Logic Gates 8-INPUT NAND GATE
| 参数名称 | 属性值 |
| Brand Name | NXP Semiconductor |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | TSSOP |
| 针数 | 14 |
| 制造商包装代码 | SOT402-1 |
| Reach Compliance Code | compliant |
| 系列 | HC/UH |
| JESD-30 代码 | R-PDSO-G14 |
| JESD-609代码 | e4 |
| 长度 | 5 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | NAND GATE |
| 最大I（ol） | 0.004 A |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 输入次数 | 8 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP14,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 包装方法 | BULK PACK |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2/6 V |
| Prop。Delay @ Nom-Sup | 39 ns |
| 传播延迟（tpd） | 39 ns |
| 认证状态 | Not Qualified |
| 施密特触发器 | NO |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 4.4 mm |
| Base Number Matches | 1 |
| 74HC30PW,112 | 74HC30DB,112 | 74HCT30DB,118 | 74HC30D,652 | 74HC30DB,118 | 74HCT30D,652 | 74HCT30D,653 | |
|---|---|---|---|---|---|---|---|
| 描述 | Logic Gates 8-INPUT NAND GATE | Logic Gates 8-INPUT NAND GATE | Logic Gates 8-INPUT NAND GATE | Logic Gates 8-INPUT NAND GATE | Logic Gates 8-INPUT NAND GATE | Logic Gates 8-INPUT NAND GATE | Logic Gates 8-INPUT NAND GATE |
| Brand Name | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 零件包装代码 | TSSOP | SSOP1 | SSOP1 | SOIC | SSOP1 | SOIC | SOIC |
| 针数 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 制造商包装代码 | SOT402-1 | SOT337-1 | SOT337-1 | SOT108-1 | SOT337-1 | SOT108-1 | SOT108-1 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 系列 | HC/UH | HC/UH | HCT | HC/UH | HC/UH | HCT | HCT |
| JESD-30 代码 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 5 mm | 6.2 mm | 6.2 mm | 8.65 mm | 6.2 mm | 8.65 mm | 8.65 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE | NAND GATE |
| 最大I（ol） | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 输入次数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | SSOP | SSOP | SOP | SSOP | SOP | SOP |
| 封装等效代码 | TSSOP14,.25 | SSOP14,.3 | SSOP14,.3 | SOP14,.25 | SSOP14,.3 | SOP14,.25 | SOP14,.25 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 电源 | 2/6 V | 2/6 V | 5 V | 2/6 V | 2/6 V | 5 V | 5 V |
| Prop。Delay @ Nom-Sup | 39 ns | 39 ns | 42 ns | 39 ns | 39 ns | 42 ns | 42 ns |
| 传播延迟（tpd） | 39 ns | 39 ns | 42 ns | 39 ns | 39 ns | 42 ns | 42 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 施密特触发器 | NO | NO | NO | NO | NO | NO | NO |
| 座面最大高度 | 1.1 mm | 2 mm | 2 mm | 1.75 mm | 2 mm | 1.75 mm | 1.75 mm |
| 最大供电电压 (Vsup) | 6 V | 6 V | 5.5 V | 6 V | 6 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 4.5 V | 2 V | 2 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 1.27 mm | 0.65 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
| 宽度 | 4.4 mm | 5.3 mm | 5.3 mm | 3.9 mm | 5.3 mm | 3.9 mm | 3.9 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 包装方法 | BULK PACK | BULK PACK | TAPE AND REEL | BULK PACK | TAPE AND REEL | BULK PACK | - |
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