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89HPES48T12ZABR

产品描述PCI Interface IC PCIE 48-LANE 12 PORT SWITCH
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小312KB,共47页
制造商IDT (Integrated Device Technology)
标准
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89HPES48T12ZABR概述

PCI Interface IC PCIE 48-LANE 12 PORT SWITCH

89HPES48T12ZABR规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码FCBGA
包装说明35 X 35 MM, 1 MM PITCH, FCBGA-1156
针数1156
制造商包装代码BR1156
Reach Compliance Codenot_compliant
ECCN代码EAR99
其他特性ALSO REQUIRES 3.3V SUPPLY
地址总线宽度
总线兼容性PCI
最大时钟频率125 MHz
外部数据总线宽度
JESD-30 代码S-PBGA-B1156
JESD-609代码e1
长度35 mm
湿度敏感等级4
端子数量1156
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA1156,34X34,40
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)245
电源1,3.3 V
认证状态Not Qualified
座面最大高度3.42 mm
最大压摆率2635 mA
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度35 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI

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48-Lane 12-Port
PCI Express® Switch
®
89HPES48T12
Data Sheet
Device Overview
The 89HPES48T12 is a member of the IDT PRECISE™ family of
PCI Express® switching solutions. The PES48T12 is a 48-lane, 12-port
peripheral chip that performs PCI Express packet switching with a
feature set optimized for high-performance applications such as servers,
storage, and communications/networking. It provides connectivity and
switching functions between a PCI Express upstream port and up to
eleven downstream ports and supports switching between downstream
ports.
Features
High Performance PCI Express Switch
– Twelve switch ports
Six main ports each of which consists of 8 SerDes
Each x8 main port can further bifurcate to 2 x4-ports
– Forty-eight 2.5 Gbps embedded SerDes
Supports pre-emphasis and receive equalization on per-port
basis
– Delivers 192 Gbps (24 GBps) of aggregate switching capacity
– Low-latency cut-through switch architecture
– Support for Max Payload Size up to 2048 bytes
– Supports one virtual channel and eight traffic classes
– PCI Express Base Specification Revision 1.1 compliant
Flexible Architecture with Numerous Configuration Options
– Port arbitration schemes utilizing round robin algorithms
– Automatic per port link width negotiation to x8, x4, x2 or x1
– Automatic lane reversal on all ports
– Automatic polarity inversion on all lanes
– Supports locked transactions, allowing use with legacy soft-
ware
– Ability to load device configuration from serial EEPROM
– Ability to control device via SMBus
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates forty-eight 2.5 Gbps embedded full duplex SerDes,
8B/10B encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Redundant upstream port failover capability
– Supports optional PCI Express end-to-end CRC checking
Block Diagram
x8/x4/x2/x1
SerDes
DL/Transaction Layer
Upstream
Route Table
Port
Arbitration
Scheduler
12-Port Switch Core
Frame Buffer
DL/Transaction Layer
DL/Transaction Layer
DL/Transaction Layer
DL/Transaction Layer
DL/Transaction Layer
SerDes
SerDes
SerDes
SerDes
SerDes
x8/x4/x2/x1
x8/x4/x2/x1
x8/x4/x2/x1
x8/x4/x2/x1
x8/x4/x2/x1
48 PCI Express Lanes
Up to 6 x8 ports or 12 x4 Ports
Figure 1 Internal Block Diagram
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 47
2011 Integrated Device Technology, Inc.
October 3, 2011
DSC 6924

89HPES48T12ZABR相似产品对比

89HPES48T12ZABR 89HPES48T12ZABLI
描述 PCI Interface IC PCIE 48-LANE 12 PORT SWITCH PCI Interface IC PCIE 48-LANE 12 PORT SWITCH
Brand Name Integrated Device Technology Integrated Device Technology
是否无铅 含铅 含铅
是否Rohs认证 符合 不符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 FCBGA FCBGA
包装说明 35 X 35 MM, 1 MM PITCH, FCBGA-1156 35 X 35 MM, 1 MM PITCH, FCBGA-1156
针数 1156 1156
制造商包装代码 BR1156 BL1156
Reach Compliance Code not_compliant not_compliant
ECCN代码 EAR99 EAR99
其他特性 ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
总线兼容性 PCI PCI
最大时钟频率 125 MHz 125 MHz
JESD-30 代码 S-PBGA-B1156 S-PBGA-B1156
JESD-609代码 e1 e0
长度 35 mm 35 mm
湿度敏感等级 4 4
端子数量 1156 1156
最高工作温度 70 °C 85 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 BGA BGA
封装等效代码 BGA1156,34X34,40 BGA1156,34X34,40
封装形状 SQUARE SQUARE
封装形式 GRID ARRAY GRID ARRAY
峰值回流温度(摄氏度) 245 225
电源 1,3.3 V 1,3.3 V
认证状态 Not Qualified Not Qualified
座面最大高度 3.42 mm 3.42 mm
最大压摆率 2635 mA 2635 mA
最大供电电压 1.1 V 1.1 V
最小供电电压 0.9 V 0.9 V
标称供电电压 1 V 1 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL
端子面层 Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn/Pb)
端子形式 BALL BALL
端子节距 1 mm 1 mm
端子位置 BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
宽度 35 mm 35 mm
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI

 
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