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TSI382-66ILV

产品描述PCI Interface IC PCI-to-x1 PCIe Bridge
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小215KB,共2页
制造商IDT (Integrated Device Technology)
标准
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TSI382-66ILV概述

PCI Interface IC PCI-to-x1 PCIe Bridge

TSI382-66ILV规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅不含铅
是否Rohs认证符合
零件包装代码CABGA
包装说明LFBGA, BGA144,12X12,32
针数144
制造商包装代码ABG144
Reach Compliance Codecompliant
ECCN代码3A001.A.3
地址总线宽度32
总线兼容性PCI
最大时钟频率66 MHz
驱动器接口标准IEEE 1149.6; IEEE 1149.1
外部数据总线宽度32
JESD-30 代码S-PBGA-B144
JESD-609代码e1
长度10 mm
湿度敏感等级3
端子数量144
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码LFBGA
封装等效代码BGA144,12X12,32
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)260
电源1.2,3.3 V
认证状态Not Qualified
座面最大高度1.45 mm
最大供电电压1.26 V
最小供电电压1.14 V
标称供电电压1.2 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距0.8 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度10 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI
Base Number Matches1

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®
Tsi382
PCIe
®
to PCI Bridge
Product Brief
Benefits
Enhances system performance by delivering high throughput and
low latency across bridge
Simplifies system design by offering numerous programmable
features
BGA Package
Minimizes board space due to small footprint
LQFP Package
Simplifies board layout by minimizing PCB layer requirements
Reduces manufacturing and board costs
Features
General
PCI Express to PCI bridge
Transparent, Non-transparent and Opaque modes
Efficient queuing and buffering for low latency and high
throughput
Compliant with the following specifications:
– PCI Express Base 1.1
– PCI Express PCI/PCI-X Bridge 1.0
– PCI-to-PCI Bridge Architecture 1.2
– PCI Local Bus 3.0
– PCI Bus Power Management Interface 1.2
PCI
PCI
Express
x1 lane PCIe Interface
Advanced error reporting capability
End-to-end CRC check and generation
Up to four outstanding memory reads
ASPM L0 link state power management
Legacy interrupt signaling and MSI interrupts
Native Hot Plug support
32/64-bit addressing and 32-bit data
Operates up to 66 MHz
Up to eight outstanding memory reads
PCI clock outputs for up to four devices
Four external PCI masters supported through internal arbiter
3.3V PCI I/Os, 5V tolerant
MSI generation and handling using interrupt and GPIO signals
Device Overview
The IDT Tsi382 is a high-performance bus bridge that connects the
PCI Express protocol to the PCI bus standard. The Tsi382’s PCIe Inter-
face supports a x1 lane configuration, which enables the bridge to offer
throughput performance of up to 2.5 Gbps per transmit and receive
direction.
The device’s PCI Interface operates up to 66 MHz, and offers
designers extensive flexibility by supporting three addressing modes:
transparent, opaque, and non-transparent.
Clocking/
Reset
PCIe Interface (x1)
EEPROM
Controller
Other Features
Masquerade mode
JTAG IEEE 1149.1, 1149.6
Four GPIO pins and four interrupt pins that can generate MSIs
D0, D3 hot, D3 cold power management state support
1.2V core power supply, 3.3V I/O
No power sequencing constraints
Packaging:
BGA: 144-pin, 10 x 10 mm, 0.8 mm ball pitch, Industrial oper-
ating temperature, with RoHS/Green and Eutectic packages
LQFP: 176-pin, 20 x 20 mm, Commercial operating tempera-
ture, RoHS compliant
Interrupt
Handling
Posted
Writer
Buffer
Non-
Posted
Buffer
Posted
Queue
Non-
Posted
Queue
Upstream
Power
Mgmt
Mux Logic
Config
Registers
Error
Handling
Mux Logic
GPIO
Downstream
Posted
Writer
Buffer
Non-
Posted
Buffer
Posted
Queue
Non-
Posted
Queue
JTAG
PCI
Arbiter
80E2010_BK001_01 (Tsi382)
PCI Interface
PCI Clock
Outputs
Figure 1 Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 2
2008 Integrated Device Technology, Inc.
August 14, 2009

TSI382-66ILV相似产品对比

TSI382-66ILV TSI382-66CQY TSI382-66IL
描述 PCI Interface IC PCI-to-x1 PCIe Bridge PCI Interface IC PCI-to-x1 PCIe Bridge PCI Interface IC PCI-to-x1 PCIe Bridge
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 不含铅 不含铅 含铅
是否Rohs认证 符合 符合 不符合
零件包装代码 CABGA TQFP CABGA
包装说明 LFBGA, BGA144,12X12,32 LQFP-176 BGA-144
针数 144 176 144
制造商包装代码 ABG144 DAG176 AB144
Reach Compliance Code compliant compliant not_compliant
地址总线宽度 32 - 32
总线兼容性 PCI ISA; VGA PCI
外部数据总线宽度 32 - 32
JESD-30 代码 S-PBGA-B144 S-PQFP-G176 S-PBGA-B144
JESD-609代码 e1 e3 e0
长度 10 mm 20 mm 10 mm
湿度敏感等级 3 3 3
端子数量 144 176 144
最高工作温度 85 °C 70 °C 85 °C
最低工作温度 -40 °C - -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LFBGA LFQFP LFBGA
封装等效代码 BGA144,12X12,32 QFP176,.87SQ,16 BGA144,12X12,32
封装形状 SQUARE SQUARE SQUARE
封装形式 GRID ARRAY FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY
峰值回流温度(摄氏度) 260 260 225
电源 1.2,3.3 V 1.2,3.3 V 1.2,3.3 V
认证状态 Not Qualified Not Qualified Not Qualified
座面最大高度 1.45 mm 1.6 mm 1.45 mm
最大供电电压 1.26 V 1.26 V 1.26 V
最小供电电压 1.14 V 1.14 V 1.14 V
标称供电电压 1.2 V 1.2 V 1.2 V
表面贴装 YES YES YES
技术 CMOS CMOS CMOS
温度等级 INDUSTRIAL COMMERCIAL INDUSTRIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin (Sn) Tin/Lead (Sn/Pb)
端子形式 BALL GULL WING BALL
端子节距 0.8 mm 0.4 mm 0.8 mm
端子位置 BOTTOM QUAD BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
宽度 10 mm 20 mm 10 mm
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
ECCN代码 3A001.A.3 - 3A001.A.3
最大时钟频率 66 MHz - 66 MHz
驱动器接口标准 IEEE 1149.6; IEEE 1149.1 - IEEE 1149.6; IEEE 1149.1
Base Number Matches 1 - 1

 
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