Buffers & Line Drivers
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Microchip(微芯科技) |
包装说明 | TSSOP, |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
差分输出 | YES |
驱动器位数 | 1 |
输入特性 | DIFFERENTIAL |
接口集成电路类型 | LINE TRANSCEIVER |
接口标准 | GENERAL PURPOSE |
JESD-30 代码 | R-PDSO-G8 |
JESD-609代码 | e4 |
长度 | 3 mm |
功能数量 | 1 |
端子数量 | 8 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
认证状态 | Not Qualified |
最大接收延迟 | 0.33 ns |
接收器位数 | 1 |
座面最大高度 | 1.1 mm |
最大供电电压 | 3.6 V |
最小供电电压 | 2.375 V |
标称供电电压 | 2.5 V |
表面贴装 | YES |
温度等级 | INDUSTRIAL |
端子面层 | NICKEL PALLADIUM GOLD |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
最大传输延迟 | 0.33 ns |
宽度 | 3 mm |
SY10EP16UKG-TR | SY10EP16UZG | SY100EP16UKG-TR | SY10EP16UKG | SY10EP16UMG-TR | SY100EP16UKG | |
---|---|---|---|---|---|---|
描述 | Buffers & Line Drivers | Buffers & Line Drivers 3.3V/5V Differential Receiver | Buffers & Line Drivers | Buffers & Line Drivers 3.3V/5V Differential Receiver | Buffers & Line Drivers | Buffers & Line Drivers 2.5/3.3V Differential Buffer/Receiver |
是否Rohs认证 | 符合 | 符合 | - | 符合 | 符合 | 符合 |
厂商名称 | Microchip(微芯科技) | Microchip(微芯科技) | - | Microchip(微芯科技) | Microchip(微芯科技) | Microchip(微芯科技) |
包装说明 | TSSOP, | SOIC-8 | - | MSOP-8 | HVSON, | MSOP-8 |
Reach Compliance Code | compliant | compliant | - | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 |
差分输出 | YES | YES | - | YES | YES | YES |
驱动器位数 | 1 | 1 | - | 1 | 1 | 1 |
输入特性 | DIFFERENTIAL | DIFFERENTIAL | - | DIFFERENTIAL | DIFFERENTIAL | DIFFERENTIAL |
接口集成电路类型 | LINE TRANSCEIVER | LINE TRANSCEIVER | - | LINE TRANSCEIVER | LINE TRANSCEIVER | LINE TRANSCEIVER |
接口标准 | GENERAL PURPOSE | GENERAL PURPOSE | - | GENERAL PURPOSE | GENERAL PURPOSE | GENERAL PURPOSE |
JESD-30 代码 | R-PDSO-G8 | R-PDSO-G8 | - | R-PDSO-G8 | S-PDSO-N8 | R-PDSO-G8 |
JESD-609代码 | e4 | e4 | - | e4 | e4 | e4 |
长度 | 3 mm | 4.93 mm | - | 3 mm | 2 mm | 3 mm |
功能数量 | 1 | 1 | - | 1 | 1 | 1 |
端子数量 | 8 | 8 | - | 8 | 8 | 8 |
最高工作温度 | 85 °C | 85 °C | - | 85 °C | 125 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | SOP | - | TSSOP | HVSON | TSSOP |
封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | SQUARE | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | - | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified |
最大接收延迟 | 0.33 ns | 0.33 ns | - | 0.33 ns | 0.33 ns | 0.33 ns |
接收器位数 | 1 | 1 | - | 1 | 1 | 1 |
座面最大高度 | 1.1 mm | 1.73 mm | - | 1.1 mm | 0.9 mm | 1.1 mm |
最大供电电压 | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 | 2.375 V | 2.375 V | - | 2.375 V | 2.375 V | 2.375 V |
标称供电电压 | 2.5 V | 2.5 V | - | 2.5 V | 2.5 V | 2.5 V |
表面贴装 | YES | YES | - | YES | YES | YES |
温度等级 | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL |
端子面层 | NICKEL PALLADIUM GOLD | Nickel/Palladium/Gold (Ni/Pd/Au) | - | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | NICKEL PALLADIUM GOLD |
端子形式 | GULL WING | GULL WING | - | GULL WING | NO LEAD | GULL WING |
端子节距 | 0.65 mm | 1.27 mm | - | 0.65 mm | 0.5 mm | 0.65 mm |
端子位置 | DUAL | DUAL | - | DUAL | DUAL | DUAL |
最大传输延迟 | 0.33 ns | 0.33 ns | - | 0.33 ns | 0.33 ns | 0.33 ns |
宽度 | 3 mm | 3.94 mm | - | 3 mm | 2 mm | 3 mm |
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