19-5028; Rev 2; 6/10
6-Channel, Flash-Configurable System Manager
with Nonvolatile Fault Registers
General Description
The MAX16067 flash-configurable system manager
monitors and sequences multiple system voltages. The
MAX16067 manages up to six system voltages simulta-
neously. The MAX16067 integrates an analog-to-digital
converter (ADC) and configurable outputs for sequenc-
ing power supplies. Device configuration information,
including overvoltage and undervoltage limits, time
delay settings, and the sequencing order is stored in
nonvolatile flash memory. During a fault condition, fault
flags and channel voltages can be automatically stored
in the nonvolatile flash memory for later readback.
The internal 1% accurate, 10-bit ADC measures each
input and compares the result to one overvoltage and
one undervoltage limit. A fault signal asserts when a
monitored voltage falls outside the set limits.
The MAX16067 supports a power-supply voltage of up to
14V and can be powered directly from the 12V interme-
diate bus in many systems.
The integrated sequencer provides precise control over
the power-up and power-down order of up to six power
supplies. Three outputs (EN_OUT1 to EN_OUT3) are
configurable with charge-pump outputs to directly drive
external n-channel MOSFETs.
The MAX16067 includes six programmable general-
purpose inputs/outputs (GPIOs). GPIOs are flash con-
figurable as a fault output, as a watchdog input or output,
or as a manual reset.
The MAX16067 features nonvolatile fault memory for
recording information during system shutdown events.
The fault logger records a failure in the internal flash
and sets a lock bit protecting the stored fault data from
accidental erasure.
An SMBus™ or a JTAG serial interface configures the
MAX16067. The MAX16067 is available in a 32-pin, 5mm
x 5mm, TQFN package and is fully specified over the
-40NC to +85NC extended temperature range.
S
Operates from 2.8V to 14V
S
1% Accurate, 10-Bit ADC Monitors 6 Voltage
Inputs
S
Analog EN Monitoring Input
S
6 Monitored Inputs with Overvoltage and
Undervoltage Limits
S
Nonvolatile Fault Event Logger
S
Power-Up and Power-Down Sequencing
Capability
S
6 Outputs for Sequencing/Power-Good Indicators
S
3 Configurable Charge-Pump Outputs
S
Six General-Purpose Inputs/Outputs Configurable
as:
Dedicated Fault Output
Watchdog Timer Function
Manual Reset
SMBus Alert
Fault Propagation Input/Output
S
SMBus and JTAG Interface
S
Supports Cascading with MAX16065/MAX16066
S
Flash-Configurable Time Delays and Thresholds
S
-40NC to +85NC Extended Operating Temperature
Range
Features
MAX16067
Applications
Networking Equipment
Telecom Equipment (Base Stations, Access)
Storage/RAID Systems
Servers
Typical Operating Circuit appears at end of data sheet.
Ordering Information/Selector Guide
PART
PIN-PACKAGE
VOLTAGE-
DETECTOR INPUTS
GENERAL-PURPOSE
INPUTS/OUTPUTS
6
SEqUENCING
OUTPUTS
6
MAX16067ETJ+
32 TQFN-EP*
6
Note:
This device is specified over the -40NC to +85NC extended temperature range.
+Denotes
a lead(Pb)-free/RoHS-compliant package.
*EP
= Exposed pad.
SMBus is a trademark of Intel Corp.
_______________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
6-Channel, Flash-Configurable System Manager
with Nonvolatile Fault Registers
MAX16067
ABSOLUTE MAXIMUM RATINGS
V
CC
to GND ...............……………………………….-0.3V to +15V
MON_, SCL, SDA, A0 to GND ................................-0.3V to +6V
EN, TCK, TMS, TDI to GND ....................................-0.3V to +4V
TDO to GND ............................................-0.3V to (V
DBP
+ 0.3V)
EN_OUT1, EN_OUT2, EN_OUT3
(configured as open-drain) to GND ..................-0.3V to +15V
EN_OUT1, EN_OUT2, EN_OUT3
(configured as charge pump) to GND ..............-0.3V to +15V
EN_OUT4, EN_OUT5, EN_OUT6, RESET, GPIO_
(configured as open-drain) to GND. ....................-0.3V to +6V
EN_OUT_, RESET, GPIO_ (configured as push-pull)
to GND .................................................-0.3V to (V
DBP
+ 0.3V)
DBP, ABP to GND .......................................-0.3V to minimum of
(4V and (V
CC
+ 0.3V))
Continuous Current (all other pins) .................................
Q20mA
Continuous Current (GND, pin 5)....................................
Q30mA
Continuous Power Dissipation (T
A
= +70NC)
32-Pin TQFN (derate 34.5mW/NC above +70NC) ..... 2759mW*
Thermal Resistance (Note 1)
B
JA
................................................................................29NC/W
B
JC
.................................................................................2NC/W
Operating Temperature Range .......................... -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
*As per JEDEC 51 Standard, Multilayer Board (PCB).
Note 1:
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to
www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
CC
= 2.8V to 14V, T
A
= T
J
= -40NC to +85NC, unless otherwise specified. Typical values are at V
ABP
= V
DBP
= V
CC
= 3.3V,
T
A
= +25NC.) (Note 2)
PARAMETER
Operating Voltage Range
Undervoltage Lockout
Undervoltage Lockout Hysteresis
Minimum Flash Operating Voltage
SYMBOL
V
CC
V
UVLO
UVLO
HYS
V
FLASH
I
CC1
Supply Current
I
CC2
Minimum voltage on V
CC
to ensure flash
erase and write operations
No load on any output
No load on any output, during flash writing
cycle
V
CC
= V
ABP
= V
DBP
= 3.6V (Note 3)
DBP Regulator Voltage
ABP Regulator Voltage
Boot Time
Flash Writing Time
Internal Timing Accuracy
ADC
Resolution
Gain Error
Offset Error
Integral Nonlinearity
2
ADC
GAIN
ADC
OFF
ADC
INL
T
A
= +25NC
T
A
= -40NC to +85NC
10
0.35
0.75
1.50
1
Bits
%
LSB
LSB
V
DBP
V
ABP
t
BOOT
V
CC
= 5V, C
DBP
= 1FF, no load
V
CC
= 5V, C
ABP
= 1FF, no load
V
CC
> V
UVLO
8-byte word
(Note 4)
-10
2.8
2.85
3
3
100
122
+10
2.7
2.8
7.7
4
14
5
3.2
3.15
200
V
V
Fs
ms
%
mA
CONDITIONS
RESET output asserted low
Minimum voltage on V
CC
to ensure the
device is flash configurable
55
MIN
1.2
2.8
14
2.7
TYP
MAX
UNITS
V
V
mV
V
______________________________________________________________________________________
6-Channel, Flash-Configurable System Manager
with Nonvolatile Fault Registers
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= 2.8V to 14V, T
A
= T
J
= -40NC to +85NC, unless otherwise specified. Typical values are at V
ABP
= V
DBP
= V
CC
= 3.3V,
T
A
= +25NC.) (Note 2)
PARAMETER
Differential Nonlinearity
ADC Total Monitoring Cycle Time
SYMBOL
ADC
DNL
t
CYCLE
Monitoring all 6 inputs, no MON_ fault
detected
MON_ range set to ‘00’
ADC MON_ Ranges
ADC
RNG
MON_ range set to ‘01’
MON_ range set to ‘10’
MON_ range set to ‘00’
ADC LSB Step Size
ADC Input Leakage Current
ENABLE INPUT (EN)
EN Input-Voltage Threshold
EN Input Current
EN Input-Voltage Range
OUTPUTS (EN_OUT_, RESET, GPIO_)
I
SINK
= 2mA
Output Voltage Low
V
OL
I
SINK
= 10mA, GPIO_ only
V
CC
= 1.2V, I
SINK
= 100FA (RESET only)
Maximum Output Sink Current
Output-Voltage High (Push-Pull)
Output-Voltage High (EN_OUT1,
EN_OUT2, EN_OUT3 Configured
as Charge Pumps)
EN_OUT_ Pullup Current
(Charge Pump)
Output Leakage Current
(Open Drain)
INPUTS (A0, GPIO_)
Input Logic-Low
Input Logic-High
WDI Pulse Width
MR
Pulse Width
SMBus INTERFACE
Logic-Input Low Voltage
Logic-Input High Voltage
Input Leakage Current
Output Sink Current
Input Capacitance
V
OL
C
IN
V
IL
V
IH
t
WDI
t
MR
V
IL
V
IH
Input voltage falling
Input voltage rising
V
CC
shorted to GND, V
MON_
= 0 or 6V
I
SINK
= 3mA
5
2.0
-1
+1
0.4
2.0
100
2
0.8
0.8
V
V
ns
Fs
V
V
FA
V
pF
3
V
OH
Total current into EN_OUT_, RESET, GPIO_,
V
CC
= 3.3V
I
SOURCE
=100FA
2.4
0.4
0.7
0.3
30
mA
V
V
V
TH_EN_R
V
TH_EN_F
I
EN
EN voltage rising
EN voltage falling
1.195
-0.5
0
1.24
1.215
1.235
+0.5
3.6
V
FA
V
ADC
LSB
MON_ range set to ‘01’
MON_ range set to ‘10’
24
5.552
2.776
1.388
5.42
2.71
1.35
1
FA
mV
V
CONDITIONS
MIN
TYP
MAX
1
30
UNITS
LSB
Fs
MAX16067
V
OH_CP
I
EN_OUT_
= 1FA
11
11.7
13
V
I
CH_UP
I
OUT_LKG
V
EN_OUT_
= 1V
5.4
7.9
1
FA
FA
EN_OUT1, EN_OUT2, EN_OUT3 > 11.8V
5
_______________________________________________________________________________________
6-Channel, Flash-Configurable System Manager
with Nonvolatile Fault Registers
MAX16067
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= 2.8V to 14V, T
A
= T
J
= -40NC to +85NC, unless otherwise specified. Typical values are at V
ABP
= V
DBP
= V
CC
= 3.3V,
T
A
= +25NC.) (Note 2)
PARAMETER
SMBus TIMING
Serial-Clock Frequency
Bus Free Time Between STOP
and START Condition
START Condition Setup Time
START Condition Hold Time
STOP Condition Setup Time
Clock Low Period
Clock High Period
Data Setup Time
Output Fall Time
Data Hold Time
Pulse Width of Spike Suppressed
SMBus Timeout
JTAG INTERFACE
TDI, TMS, TCK Logic-Low Input
Voltage
TDI, TMS, TCK Logic-High Input
Voltage
TDO Logic-Output Low Voltage
TDO Logic-Output High Voltage
TDI, TMS Pullup Resistors
I/O Capacitance
TCK Clock Period
TCK High/Low Time
TCK to TMS, TDI Setup Time
TCK to TMS, TDI Hold Time
TCK to TDO Delay
TCK to TDO High-Z Delay
V
IL
V
IH
V
OL_TDO
V
OH_TDO
R
JPU
C
I/O
t
1
t
2,
t
3
t
4
t
5
t
6
t
7
50
15
15
500
500
500
Input voltage falling
Input voltage rising
I
SINK
= 3mA
I
SOURCE
= 200FA
Pullup to DBP
2.4
30
50
5
1000
65
2.0
0.4
0.8
V
V
V
V
kI
pF
ns
ns
ns
ns
ns
ns
f
SCL
t
BUF
t
SU:STA
t
HD:STA
t
SU:STO
t
LOW
t
HIGH
t
SU:DAT
t
OF
t
HD:DAT
t
SP
t
TIMEOUT
SMBCLK time low for reset
22
10pF
P
C
BUS
P
400pF
From 50% SCL falling to SDA
change
Receive
Transmit
0.15
0.3
250
35
0.9
1.3
0.6
0.6
0.6
1.3
0.6
100
250
400
kHz
Fs
Fs
Fs
Fs
Fs
Fs
ns
ns
Fs
ns
ms
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
Note 2:
Specifications are guaranteed for the stated global conditions, unless otherwise noted. 100% production tested at T
A
=
+25NC and T
A
= +85NC. Specifications at T
A
= -40NC are guaranteed by design.
Note 3:
For V
CC
of 3.6V or lower, connect V
CC
, DBP, and ABP together. For higher supply applications, connect only V
CC
to the
supply rail.
Note 4:
Applies to RESET (except for reset timeout period of 25Fs), fault, autoretry, sequence delays, and watchdog timeout.
4
______________________________________________________________________________________
6-Channel, Flash-Configurable System Manager
with Nonvolatile Fault Registers
MAX16067
SDA
t
SU:DAT
t
BUF
t
LOW
t
HD:DAT
t
SU:STA
t
HD:STA
t
SU:STO
SCL
t
HIGH
t
HD:STA
t
R
START
CONDITION
t
F
REPEATED START
CONDITION
STOP
CONDITION
START
CONDITION
Figure 1. SMBus Timing Diagram
t
1
t
2
t
3
TCK
t
4
t
5
TDI, TMS
t
6
t
7
TDO
Figure 2. JTAG Timing Diagram
_______________________________________________________________________________________
5
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