Operating Temperature Range ........................... -40°C to +85°C
Junction Temperature ......................................................+150°C
Storage Temperature Range ............................ -55°C to +125°C
Lead Temperature (soldering, 10s) ................................. +300°C
Soldering Temperature (reflow) .......................................+260°C
ESD Protection (All Pins, Human Body Model) ..................±2kV
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics
(Note 1)
TQFP
Junction-to-Ambient Thermal Resistance (θ
JA
) ..........36°C/W
Junction-to-Case Thermal Resistance (θ
JC
) .....................4°C/W
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Recommended Operating Conditions
(T
A
= -40°C to +85°C, unless otherwise noted.) (Notes 2, 3)
PARAMETER
Supply Voltage
Input Logic 1
(RST, CSW, SCK, DIN,
CE)
Input Logic 0
(RST, CSW, SCK, DIN,
CE)
Input Logic 1 (32KX1)
Input Logic 0 (32KX1)
SYMBOL
V
CC
V
IH
V
IL
V
IH32KX1
V
IL32KX1
CONDITIONS
MIN
2.3
V
CC
x 0.7
-0.3
V
CC
x 0.85
-0.3
TYP
3.0
MAX
3.6
V
CC
+ 0.3
V
CC
x 0.3
V
CC
+ 0.3
V
CC
x 0.15
UNITS
V
V
V
V
V
Electrical Characteristics
(V
CC
= 2.3V to 3.6V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at V
CC
= 3.0V and T
A
= +25°C.) (Notes 2, 3)
PARAMETER
Input Leakage
(CSW,
RST,
SCK, DIN,
CE)
Output Leakage
(INT,
WDO,
T1,T2,T3,T4)
Output Voltage Low (32KOUT)
Output Voltage High (32KOUT)
Output Voltage High
(DOUT, CMP_OUT/UP_DN)
Output Voltage High (TC)
V
OL32K
V
OH32K
V
OH
V
OHTC
2mA
-1mA
-4mA
V
CC
= 3.3V, I
OUT
= -4mA
0.8 x V
CC
0.8 x V
CC
2.9
3.1
SYMBOL
I
L
CONDITIONS
MIN
-0.1
-0.1
TYP
MAX
+0.1
+0.1
0.2 x V
CC
UNITS
µA
µA
V
V
V
V
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Maxim Integrated
│
2
MAX35101
Time-to-Digital Converter with Analog Front-End
Electrical Characteristics (continued)
(V
CC
= 2.3V to 3.6V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at V
CC
= 3.0V and T
A
= +25°C.) (Notes 2, 3)
PARAMETER
Output Voltage High
(Launch_UP, Launch_DN)
Output Voltage Low (WDO,
INT,
DOUT, CMP_OUT/UP_DN)
Pulldown Resistance (TC)
Input Voltage Low (TC)
Output Voltage Low
(Launch_UP, Launch_DN)
Resistance (T1, T2, T3, T4)
Input Capacitance
(CE, SCK, DIN,
RST,
CSW)
RST
Low Time
CURRENT
Standby Current
32kHz OSC Current
4MHz OSC Current
LDO Bias Current
Time Measurement Unit Current
Calculator Current
I
DDQ
I
32KHZ
I
4MHZ
I
CCLDO
I
CCTMU
I
CCCPU
I
CC3
Device Current Drain
I
CC6
FLASH Erase Current
ANALOG RECEIVER
Analog Input Voltage
(STOP_UP, STOP_DN)
Input Offset Step Size
STOP_UP/STOP_DN Bias Voltage
Receiver Sensitivity
TIME MEASUREMENT UNIT
Measurement Range
Time Measurement Accuracy
Time Measurement Resolution
t
MEAS
t
ACC
t
RES
Time of flight
Differential time measurement
8
20
3.8
8000
µs
ps
ps
V
ANA
V
STEP
V
BIAS
V
ANA
Stop hit detect level (Note 5)
10
10
700
1
V
CC
x (3/8)
V
CC
x
(3/8)
2x
mV
P-P
mV
V
mV
P-P
I
FLASH
TOF_DIFF = 2 per second (3 hits),
temperature = 1 per 30s
TOF_DIFF = 2 per second (6 hits),
temperature = 1 per 30s
No oscillators running, T
A
= +25°C
32kHz oscillator only (Note 4)
4MHz oscillator only (Note 4)
I
CCCPU
= 0 (Note 4)
(Note 4)
0.1
0.5
40
15
4.5
2.5
10
µA
13
0.5
1
mA
1
0.9
85
35
8
5
µA
µA
µA
µA
mA
mA
SYMBOL
V
OHLAUCH
V
OL
R
TC
V
ILTC
V
OLLAUCH
R
ON
C
IN
t
RST
Not tested
V
CC
= 3.3V, I
OUT
= 50mA
CONDITIONS
V
CC
= 3.3V, I
OUT
= -50mA
4mA
650
1000
0.36 x V
CC
0.2
1
7
100
0.4
MIN
2.8
TYP
3.0
0.2 x V
CC
1500
MAX
UNITS
V
V
Ω
V
V
Ω
pF
ns
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Maxim Integrated
│
3
MAX35101
Time-to-Digital Converter with Analog Front-End
Electrical Characteristics (continued)
(V
CC
= 2.3V to 3.6V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at V
CC
= 3.0V and T
A
= +25°C.) (Notes 2, 3)
PARAMETER
FLASH
Data Retention
Flash Endurance
Block Flash Erase Time
LDO Stabilization Time
Word Write Time
Transfer Configuration to Flash
Command Time
EXECUTION TIMES
Power-On-Reset Time
INIT Command Time
Case Switch Time
CAL Command Time
SERIAL PERIPHERAL INTERFACE
DIN to SCK Setup
SCK to DIN Hold
SCK to DOUT Delay
SCK Low Time
SCK High Time
SCK Frequency
CE
to SCK Setup
SCK to
CE
Hold
CE
Inactive Time
CE
to DOUT High Impedance
t
DC
t
CDH
t
CDD
t
CL
t
CH
t
CLK
t
CC
t
CCH
t
CWH
t
CCZ
2
5
V
CC
≥ 3.0V
V
CC
= 2.3V
5
V
CC
≥ 3.0V
V
CC
= 2.3V
25
50
25
2
5
4
30
4
20
10
40
20
40
20
20
20
20
ns
ns
ns
ns
ns
MHz
ns
ns
ns
ns
t
RESET
t
INIT
t
CSW
t
CAL
Reset to POR INT
Command received when INIT bit set
CSW pin logic-high until CSWI bit set
Command received when CAL bit set
275
2.5
20
1.25
µs
ms
ns
ms
D
R
N
FLASH
t
ERASE
t
STABLE
t
WRITE
t
CONFIG
135
72
35
100
T
A
= +25°C
T
A
= +25°C
100
20k
50
Years
Cycles
ms
µs
µs
ms
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
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Maxim Integrated
│
4
MAX35101
Time-to-Digital Converter with Analog Front-End
Recommended External Crystal Characteristics
PARAMETER
32kHz Nominal Frequency
32kHz Frequency Tolerance
32kHz Load Capacitance
32kHz Series Resistance
4MHz Crystal Nominal Frequency
4MHz Crystal Frequency Tolerance
4MHz Crystal Load Capacitance
4MHz Crystal Series Resistance
4MHz Ceramic Nominal Frequency
4MHz Ceramic Frequency
Tolerance
4MHz Ceramic Load Capacitance
4MHz Ceramic Series Resistance
T
A
= +25°C
-0.5
30
30
SYMBOL
f
32K
Δf
32K
/f
32K
C
L32K
R
S32K
F
4M
Δf
4M
/f
4M
C
L4M
R
S4M
4.000
+0.5
T
A
= +25°C
-30
12.0
120
4.000
+30
T
A
= +25°C
-20
12.5
70
CONDITIONS
MIN
TYP
32.768
+20
MAX
UNITS
kHz
ppm
pF
kΩ
MHz
ppm
pF
Ω
MHz
%
pF
Ω
Note 2:
All voltages are referenced to ground. Current entering the device are specified as positive and currents exiting the device
are negative.
Note 3:
Limits are 100% production tested at T
A
= +25°C. Limits over the operating temperature range and relevant supply voltage
range are guaranteed by design and characterization.
Note 4:
Currents are specified as individual block currents. Total current for a point in time can be calculated by taking the standby
current and adding any block currents that are active at that time.
Note 5:
Receiver sensitivity includes performance degradation contributed by STOP_UP and STOP_DN device pin input offset volt-