-T16 |
JESD-609代码 | - | e0 | e0 | e0 | e0 | e0 |
标称负供电电压 (Vsup) | - | -15 V | -15 V | -15 V | -15 V | -15 V |
信道数量 | - | 4 | 8 | 4 | 8 | 4 |
功能数量 | - | 1 | 1 | 1 | 1 | 1 |
端子数量 | - | 16 | 16 | 16 | 16 | 16 |
标称断态隔离度 | - | 60 dB | 60 dB | 60 dB | 60 dB | 60 dB |
通态电阻匹配规范 | - | 36 Ω | 60 Ω | 36 Ω | 60 Ω | 36 Ω |
最大通态电阻 (Ron) | - | 350 Ω | 300 Ω | 350 Ω | 300 Ω | 300 Ω |
最高工作温度 | - | 70 °C | 125 °C | 70 °C | 125 °C | 125 °C |
封装主体材料 | - | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | - | DIP | DFP | DIP | DIP | DIP |
封装等效代码 | - | DIP16,.3 | FL16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | - | IN-LINE | FLATPACK | IN-LINE | IN-LINE | IN-LINE |
峰值回流温度(摄氏度) | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
电源 | - | +-15 V | +-15 V | +-15 V | +-15 V | +-15 V |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大信号电流 | - | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A |
最大供电电流 (Isup) | - | 1 mA | 0.2 mA | 1 mA | 0.2 mA | 0.2 mA |
标称供电电压 (Vsup) | - | 15 V | 15 V | 15 V | 15 V | 15 V |
表面贴装 | - | NO | YES | NO | NO | NO |
切换 | - | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | - | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | MILITARY |
端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | - | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | - | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | - | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
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