Flip Flops DUAL J-K POS EDGE
| 参数名称 | 属性值 |
| Source Url Status Check Date | 2013-06-14 00:00:00 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | SOIC |
| 包装说明 | SSOP, |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| 系列 | HCT |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e4 |
| 长度 | 6.2 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | J-KBAR FLIP-FLOP |
| 湿度敏感等级 | 1 |
| 位数 | 2 |
| 功能数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 传播延迟（tpd） | 53 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 5.3 mm |
| 最小 fmax | 18 MHz |
| 74HCT109DB-T | 74HCT109N652 | 74HCT109D | 74HC109DB-T | 74HCT109PW-T | 74HC109DB | 74HCT109DB | 74HCT109PW | 74HC109N | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Flip Flops DUAL J-K POS EDGE | Flip Flops DUAL J-K POS EDGE | Flip Flops DUAL J-K W/NEG-EDGE TRIG | Flip Flops DUAL J-K POS EDGE | Flip Flops DUAL J-K W/NEG-EDGE TRIG | Flip Flops DUAL J-K POS EDGE | Flip Flops DUAL J-K POS EDGE | Flip Flops DUAL J-K W/NEG-EDGE TRIG | |
| 是否Rohs认证 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | SOIC | - | SOIC | SOIC | TSSOP | SOIC | SOIC | TSSOP | DIP |
| 包装说明 | SSOP, | - | SOT-109, SO-16 | SSOP, | TSSOP, | SSOP, SSOP16,.3 | SOT-338-1, SSOP-16 | TSSOP, TSSOP16,.25 | DIP, DIP16,.3 |
| 针数 | 16 | - | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | unknown | - | unknown | unknown | unknown | compliant | unknown | compliant | unknown |
| 系列 | HCT | - | HCT | HC/UH | HCT | HC/UH | HCT | HCT | HC/UH |
| JESD-30 代码 | R-PDSO-G16 | - | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDIP-T16 |
| JESD-609代码 | e4 | - | - | e4 | e4 | e4 | e4 | e4 | - |
| 长度 | 6.2 mm | - | 9.9 mm | 6.2 mm | 5 mm | 6.2 mm | 6.2 mm | 5 mm | 21.6 mm |
| 负载电容（CL） | 50 pF | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | J-KBAR FLIP-FLOP | - | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP |
| 湿度敏感等级 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | - |
| 位数 | 2 | - | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 功能数量 | 2 | - | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | - | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出极性 | COMPLEMENTARY | - | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | - | SOP | SSOP | TSSOP | SSOP | SSOP | TSSOP | DIP |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | - | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE |
| 峰值回流温度（摄氏度） | 260 | - | 260 | 260 | 260 | 260 | 260 | 260 | NOT APPLICABLE |
| 传播延迟（tpd） | 53 ns | - | 53 ns | 265 ns | 53 ns | 265 ns | 53 ns | 53 ns | 265 ns |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2 mm | - | 1.75 mm | 2 mm | 1.1 mm | 2 mm | 2 mm | 1.1 mm | 4.7 mm |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 6 V | 5.5 V | 6 V | 5.5 V | 5.5 V | 6 V |
| 最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | 2 V | 4.5 V | 2 V | 4.5 V | 4.5 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 4.5 V | 5 V | 4.5 V | 5 V | 5 V | 4.5 V |
| 表面贴装 | YES | - | YES | YES | YES | YES | YES | YES | NO |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD | - | NICKEL/PALLADIUM/GOLD (NI/PD/AU) | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL/PALLADIUM/GOLD (NI/PD/AU) |
| 端子形式 | GULL WING | - | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 0.65 mm | - | 1.27 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 2.54 mm |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | - | 30 | 30 | 30 | 30 | 30 | 30 | NOT APPLICABLE |
| 触发器类型 | POSITIVE EDGE | - | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | 5.3 mm | - | 3.9 mm | 5.3 mm | 4.4 mm | 5.3 mm | 5.3 mm | 4.4 mm | 7.62 mm |
| 最小 fmax | 18 MHz | - | 18 MHz | 24 MHz | 18 MHz | 24 MHz | 18 MHz | 18 MHz | 24 MHz |
| 是否无铅 | - | - | 不含铅 | - | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 最大频率@ Nom-Sup | - | - | 18000000 Hz | - | - | 20000000 Hz | 18000000 Hz | 18000000 Hz | 20000000 Hz |
| 最大I（ol） | - | - | 0.006 A | - | - | 0.004 A | 0.006 A | 0.006 A | 0.004 A |
| 封装等效代码 | - | - | SOP16,.25 | - | - | SSOP16,.3 | SSOP16,.3 | TSSOP16,.25 | DIP16,.3 |
| 电源 | - | - | 5 V | - | - | 2/6 V | 5 V | 5 V | 2/6 V |
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