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70V9169L7PFGI8

产品描述SRAM 16K X 9 SYNC DP SRAM
产品类别存储    存储   
文件大小691KB,共17页
制造商IDT (Integrated Device Technology)
标准
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70V9169L7PFGI8概述

SRAM 16K X 9 SYNC DP SRAM

70V9169L7PFGI8规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码TQFP
包装说明LFQFP,
针数100
制造商包装代码PNG100
Reach Compliance Codecompliant
ECCN代码EAR99
Samacsys DescriptionTQFP 14.0 X 14.0 X 1.4 MM
最长访问时间18 ns
其他特性FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 代码S-PQFP-G100
JESD-609代码e3
长度14 mm
内存密度147456 bit
内存集成电路类型DUAL-PORT SRAM
内存宽度9
湿度敏感等级3
功能数量1
端子数量100
字数16384 words
字数代码16000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织16KX9
封装主体材料PLASTIC/EPOXY
封装代码LFQFP
封装形状SQUARE
封装形式FLATPACK, LOW PROFILE, FINE PITCH
并行/串行PARALLEL
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1.6 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Matte Tin (Sn) - annealed
端子形式GULL WING
端子节距0.5 mm
端子位置QUAD
处于峰值回流温度下的最长时间30
宽度14 mm
Base Number Matches1

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HIGH-SPEED 3.3V 16/8K X 9
SYNCHRONOUS PIPELINED
DUAL-PORT STATIC RAM
Features:
IDT70V9169/59L
True Dual-Ported memory cells which allow simultaneous
access of the same memory location
High-speed clock to data access
– Commercial: 6.5/7.5/9ns (max.)
– Industrial: 7.5ns (max.)
Low-power operation
– IDT70V916/59L/59L
Active: 450mW (typ.)
Standby: 1.5mW (typ.)
Flow-Through or Pipelined output mode on either port via
the
FT/PIPE
pins
Counter enable and reset features
Dual chip enables allow for depth expansion without
additional logic
Full synchronous operation on both ports
– 3.5ns setup to clock and 0ns hold on all control, data, and
address inputs
– Data input, address, and control registers
– Fast 6.5ns clock to data out in the Pipelined output mode
– Self-timed write allows fast cycle time
– 10ns cycle time, 100MHz operation in Pipelined output mode
Separate upper-byte and lower-byte controls for
multiplexed bus and bus matching compatibility
LVTTL- compatible, single 3.3V (±0.3V) power supply
Industrial temperature range (–40°C to +85°C) is
available for 83 MHz
Available in a 100-pin Thin Quad Flatpack (TQFP) and 100-
pin fine pitch Ball Grid Array (fpBGA) packages.
Functional Block Diagram
R/W
L
OE
L
CE
0L
CE
1L
R/W
R
OE
R
CE
0R
CE
1R
1
0
0/1
1
0
0/1
FT/PIPE
L
0/1
1
0
0
1
0/1
FT/PIPE
R
I/O
0L
- I/O
8L
I/O
0R
- I/O
8R
I/O
Control
I/O
Control
A
13L
(1)
A
0L
CLK
L
ADS
L
CNTEN
L
CNTRST
L
NOTE:
1. A
13
is a NC for IDT70V9159.
A
13R
(1)
Counter/
Address
Reg.
MEMORY
ARRAY
Counter/
Address
Reg.
A
0R
CLK
R
ADS
R
CNTEN
R
CNTRST
R
5655 drw 01
JUNE 2015
1
©2015 Integrated Device Technology, Inc.
DSC-5655/4

70V9169L7PFGI8相似产品对比

70V9169L7PFGI8 70V9159L9BF 70V9169L7BFI 70V9169L9BF
描述 SRAM 16K X 9 SYNC DP SRAM SRAM 8K x 9 Sync,3.3V Dual-Port RAM, Pipelined/Flow-Through SRAM 16K x 9 Sync,3.3V Dual-Port RAM, Pipelined/Flow-Through SRAM 16K x 9 Sync,3.3V Dual-Port RAM, Pipelined/Flow-Through
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 不含铅 含铅 含铅 含铅
是否Rohs认证 符合 不符合 不符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 TQFP CABGA CABGA CABGA
包装说明 LFQFP, 10 X 10 MM, 1.4 MM HEIGHT, 0.8 MM PITCH, FBGA-100 10 X 10 MM, 1.4 MM HEIGHT, 0.8 MM PITCH, FBGA-100 10 X 10 MM, 1.4 MM HEIGHT, 0.8 MM PITCH, FBGA-100
针数 100 100 100 100
制造商包装代码 PNG100 BF100 BF100 BF100
Reach Compliance Code compliant not_compliant not_compliant not_compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99
最长访问时间 18 ns 9 ns 7.5 ns 9 ns
其他特性 FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 代码 S-PQFP-G100 S-PBGA-B100 S-PBGA-B100 S-PBGA-B100
JESD-609代码 e3 e0 e0 e0
长度 14 mm 10 mm 10 mm 10 mm
内存密度 147456 bit 73728 bit 147456 bit 147456 bit
内存集成电路类型 DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM DUAL-PORT SRAM
内存宽度 9 9 9 9
湿度敏感等级 3 3 3 3
功能数量 1 1 1 1
端子数量 100 100 100 100
字数 16384 words 8192 words 16384 words 16384 words
字数代码 16000 8000 16000 16000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 85 °C 70 °C 85 °C 70 °C
组织 16KX9 8KX9 16KX9 16KX9
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFQFP LFBGA LFBGA LFBGA
封装形状 SQUARE SQUARE SQUARE SQUARE
封装形式 FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 225 225 225
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.6 mm 1.4 mm 1.4 mm 1.4 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V 3 V 3 V 3 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES
技术 CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL
端子面层 Matte Tin (Sn) - annealed Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
端子形式 GULL WING BALL BALL BALL
端子节距 0.5 mm 0.8 mm 0.8 mm 0.8 mm
端子位置 QUAD BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 14 mm 10 mm 10 mm 10 mm
最大时钟频率 (fCLK) - 66.7 MHz 83 MHz 66.7 MHz
I/O 类型 - COMMON COMMON COMMON
端口数量 - 2 2 2
输出特性 - 3-STATE 3-STATE 3-STATE
封装等效代码 - BGA100,10X10,32 BGA100,10X10,32 BGA100,10X10,32
电源 - 3.3 V 3.3 V 3.3 V
最大待机电流 - 0.003 A 0.003 A 0.003 A
最小待机电流 - 3 V 3 V 3 V
最大压摆率 - 0.23 mA 0.28 mA 0.23 mA

 
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