STPS2545C
Power Schottky rectifier
Datasheet - production data
A1
K
A2
K
Description
Dual center tab Schottky rectifier suited for switch
mode power supplies and high frequency DC to
DC converters.
A1
K
A2
TO-220AB
K
K
This device is especially intended for use in low
voltage, high frequency inverters, free-wheeling
and polarity protection applications.
Table 1: Device summary
Symbol
Value
2 x 12.5 A
45 V
175 °C
0.5 V
A2
A1
A2
A1
I
F(AV)
V
RRM
T
j
(max.)
D²PAK
Features
Very small conduction losses
Negligible switching losses
Extremely fast switching
Low thermal resistance
Avalanche capability specified
High frequency operation
ECOPACK
®
2 compliant component (on
demand for D²PAK)
V
F
(typ.)
May 2017
DocID8736 Rev 5
1/11
www.st.com
This is information on a product in full production.
Characteristics
STPS2545C
1
Characteristics
Table 2: Absolute ratings (limiting values, per diode, at 25 °C, unless otherwise specified)
Symbol
V
RRM
I
F(RMS)
I
F(AV)
I
FSM
P
ARM
T
stg
T
j
Notes:
(1)
(dP
tot
/dT
j
)
Parameter
Repetitive peak reverse voltage
Forward rms current
Average forward current δ = 0.5,
square wave
Surge non repetitive forward
current
Repetitive peak avalanche power
Storage temperature range
Maximum operating junction temperature
(1)
T
C
= 160 °C
T
C
= 155 °C
Per diode
Per device
Value
45
30
12.5
Unit
V
A
A
25
200
345
-65 to +175
175
A
W
°C
°C
t
p
= 10 ms sinusoidal
t
p
= 10 µs, T
j
= 125 °C
< (1/R
th(j-a)
) condition to avoid thermal runaway for a diode on its own heatsink.
Table 3: Thermal parameters
Symbol
R
th(j-c)
R
th(c)
Junction to case
Coupling
Parameter
Per diode
Total
Max. value
1.6
1.1
0.6
Unit
°C/W
°C/W
When the diodes 1 and 2 are used simultaneously:
ΔT
j
(diode 1) = P(diode1) x R
th(j-c)
(Per diode) + P(diode 2) x R
th(c)
Table 4: Static electrical characteristics (per diode)
Symbol
I
R
(1)
Parameter
Reverse leakage current
Test conditions
T
j
= 25 °C
T
j
= 125 °C
T
j
= 125 °C
V
F
(1)
Forward voltage drop
T
j
= 25 °C
T
j
= 125 °C
Notes:
(1)
Pulse
Min.
-
-
-
-
-
Typ.
Max.
125
Unit
µA
mA
V
R
= V
RRM
I
F
= 12.5 A
I
F
= 25 A
9
0.50
25
0.57
0.84
V
0.65
0.72
test: t
p
= 380 µs, δ < 2%
To evaluate the conduction losses, use the following equation:
P = 0.42 x I
F(AV)
+ 0.012 x I
F2(RMS)
2/11
DocID8736 Rev 5
STPS2545C
Characteristics
1.1
Characteristics (curves)
Figure 1: Conduction losses versus average
current, per diode)
10
9
8
7
6
5
δ
=1
Figure 2: Average forward current versus ambient
temperature (δ = 0.5, per diode)
14
PF(AV) (W)
δ = 0.05 δ = 0.1
δ
= 0.2
δ = 0.5
Rt h
(j-a)
=Rth
(j-c)
12
10
8
6
Rth
(j-a)
= 50° C/W
4
3
4
T
T
2
1
2
IF(AV) (A)
0.0
2
.5
5.0
7
.5
10.0
δ = tp/T
12.5
0
tp
15.0
0
0
δ =tp/T
tp
T
amb
(°C)
50
75
100
125
150
175
25
Figure 3: Normalized avalanche power derating
versus pulse duration (T
j
= 125 °C)
1
P
ARM
(t p )
P
ARM
(10 µs)
Figure 4: Relative variation of thermal impedance
junction to case versus pulse duration
1.0
0.9
0.8
Zth(j-c) /Rth(j-c)
0.1
0.7
0.6
0.5
0.4
δ
= 0.2
δ
= 0.5
0.01
0.3
δ
= 0.1
0.2
S in gle puls e
T
t
P
(s )
0.1
t
p
(µs)
0.001
1
10
100
1000
0.0
1.E - 03
δ =tp/T
tp
1.E - 02
1.E - 01
1.E + 00
Figure 5: Reverse leakage current versus reverse
voltage applied (typical values, per diode)
1.E + 02
Figure 6: Junction capacitance versus reverse
voltage applied (typical values, per diode)
10.0
IR(mA)
T
j
=150°C
C (nF)
F =1MHz
V
osc
=30mV
T
j
=25°C
1.E + 01
T
j
=125°C
1.E + 00
T
j
=100°C
T
j
=75°C
1. 0
1.E - 01
T
j
=50°C
1.E - 02
T
j
=25°C
V
R
(V)
1.E - 03
0. 1
V
R
(V)
30
35
40
45
0
10
100
0
5
10
15
20
25
DocID8736 Rev 5
3/11
Characteristics
Figure 7: Forward voltage drop versus forward
current (per diode)
STPS2545C
Figure 8: Thermal resistance junction to ambient
versus copper surface under tab
R
th (j-a)
(°C/W )
80
D²PAK
70
60
Epoxy printed board FR4, copper thickness = 35 µm
50
40
30
20
10
0
0
5
10
15
20
S
Cu
(cm²)
25
30
35
40
4/11
DocID8736 Rev 5
STPS2545C
Package
information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at:
www.st.com.
ECOPACK
®
is an ST trademark.
Cooling method: by conduction (C)
Epoxy meets UL 94,V0
Recommended torque value: 0.55 N·m (for TO-220AB)
Maximum torque value: 0.7 N·m (for TO-220AB)
DocID8736 Rev 5
5/11
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