Microprocessors - MPU PowerQUICC 32 Bit Power Arch SoC
参数名称 | 属性值 |
Product Attribute | Attribute Value |
制造商 Manufacturer | NXP(恩智浦) |
产品种类 Product Category | Microprocessors - MPU |
RoHS | Details |
安装风格 Mounting Style | SMD/SMT |
封装 / 箱体 Package / Case | FC-PBGA-783 |
Core | e500 |
Number of Cores | 1 Core |
Data Bus Width | 32 bit |
Maximum Clock Frequency | 667 MHz |
L1 Cache Instruction Memory | 32 kB |
L1 Cache Data Memory | 32 kB |
工作电源电压 Operating Supply Voltage | 1 V |
最小工作温度 Minimum Operating Temperature | 0 C |
最大工作温度 Maximum Operating Temperature | + 90 C |
Memory Type | L1/L2 Cache |
接口类型 Interface Type | Ethernet, I2C, PCIe, UART |
I/O Voltage | 1.8 V, 2.5 V, 3.3 V |
Instruction Type | Floating Point |
L2 Cache Instruction / Data Memory | 256 kB |
Moisture Sensitive | Yes |
Number of Timers/Counters | 4 x 32 bit |
Processor Series | PowerQUICC III |
工厂包装数量 Factory Pack Quantity | 36 |
看门狗计时器 Watchdog Timers | Watchdog Timer |
单位重量 Unit Weight | 0.117677 oz |
MPC8533VJALFA | MPC8533VTARJA | MPC8533EVTANGA | MPC8533EVTALF | MPC8533EVTAQGA | MPC8533EVTALFA | MPC8533VTANGA | MPC8533VTAQGA | MPC8533EVTANG | MPC8533EVTARJA | |
---|---|---|---|---|---|---|---|---|---|---|
描述 | Microprocessors - MPU PowerQUICC 32 Bit Power Arch SoC | Microprocessors - MPU PQ38K 8533 | Microprocessors - MPU PQ38K 8533E | Microprocessors - MPU PQ38K 8533E | Microprocessors - MPU PQ38K 8533E | Microprocessors - MPU PQ38K 8533E | Microprocessors - MPU PQ38K 8533 | Microprocessors - MPU PQ38K 8533 | Microprocessors - MPU PQ38K 8533E | Microprocessors - MPU PQ38K 8533E |
Brand Name | - | Freescale | Freescale | - | Freescale | Freescale | Freescale | - | - | Freescale |
是否无铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | - | NXP(恩智浦) | - | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) |
包装说明 | - | BGA, BGA783,28X28,40 | BGA, BGA783,28X28,40 | BGA, BGA783,28X28,40 | BGA, BGA783,28X28,40 | BGA, BGA783,28X28,40 | BGA, BGA783,28X28,40 | BGA, BGA783,28X28,40 | BGA, BGA783,28X28,40 | BGA, BGA783,28X28,40 |
Reach Compliance Code | - | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
地址总线宽度 | - | 16 | 16 | 32 | 16 | 16 | 16 | 16 | 32 | 16 |
位大小 | - | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
边界扫描 | - | YES | YES | YES | YES | YES | YES | YES | YES | YES |
外部数据总线宽度 | - | 64 | 64 | 32 | 64 | 64 | 64 | 64 | 32 | 64 |
格式 | - | FIXED POINT | FIXED POINT | FLOATING POINT | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT | FLOATING POINT | FIXED POINT |
集成缓存 | - | YES | YES | YES | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | - | S-PBGA-B783 | S-PBGA-B783 | S-PBGA-B783 | S-PBGA-B783 | S-PBGA-B783 | S-PBGA-B783 | S-PBGA-B783 | S-PBGA-B783 | S-PBGA-B783 |
JESD-609代码 | - | e2 | e2 | e2 | e2 | e2 | e2 | e2 | e2 | e2 |
长度 | - | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm |
低功率模式 | - | YES | YES | NO | YES | YES | YES | YES | NO | YES |
湿度敏感等级 | - | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
端子数量 | - | 783 | 783 | 783 | 783 | 783 | 783 | 783 | 783 | 783 |
最高工作温度 | - | 90 °C | 90 °C | - | 90 °C | 90 °C | 90 °C | 90 °C | - | 90 °C |
封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | - | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
封装等效代码 | - | BGA783,28X28,40 | BGA783,28X28,40 | BGA783,28X28,40 | BGA783,28X28,40 | BGA783,28X28,40 | BGA783,28X28,40 | BGA783,28X28,40 | BGA783,28X28,40 | BGA783,28X28,40 |
封装形状 | - | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | - | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
电源 | - | 1,1.8/2.5,3.3 V | 1,1.8/2.5,3.3 V | 1,1.8/2.5,3.3 V | 1,1.8/2.5,3.3 V | 1,1.8/2.5,3.3 V | 1,1.8/2.5,3.3 V | 1,1.8/2.5,3.3 V | 1,1.8/2.5,3.3 V | 1,1.8/2.5,3.3 V |
认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | - | 2.8 mm | 2.8 mm | 2.8 mm | 2.8 mm | 2.8 mm | 2.8 mm | 2.8 mm | 2.8 mm | 2.8 mm |
速度 | - | 1067 MHz | 800 MHz | 667 MHz | 1000 MHz | 667 MHz | 800 MHz | 1000 MHz | 800 MHz | 1067 MHz |
最大供电电压 | - | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V | 1.05 V |
最小供电电压 | - | 0.95 V | 0.95 V | 0.95 V | 0.95 V | 0.95 V | 0.95 V | 0.95 V | 0.95 V | 0.95 V |
标称供电电压 | - | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V | 1 V |
表面贴装 | - | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | - | OTHER | OTHER | - | OTHER | OTHER | OTHER | OTHER | - | OTHER |
端子面层 | - | Tin/Silver (Sn/Ag) | TIN COPPER/TIN SILVER | Tin/Silver (Sn/Ag) | TIN COPPER/TIN SILVER | TIN COPPER/TIN SILVER | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) | Tin/Silver (Sn/Ag) | TIN COPPER/TIN SILVER |
端子形式 | - | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | - | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
端子位置 | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
宽度 | - | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm | 29 mm |
uPs/uCs/外围集成电路类型 | - | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR | MICROPROCESSOR, RISC |
峰值回流温度(摄氏度) | - | - | 260 | 260 | 260 | 260 | - | - | 260 | 260 |
处于峰值回流温度下的最长时间 | - | - | 40 | 40 | 40 | 40 | - | - | 40 | 40 |
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