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MMBD914T

产品描述Diodes - General Purpose, Power, Switching 100V
产品类别半导体    分立半导体   
文件大小191KB,共3页
制造商Micro Commercial Components (MCC)
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MMBD914T概述

Diodes - General Purpose, Power, Switching 100V

MMBD914T规格参数

参数名称属性值
Product AttributeAttribute Value
制造商
Manufacturer
Micro Commercial Components (MCC)
产品种类
Product Category
Diodes - General Purpose, Power, Switching
RoHSN
安装风格
Mounting Style
SMD/SMT
封装 / 箱体
Package / Case
SOT-23
Peak Reverse Voltage100 V
Max Surge Current1 A
If - Forward Current0.15 A
ConfigurationSingle
Recovery Time4 ns
Vf - Forward Voltage0.855 V
Ir - Reverse Current0.025 uA
最小工作温度
Minimum Operating Temperature
- 55 C
最大工作温度
Maximum Operating Temperature
+ 150 C
系列
Packaging
Cut Tape
系列
Packaging
MouseReel
系列
Packaging
Reel
高度
Height
1.12 mm (Max)
长度
Length
3.04 mm (Max)
类型
Type
Ultra Fast Recovery Rectifier
宽度
Width
1.4 mm (Max)
工厂包装数量
Factory Pack Quantity
3000
单位重量
Unit Weight
0.000282 oz

文档预览

下载PDF文档
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

  !"#
$ %    !"#
MMBD914
Features
Low Current Leakage
Halogen free available upon request by adding suffix "-HF"
Small Outline Surface Mount Package
Lead Free Finish/Rohs Compliant ("P"Suffix designates
RoHS Compliant. See ordering information)
C
Pin Configuration
Top View
350mW 100 Volt
Silicon Epitaxial Diode
SOT-23
A
D
5D
A
Maximum Ratings
Operating Temperature: -55°C to +150°C
Storage Temperature: -55°C to +150°C
Maximum Thermal Resistance; 357K/W Junction To Ambient
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
G
F
E
C
B
H
J
Electrical Characteristics @ 25°C Unless Otherwise Specified
Reverse Voltage
Peak Reverse
Voltage
Average Rectified
Current
Power Dissipation
Junction
Temperature
Peak Forward Surge
Current
Maximum
Instantaneous
Forward Voltage
Maximum DC
Reverse Current At
Rated DC Blocking
Voltage
Typical Junction
Capacitance
Reverse Recovery
Time
V
R
V
RM
I
O
P
TOT
T
J
I
FSM
V
F
75V
100V
150mA
350mW
175°C
1.0A
t=1s,Non-Repetitive
Resistive Load
f > 50Hz
DIM
A
B
C
D
E
F
G
H
J
K
INCHES
MIN
.110
.083
.047
.035
.070
.018
.0005
.035
.003
.015
DIMENSIONS
MM
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
.085
.37
MAX
.120
.104
.055
.041
.081
.024
.0039
.044
.007
.020
MAX
3.04
2.64
1.40
1.03
2.05
.60
.100
1.12
.180
.51
NOTE
.855V
I
FM
= 10mA;
T
J
= 25°C*
T
J
= 25°C
V
R
=20Volts
Suggested Solder
Pad Layout
.031
.800
.035
.900
.079
2.000
inches
mm
I
R
25nA
Measured at
1.0MHz, V
R
=0V
T
rr
4nS
I
F
=10mA
V
R
= 6V
R
L
=100Ω
*Pulse test: Pulse width 300
µsec,
Duty cycle 2%
C
J
2pF
.037
.950
.037
.950
Revision:
B
www.mccsemi.com
1 of 3
2013/01/01

 
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