1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994 .
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS
MEASURED BETWEEN 0.25 AND 0.30 MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS
THE TERMINALS.
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
MIN
0.70
0.00
0.25
1.40
0.90
0.35
MILLIMETERS
NOM
MAX
0.75
0.80
0.05
0.20 REF
0.30
0.35
2.00 BSC
1.50
1.60
2.00 BSC
1.00
1.10
1.30 BSC
0.35 REF
0.40
0.45
MIN
0.028
0.000
0.010
INCHES
NOM
0.030
MAX
0.031
0.002
0.014
0.063
0.043
0.018
D
A
B
PIN ONE
REFERENCE
E
2X
0.10 C
2X
0.008 REF
0.012
0.079 BSC
0.055
0.059
0.079 BSC
0.035
0.039
0.051 BSC
0.014 REF
0.014
0.016
0.10 C
0.10 C
8X
0.08 C
SEATING
PLANE
A1
2X
L
K
0.400
1.600
E2
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.275
ON Semiconductor
and
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三星刚出的旗舰新机Galaxy S III固然不错，但是高昂的价格不是每个人都能承受的起。昨天我们报道了一部山寨版的i9300，而现在该机价格和具体配置已经全部出炉。 这款山寨的Galaxy S III名叫HDC Galaxy S3，其外形甚至UI界面都与原型机异常相似。该机的三围为138×70×9.2mm，配备了一块4.7寸触摸屏，分辨率只有800×480像素。
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